ATE364738T1 - Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden - Google Patents

Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden

Info

Publication number
ATE364738T1
ATE364738T1 AT99308131T AT99308131T ATE364738T1 AT E364738 T1 ATE364738 T1 AT E364738T1 AT 99308131 T AT99308131 T AT 99308131T AT 99308131 T AT99308131 T AT 99308131T AT E364738 T1 ATE364738 T1 AT E364738T1
Authority
AT
Austria
Prior art keywords
metals
metal
substrate
group
improving
Prior art date
Application number
AT99308131T
Other languages
English (en)
Inventor
Barry C Muffoletto
Ashish Shah
Original Assignee
Greatbatch W Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Greatbatch W Ltd filed Critical Greatbatch W Ltd
Application granted granted Critical
Publication of ATE364738T1 publication Critical patent/ATE364738T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12507—More than two components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Physical Vapour Deposition (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
AT99308131T 1998-10-16 1999-10-15 Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden ATE364738T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/174,132 US6096391A (en) 1998-10-16 1998-10-16 Method for improving electrical conductivity of metals, metal alloys and metal oxides

Publications (1)

Publication Number Publication Date
ATE364738T1 true ATE364738T1 (de) 2007-07-15

Family

ID=22634961

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99308131T ATE364738T1 (de) 1998-10-16 1999-10-15 Verfahren zur verbesserung der elektrischen leitfähigkeit von metallen, metalllegierungen und metalloxiden

Country Status (5)

Country Link
US (2) US6096391A (de)
EP (1) EP0994202B1 (de)
JP (1) JP2000129426A (de)
AT (1) ATE364738T1 (de)
DE (1) DE69936281T2 (de)

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US6221747B1 (en) * 1999-07-02 2001-04-24 United Integrated Circuits Corp. Method of fabricating a conductive plug with a low junction resistance in an integrated circuit
KR100403957B1 (ko) * 2001-05-03 2003-11-03 주식회사 하이닉스반도체 강유전체 메모리 소자의 제조 방법
KR100422594B1 (ko) * 2001-09-12 2004-03-16 주식회사 하이닉스반도체 반도체 소자의 커패시터 및 제조방법
US7241344B2 (en) * 2004-02-10 2007-07-10 Boston Scientific Scimed, Inc. Apparatus and method for electrostatic spray coating of medical devices
US7410509B2 (en) * 2005-01-19 2008-08-12 Greatbatch Ltd. Sputtered ruthenium oxide coatings in electrolytic capacitor
DE102007043479A1 (de) * 2007-09-12 2009-03-19 Valeo Schalter Und Sensoren Gmbh Verfahren zur Oberflächenbehandlung von Aluminium und ein Schichtaufbau eines Bauteils aus Aluminium mit einer elektrischen Kontaktierung
EP2254656A1 (de) * 2008-02-29 2010-12-01 Fort Wayne Metals Research Products Corporation Verbunddraht mit abwechselnder kernanordnung
US8023250B2 (en) 2008-09-12 2011-09-20 Avx Corporation Substrate for use in wet capacitors
US8279585B2 (en) * 2008-12-09 2012-10-02 Avx Corporation Cathode for use in a wet capacitor
US8405956B2 (en) * 2009-06-01 2013-03-26 Avx Corporation High voltage electrolytic capacitors
US8605411B2 (en) 2010-09-16 2013-12-10 Avx Corporation Abrasive blasted conductive polymer cathode for use in a wet electrolytic capacitor
US8259435B2 (en) 2010-11-01 2012-09-04 Avx Corporation Hermetically sealed wet electrolytic capacitor
US8514547B2 (en) 2010-11-01 2013-08-20 Avx Corporation Volumetrically efficient wet electrolytic capacitor
US9105401B2 (en) 2011-12-02 2015-08-11 Avx Corporation Wet electrolytic capacitor containing a gelled working electrolyte
US9129747B2 (en) 2012-03-16 2015-09-08 Avx Corporation Abrasive blasted cathode of a wet electrolytic capacitor
JP6327531B2 (ja) 2012-11-30 2018-05-23 エレクトリック パワー リサーチ インスチテュート インコーポレイテッド 表面ドーピングによる電気的接触導電率の改善
CN106044963B (zh) * 2016-07-26 2019-01-29 西安建筑科技大学 一种钛基聚苯胺掺杂二氧化铅复合电极材料的制备方法
US12512274B2 (en) 2022-08-26 2025-12-30 KYOCERA AVX Components Corporation Wet electrolytic capacitor containing a gelled working electrolyte

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438153A (en) * 1981-02-24 1984-03-20 Welbilt Electronics Die Corporation Method of and apparatus for the vapor deposition of material upon a substrate
US4596719A (en) * 1981-02-24 1986-06-24 Wedtech Corp. Multilayer coating method and apparatus
US4351855A (en) * 1981-02-24 1982-09-28 Eduard Pinkhasov Noncrucible method of and apparatus for the vapor deposition of material upon a substrate using voltaic arc in vacuum
US4609564C2 (en) * 1981-02-24 2001-10-09 Masco Vt Inc Method of and apparatus for the coating of a substrate with material electrically transformed into a vapor phase
US4569719A (en) * 1981-07-17 1986-02-11 Plasma Physics Corporation Glow discharge method and apparatus and photoreceptor devices made therewith
US4780797A (en) * 1987-12-16 1988-10-25 Tansitor Electronic, Inc. Capacitor tantalum surface for use as a counterelectrode device and method
US5011638A (en) * 1988-06-17 1991-04-30 Vapor Technologies, Inc. Method of making open-pore structures
US4975230A (en) * 1988-06-17 1990-12-04 Vapor Technologies Inc. Method of making an open pore structure
US4978556A (en) * 1988-07-18 1990-12-18 Vapor Technologies Inc. Electrode for vapor deposition and vapor-deposition method using same
US4942844A (en) * 1988-11-25 1990-07-24 Vapor Technologies Inc. High penetration deposition process and apparatus
JPH03147310A (ja) * 1989-11-01 1991-06-24 Nippon Chemicon Corp 電解コンデンサ用アルミニウム電極の製造方法
US5098485A (en) * 1990-09-19 1992-03-24 Evans Findings Company Method of making electrically insulating metallic oxides electrically conductive
US5269898A (en) * 1991-03-20 1993-12-14 Vapor Technologies, Inc. Apparatus and method for coating a substrate using vacuum arc evaporation
JPH05295522A (ja) * 1992-04-17 1993-11-09 Nippon Steel Corp 薄膜形成方法
US5369547A (en) * 1993-03-22 1994-11-29 The Evans Findings Co., Ltd. Capacitor
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US6599580B2 (en) * 1997-05-01 2003-07-29 Wilson Greatbatch Ltd. Method for improving electrical conductivity of a metal oxide layer on a substrate utilizing high energy beam mixing

Also Published As

Publication number Publication date
EP0994202B1 (de) 2007-06-13
US6096391A (en) 2000-08-01
EP0994202A3 (de) 2002-08-21
JP2000129426A (ja) 2000-05-09
DE69936281T2 (de) 2008-04-03
US20050266261A1 (en) 2005-12-01
DE69936281D1 (de) 2007-07-26
EP0994202A2 (de) 2000-04-19

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties