ATE367650T1 - Prüfverbinder mit anisotroper leitfähigkeit - Google Patents

Prüfverbinder mit anisotroper leitfähigkeit

Info

Publication number
ATE367650T1
ATE367650T1 AT03784570T AT03784570T ATE367650T1 AT E367650 T1 ATE367650 T1 AT E367650T1 AT 03784570 T AT03784570 T AT 03784570T AT 03784570 T AT03784570 T AT 03784570T AT E367650 T1 ATE367650 T1 AT E367650T1
Authority
AT
Austria
Prior art keywords
connection
conductive
conductive parts
parts
total number
Prior art date
Application number
AT03784570T
Other languages
English (en)
Inventor
Ryoji Setaka
Masaya Naoi
Katsumi Sato
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of ATE367650T1 publication Critical patent/ATE367650T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Non-Insulated Conductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Electron Sources, Ion Sources (AREA)
AT03784570T 2002-08-09 2003-08-07 Prüfverbinder mit anisotroper leitfähigkeit ATE367650T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002232558 2002-08-09

Publications (1)

Publication Number Publication Date
ATE367650T1 true ATE367650T1 (de) 2007-08-15

Family

ID=31711837

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03784570T ATE367650T1 (de) 2002-08-09 2003-08-07 Prüfverbinder mit anisotroper leitfähigkeit

Country Status (8)

Country Link
US (1) US7095241B2 (de)
EP (1) EP1553623B1 (de)
KR (1) KR100715751B1 (de)
CN (1) CN100413045C (de)
AT (1) ATE367650T1 (de)
AU (1) AU2003254855A1 (de)
DE (1) DE60315059T2 (de)
WO (1) WO2004015762A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7311531B2 (en) * 2003-03-26 2007-12-25 Jsr Corporation Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
KR101167750B1 (ko) * 2004-10-29 2012-07-23 제이에스알 가부시끼가이샤 웨이퍼 검사용 탐침 부재, 웨이퍼 검사용 프로브 카드 및웨이퍼 검사 장치
US20070268032A1 (en) * 2004-11-12 2007-11-22 Jsr Corporation Probe Member for Wafer Inspection, Probe Card for Wafer Inspection and Wafer Inspection Apparatus
JP4353171B2 (ja) * 2005-02-02 2009-10-28 セイコーエプソン株式会社 電子機器、光学パネル、検査プローブ、光学パネルの検査装置、光学パネルの検査方法
JP4577109B2 (ja) * 2005-06-20 2010-11-10 パナソニック株式会社 タッチパネル及びその製造方法
DE102006059429A1 (de) * 2006-12-15 2008-06-26 Atg Luther & Maelzer Gmbh Modul für eine Prüfvorrichtung zum Testen von Leiterplatten
US8410808B2 (en) * 2007-03-30 2013-04-02 Jsr Corporation Anisotropic conductive connector, probe member and wafer inspection system
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
KR100787407B1 (ko) * 2007-08-14 2007-12-21 주식회사 파이컴 전기 검사 장치 및 그 제조 방법
WO2011027692A1 (ja) * 2009-09-02 2011-03-10 ポリマテック株式会社 異方導電体及び異方導電体の製造方法並びに異方導電体配列シート
JP6374642B2 (ja) 2012-11-28 2018-08-15 株式会社日本マイクロニクス プローブカード及び検査装置
CN105527472B (zh) * 2014-10-17 2018-10-02 株式会社Isc 测试座
CN106568993B (zh) * 2015-10-09 2019-07-30 苍南县三维电子塑胶有限公司 可编程的显示面板检测用探针结构及检测系统
KR101785428B1 (ko) * 2016-04-21 2017-10-16 (주) 마이크로프랜드 반도체소자 테스트소켓
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
US10684930B2 (en) 2017-11-30 2020-06-16 International Business Machines Corporation Functional testing of high-speed serial links
CN108461387B (zh) * 2018-03-19 2020-06-19 北京北方华创微电子装备有限公司 功率馈入机构、旋转基座装置及半导体加工设备
US12021322B2 (en) * 2018-10-11 2024-06-25 Sekisui Polymatech Co., Ltd. Electrical connection sheet and terminal-equipped glass plate structure
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
CN112924844A (zh) * 2019-12-06 2021-06-08 迪科特测试科技(苏州)有限公司 探测装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2794296B2 (ja) * 1988-08-10 1998-09-03 エヌオーケー株式会社 成形品
JP2737647B2 (ja) * 1994-03-10 1998-04-08 カシオ計算機株式会社 異方導電性接着剤およびそれを用いた導電接続構造
JPH1140224A (ja) * 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
JP4240724B2 (ja) * 2000-01-26 2009-03-18 Ｊｓｒ株式会社 異方導電性シートおよびコネクター
DE10011806A1 (de) * 2000-03-10 2001-09-13 Fr Luerssen Werft Gmbh & Co Abgasanlage für Wasserfahrzeuge
JP3541777B2 (ja) * 2000-03-15 2004-07-14 ソニーケミカル株式会社 異方性導電接続材料
TW536628B (en) * 2000-08-09 2003-06-11 Jsr Corp Anisotropic conductive sheet
US6720787B2 (en) * 2000-09-25 2004-04-13 Jsr Corporation Anisotropically conductive sheet, production process thereof and applied product thereof
JP4734706B2 (ja) * 2000-11-01 2011-07-27 Ｊｓｒ株式会社 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法
AU2002221060A1 (en) * 2000-12-08 2002-06-18 Jsr Corporation Anisotropic conductive sheet and wafer inspection device
JP3543765B2 (ja) * 2000-12-28 2004-07-21 Ｊｓｒ株式会社 ウエハ検査用プローブ装置
KR100577947B1 (ko) * 2001-02-09 2006-05-10 제이에스알 가부시끼가이샤 이방 도전성 커넥터 및 그 제조 방법 및 프로우브 부재

Also Published As

Publication number Publication date
KR20050027252A (ko) 2005-03-18
EP1553623B1 (de) 2007-07-18
US20060043983A1 (en) 2006-03-02
US7095241B2 (en) 2006-08-22
AU2003254855A1 (en) 2004-02-25
EP1553623A1 (de) 2005-07-13
KR100715751B1 (ko) 2007-05-08
WO2004015762A1 (ja) 2004-02-19
EP1553623A4 (de) 2006-05-24
CN100413045C (zh) 2008-08-20
CN1675755A (zh) 2005-09-28
DE60315059T2 (de) 2008-04-17
DE60315059D1 (de) 2007-08-30

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Legal Events

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