ATE36919T1 - Schweissbare leitfaehige zusammensetzungen, ihre anwendung als beschichtungen auf substraten und geeignete zusammensetzungen zu ihrer bildung. - Google Patents

Schweissbare leitfaehige zusammensetzungen, ihre anwendung als beschichtungen auf substraten und geeignete zusammensetzungen zu ihrer bildung.

Info

Publication number
ATE36919T1
ATE36919T1 AT85305082T AT85305082T ATE36919T1 AT E36919 T1 ATE36919 T1 AT E36919T1 AT 85305082 T AT85305082 T AT 85305082T AT 85305082 T AT85305082 T AT 85305082T AT E36919 T1 ATE36919 T1 AT E36919T1
Authority
AT
Austria
Prior art keywords
compositions
substrates
conductive compositions
resin
coatings
Prior art date
Application number
AT85305082T
Other languages
English (en)
Inventor
John Frank St
Sanson Shahbazi
Original Assignee
Electro Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Materials filed Critical Electro Materials
Application granted granted Critical
Publication of ATE36919T1 publication Critical patent/ATE36919T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
AT85305082T 1984-07-18 1985-07-17 Schweissbare leitfaehige zusammensetzungen, ihre anwendung als beschichtungen auf substraten und geeignete zusammensetzungen zu ihrer bildung. ATE36919T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/631,974 US4595606A (en) 1984-07-18 1984-07-18 Solderable conductive compositions having high adhesive strength
EP85305082A EP0169060B1 (de) 1984-07-18 1985-07-17 Schweissbare leitfähige Zusammensetzungen, ihre Anwendung als Beschichtungen auf Substraten und geeignete Zusammensetzungen zu ihrer Bildung

Publications (1)

Publication Number Publication Date
ATE36919T1 true ATE36919T1 (de) 1988-09-15

Family

ID=24533555

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85305082T ATE36919T1 (de) 1984-07-18 1985-07-17 Schweissbare leitfaehige zusammensetzungen, ihre anwendung als beschichtungen auf substraten und geeignete zusammensetzungen zu ihrer bildung.

Country Status (9)

Country Link
US (1) US4595606A (de)
EP (1) EP0169060B1 (de)
JP (1) JPS6140316A (de)
KR (1) KR860000921A (de)
AT (1) ATE36919T1 (de)
CA (1) CA1246767A (de)
DE (1) DE3564743D1 (de)
PH (1) PH21722A (de)
SG (1) SG86788G (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680141A (en) * 1984-11-29 1987-07-14 Mcdonnell Douglas Corporation Solder composition
US4673532A (en) * 1986-01-22 1987-06-16 Mcdonnell Douglas Corporation Rosin-free solder composition
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
DE3724013A1 (de) * 1987-07-21 1989-02-02 Flachglas Ag Verfahren zum aufbringen einer farbigen beschichtung auf eine oberflaeche einer glasscheibe
US5147453A (en) * 1987-11-03 1992-09-15 Basf Corporation Paint compositions containing silver metal flake pigment
US4896250A (en) * 1988-02-12 1990-01-23 Emerson & Cuming, Inc. Solvent-processible electrically conductive coatings
US5006575A (en) * 1989-10-20 1991-04-09 E. I. Du Pont De Nemours And Company Die attach adhesive composition
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5089173A (en) * 1990-05-02 1992-02-18 Advanced Products Inc. Highly conductive polymer thick film compositions
US5112687A (en) * 1990-05-02 1992-05-12 Advanced Products Inc. Highly conductive polymer thick film compositions
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
US5141777A (en) * 1990-05-02 1992-08-25 Advanced Products, Inc. Highly conductive polymer thick film compositions
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
JPH04345664A (ja) * 1991-05-01 1992-12-01 Du Pont Japan Ltd 導電性樹脂組成物
DE69221480T2 (de) * 1991-05-01 1998-01-22 Du Pont Elektrisch leitende Polymermischungen
US5283007A (en) * 1992-04-28 1994-02-01 E. I. Du Pont De Nemours And Company Conductive polymer compositions
JPH0521208A (ja) * 1991-05-07 1993-01-29 Daito Tsushinki Kk Ｐｔｃ素子
JPH0826251B2 (ja) * 1991-06-05 1996-03-13 福田金属箔粉工業株式会社 焼付型導電塗料用銀粉及びそれを用いた焼付型導電塗料
JP2730357B2 (ja) * 1991-11-18 1998-03-25 松下電器産業株式会社 電子部品実装接続体およびその製造方法
US5447267A (en) * 1993-02-08 1995-09-05 Matsushita Electric Industrial Co., Ltd. Method of soldering electronic part using a bond for tacking the electronic part
US5780143A (en) * 1995-03-01 1998-07-14 Tokuyama Corporation Circuit board
JPH09116273A (ja) * 1995-08-11 1997-05-02 Shinko Electric Ind Co Ltd 多層回路基板及びその製造方法
JPH0959553A (ja) * 1995-08-30 1997-03-04 Dainippon Printing Co Ltd 透明導電性インキ
AU5561696A (en) * 1996-04-18 1997-11-07 International Business Machines Corporation Organic-metallic composite coating for copper surface protection
KR100629923B1 (ko) * 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
US6750301B1 (en) * 2000-07-07 2004-06-15 National Starch And Chemical Investment Holding Corporation Die attach adhesives with epoxy compound or resin having allyl or vinyl groups
JP2005234464A (ja) * 2004-02-23 2005-09-02 Tdk Corp 光トランシーバ及びこれに用いる光モジュール
KR20120056885A (ko) * 2009-09-24 2012-06-04 이 아이 듀폰 디 네모아 앤드 캄파니 도금 링크로서 사용하기 위한 중합체 후막 은 전극 조성물
US20120119163A1 (en) * 2010-11-17 2012-05-17 E. I. Du Pont De Nemours And Company Solderable polymer thick film silver electrode composition for use in thin-film photovoltaic cells and other applications
US8704087B2 (en) 2011-06-01 2014-04-22 E I Du Pont De Nemours And Company Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications
JP6233792B2 (ja) * 2013-01-28 2017-11-22 国立大学法人群馬大学 導電性ペースト
EP2918371A1 (de) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Lötbare leitfähige Polymer-Dickschichtzusammensetzung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
GB1251834A (de) * 1968-04-02 1971-11-03
JPS57185316A (en) * 1981-05-11 1982-11-15 Sumitomo Metal Mining Co Ltd Electrically conductive resin paste
US4371459A (en) * 1981-12-17 1983-02-01 E. I. Du Pont De Nemours And Company Flexible screen-printable conductor composition
US4564563A (en) * 1983-09-30 1986-01-14 Electro Materials Corp. Of America Solderable conductor
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor

Also Published As

Publication number Publication date
DE3564743D1 (en) 1988-10-06
PH21722A (en) 1988-02-03
SG86788G (en) 1989-06-16
EP0169060A2 (de) 1986-01-22
EP0169060A3 (en) 1986-08-27
CA1246767A (en) 1988-12-13
EP0169060B1 (de) 1988-08-31
JPS6140316A (ja) 1986-02-26
KR860000921A (ko) 1986-02-20
US4595606A (en) 1986-06-17

Similar Documents

Publication Publication Date Title
ATE36919T1 (de) Schweissbare leitfaehige zusammensetzungen, ihre anwendung als beschichtungen auf substraten und geeignete zusammensetzungen zu ihrer bildung.
ATE36918T1 (de) Biegsame, direkt schweissbare, leitfaehige zusammensetzungen, geeignete zusammensetzungen zu ihrer bildung und ihre anwendung als beschichtungen auf substraten.
NL185088C (nl) Kleefmiddelsamenstelling en samengestelde struktuur van substraten en kleefmiddel.
TR200000160T2 (tr) Kaba yapılar için ısıyla sertleşen yıkamaya dayanıklı sızdırmazlık bileşiği.
AU566131B2 (en) Polyurethane coating or adhesive composition
AU7125981A (en) Fluorinated acrylate coating composition
AU575017B2 (en) Modified epoxy resins and coating compositions containing them
AU558269B2 (en) Acrylic functional urethane alkyd resin coating compositions
AU564748B2 (en) Phosphated epoxy and acrylic resin coating composition
AU4532585A (en) Epoxy resin composition
DE3564952D1 (en) Novel (meth)acrylate and resin composition comprising the same
AU567882B2 (en) Advanced epoxy resins and coating compositions containing the advanced epoxy resins.
DE3062969D1 (en) Precondensed heat-curable aqueous varnish-coating composition and application thereof to the cathodic electrodeposition on electro-conductive substrates
DE3583358D1 (de) Durch strahlung vernetzbare klebemittelzusammensetzung fuer oberflaechenschutzfilme.
EP0188901A3 (en) Adhesive resin composition
AU560539B2 (en) Coating conductive substrate with cationic binder composition
ES8502716A1 (es) Procedimiento para mejorar la adherencia en los recubrimientos para el revestimiento de las superficies de metales.
EP0167308A3 (de) Flüssige copolymere Organosiloxane
ATE46196T1 (de) Korrosionsbestaendige tantalpentaoxidueberzuege.
DE3480405D1 (en) Thermosetting coating composition useful as chip resistant primer
JPS55147578A (en) Adhesive composition
AU2637184A (en) Epoxy resin adhesive composition
JPS53101026A (en) Resin composition for surface finishing of construction
JPS5747746A (en) Foamed glass plate
JPS5757768A (en) Primer composition

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee