ATE455369T1 - Verfahren und vorrichtung zur messtechnikintegration mit einer ätzbehandlung - Google Patents

Verfahren und vorrichtung zur messtechnikintegration mit einer ätzbehandlung

Info

Publication number
ATE455369T1
ATE455369T1 AT07022412T AT07022412T ATE455369T1 AT E455369 T1 ATE455369 T1 AT E455369T1 AT 07022412 T AT07022412 T AT 07022412T AT 07022412 T AT07022412 T AT 07022412T AT E455369 T1 ATE455369 T1 AT E455369T1
Authority
AT
Austria
Prior art keywords
chamber
integration
measurement technology
etch treatment
etch
Prior art date
Application number
AT07022412T
Other languages
English (en)
Inventor
Khiem K Nguyen
Richard Lewington
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE455369T1 publication Critical patent/ATE455369T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AT07022412T 2006-11-21 2007-11-19 Verfahren und vorrichtung zur messtechnikintegration mit einer ätzbehandlung ATE455369T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/561,995 US7601272B2 (en) 2005-01-08 2006-11-21 Method and apparatus for integrating metrology with etch processing

Publications (1)

Publication Number Publication Date
ATE455369T1 true ATE455369T1 (de) 2010-01-15

Family

ID=39402905

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07022412T ATE455369T1 (de) 2006-11-21 2007-11-19 Verfahren und vorrichtung zur messtechnikintegration mit einer ätzbehandlung

Country Status (8)

Country Link
US (1) US7601272B2 (de)
EP (1) EP1939931B1 (de)
JP (1) JP2008147645A (de)
KR (1) KR101188385B1 (de)
CN (2) CN101188192A (de)
AT (1) ATE455369T1 (de)
DE (1) DE602007004290D1 (de)
TW (1) TWI387039B (de)

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KR20210116240A (ko) * 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 조절성 접합부를 갖는 기판 핸들링 장치
US11609183B2 (en) * 2020-08-18 2023-03-21 Applied Materials, Inc. Methods and systems to measure properties of products on a moving blade in electronic device manufacturing machines
CN112133631B (zh) * 2020-09-25 2022-11-18 上海华力微电子有限公司 改善栅极刻蚀形貌稳定性的方法和刻蚀设备
JP7565191B2 (ja) * 2020-11-09 2024-10-10 ニデックインスツルメンツ株式会社 産業用ロボット
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Also Published As

Publication number Publication date
KR20080046107A (ko) 2008-05-26
CN103745912A (zh) 2014-04-23
DE602007004290D1 (de) 2010-03-04
US20070097383A1 (en) 2007-05-03
JP2008147645A (ja) 2008-06-26
TWI387039B (zh) 2013-02-21
EP1939931B1 (de) 2010-01-13
CN103745912B (zh) 2018-09-21
EP1939931A2 (de) 2008-07-02
EP1939931A3 (de) 2008-11-05
US7601272B2 (en) 2009-10-13
TW200832594A (en) 2008-08-01
KR101188385B1 (ko) 2012-10-08
CN101188192A (zh) 2008-05-28

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