ATE519826T1 - Elektronische vorrichtung enthaltend ein thermisches zwischenlagematerial - Google Patents

Elektronische vorrichtung enthaltend ein thermisches zwischenlagematerial

Info

Publication number
ATE519826T1
ATE519826T1 AT04716410T AT04716410T ATE519826T1 AT E519826 T1 ATE519826 T1 AT E519826T1 AT 04716410 T AT04716410 T AT 04716410T AT 04716410 T AT04716410 T AT 04716410T AT E519826 T1 ATE519826 T1 AT E519826T1
Authority
AT
Austria
Prior art keywords
fluoroelastomer
electronic device
component
device containing
mooney viscosity
Prior art date
Application number
AT04716410T
Other languages
English (en)
Inventor
Chih-Min Cheng
Andrew Collins
Original Assignee
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co Kgaa filed Critical Henkel Ag & Co Kgaa
Application granted granted Critical
Publication of ATE519826T1 publication Critical patent/ATE519826T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Liquid Developers In Electrophotography (AREA)
AT04716410T 2003-03-12 2004-03-02 Elektronische vorrichtung enthaltend ein thermisches zwischenlagematerial ATE519826T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/388,031 US6776226B1 (en) 2003-03-12 2003-03-12 Electronic device containing thermal interface material
PCT/US2004/006166 WO2004081139A1 (en) 2003-03-12 2004-03-02 Electronic device containing thermal interface material

Publications (1)

Publication Number Publication Date
ATE519826T1 true ATE519826T1 (de) 2011-08-15

Family

ID=32850512

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04716410T ATE519826T1 (de) 2003-03-12 2004-03-02 Elektronische vorrichtung enthaltend ein thermisches zwischenlagematerial

Country Status (5)

Country Link
US (1) US6776226B1 (de)
EP (1) EP1601739B1 (de)
AT (1) ATE519826T1 (de)
PT (1) PT1601739E (de)
WO (1) WO2004081139A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381121B1 (en) * 1999-05-24 2002-04-30 Showa Denko Kabushiki Kaisha Solid electrolytic capacitor
US20040180209A1 (en) * 2003-03-12 2004-09-16 Chih-Min Cheng Thermal interface material
TW200634140A (en) * 2005-03-21 2006-10-01 Mitac Technology Corp Heat conduction interface structure and manufacturing process method thereof
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140080951A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
JP5563175B1 (ja) * 2014-03-05 2014-07-30 清二 加川 高熱伝導率の放熱シート及びその製造方法
TWI561623B (en) * 2015-09-07 2016-12-11 Polytronics Technology Corp Thermal interface material
CN111295431B (zh) * 2017-11-02 2022-01-11 大金工业株式会社 散热材料用含氟弹性体组合物和片

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051100A (en) * 1973-06-04 1977-09-27 Caterpillar Tractor Co. Fluoroelastomer-based composite material
US4576845A (en) 1983-12-15 1986-03-18 Krc Inc. Thermally conductive base layers for cast polyurethane roll covers
US5275887A (en) * 1986-04-22 1994-01-04 Raychem Corporation Fluoropolymer compositions
CA1331245C (en) * 1987-12-21 1994-08-02 Carol Ann Latham Thermally conductive ceramic/polymer composites
JP2886337B2 (ja) * 1988-12-21 1999-04-26 レイケム・コーポレイション 熱可塑性フルオロポリマー接着剤組成物
US5010038A (en) * 1989-06-29 1991-04-23 Digital Equipment Corp. Method of cooling and powering an integrated circuit chip using a compliant interposing pad
US5545473A (en) 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5591034A (en) 1994-02-14 1997-01-07 W. L. Gore & Associates, Inc. Thermally conductive adhesive interface
US5480930A (en) * 1994-08-18 1996-01-02 Dow Corning Corporation Fluorocarbon rubbers modified by silicone resins
US5904978A (en) 1995-12-15 1999-05-18 W. L. Gore & Associates, Inc. Electrically conductive polytetrafluoroethylene article
US5741855A (en) * 1996-06-10 1998-04-21 Raychem Corporation Compatibilized fluoroplastic blends
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
US6210789B1 (en) 1997-02-20 2001-04-03 W. L. Gore & Associates, Inc. Electrically conductive composite article
JPH10242354A (ja) 1997-02-24 1998-09-11 Matsushita Electric Ind Co Ltd 熱伝導部材およびそれを用いた電子装置
US5945217A (en) 1997-10-14 1999-08-31 Gore Enterprise Holdings, Inc. Thermally conductive polytrafluoroethylene article
US6090491A (en) 1998-02-27 2000-07-18 Eastman Kodak Company Fuser member with styrl-treated Al2 O3 filler and functionalized release fluids
US6255581B1 (en) 1998-03-31 2001-07-03 Gore Enterprise Holdings, Inc. Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace
US6203873B1 (en) 1998-05-22 2001-03-20 Dayco Products, Inc. Blends of fluoroelastomer interpolymers with thermo fluoroplastic interpolymers and the use of such blends in hoses
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6410630B1 (en) * 1999-12-29 2002-06-25 Pelseal Technologies, Llc High solids fluoroelastomer compositions
JP4759122B2 (ja) * 2000-09-12 2011-08-31 ポリマテック株式会社 熱伝導性シート及び熱伝導性グリス

Also Published As

Publication number Publication date
US6776226B1 (en) 2004-08-17
EP1601739A1 (de) 2005-12-07
PT1601739E (pt) 2011-10-19
EP1601739B1 (de) 2011-08-10
WO2004081139A1 (en) 2004-09-23

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