ATE366995T1 - Vorrichtung und verfahren zur bestückungsbehandlung - Google Patents
Vorrichtung und verfahren zur bestückungsbehandlungInfo
- Publication number
- ATE366995T1 ATE366995T1 AT02252010T AT02252010T ATE366995T1 AT E366995 T1 ATE366995 T1 AT E366995T1 AT 02252010 T AT02252010 T AT 02252010T AT 02252010 T AT02252010 T AT 02252010T AT E366995 T1 ATE366995 T1 AT E366995T1
- Authority
- AT
- Austria
- Prior art keywords
- components
- separated
- assembling treatment
- pick
- engage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
Landscapes
- Specific Conveyance Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Processing Of Meat And Fish (AREA)
- Pretreatment Of Seeds And Plants (AREA)
- Intermediate Stations On Conveyors (AREA)
- Manufacturing Of Steel Electrode Plates (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81421701A | 2001-03-22 | 2001-03-22 | |
| US09/920,016 US6655045B2 (en) | 2001-03-22 | 2001-08-02 | Apparatus and method for pick and place handling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE366995T1 true ATE366995T1 (de) | 2007-08-15 |
Family
ID=27123822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02252010T ATE366995T1 (de) | 2001-03-22 | 2002-03-20 | Vorrichtung und verfahren zur bestückungsbehandlung |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1244137B1 (de) |
| CN (2) | CN1198315C (de) |
| AT (1) | ATE366995T1 (de) |
| DE (1) | DE60221060T2 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6991967B2 (en) * | 2004-02-23 | 2006-01-31 | Asm Assembly Automation Ltd. | Apparatus and method for die attachment |
| AT516417B1 (de) | 2014-10-29 | 2018-10-15 | Zkw Group Gmbh | Begrenzung für das Ablegen von elektronischen Bauteilen auf eine Unterlage |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0773765B2 (ja) * | 1990-06-05 | 1995-08-09 | 株式会社アマダ | 多数個取り小製品の仕分け集積装置 |
| US5710065A (en) * | 1995-01-03 | 1998-01-20 | Texas Instruments Incorporated | Method and apparatus for breaking and separating dies from a wafer |
| JP3265252B2 (ja) * | 1998-01-13 | 2002-03-11 | 山形日本電気株式会社 | 半導体収納治具、ハンドリング方法及び生産システム |
| US6165232A (en) * | 1998-03-13 | 2000-12-26 | Towa Corporation | Method and apparatus for securely holding a substrate during dicing |
| US6187654B1 (en) * | 1998-03-13 | 2001-02-13 | Intercon Tools, Inc. | Techniques for maintaining alignment of cut dies during substrate dicing |
| JP2001196328A (ja) * | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Ｃｓｐ基板の分割方法 |
-
2002
- 2002-03-20 AT AT02252010T patent/ATE366995T1/de active
- 2002-03-20 EP EP02252010A patent/EP1244137B1/de not_active Expired - Lifetime
- 2002-03-20 DE DE60221060T patent/DE60221060T2/de not_active Expired - Lifetime
- 2002-03-22 CN CN02107772.XA patent/CN1198315C/zh not_active Expired - Lifetime
- 2002-03-22 CN CNB2004100871899A patent/CN1311521C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1244137A2 (de) | 2002-09-25 |
| CN1198315C (zh) | 2005-04-20 |
| CN1376623A (zh) | 2002-10-30 |
| DE60221060D1 (de) | 2007-08-23 |
| HK1050669A1 (en) | 2003-07-04 |
| EP1244137B1 (de) | 2007-07-11 |
| CN1606126A (zh) | 2005-04-13 |
| CN1311521C (zh) | 2007-04-18 |
| EP1244137A3 (de) | 2005-02-02 |
| DE60221060T2 (de) | 2008-03-20 |
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