ATE370262T1 - Vorrichtung zur durchführung mindestens einer behandlung eines substrates - Google Patents

Vorrichtung zur durchführung mindestens einer behandlung eines substrates

Info

Publication number
ATE370262T1
ATE370262T1 AT01952049T AT01952049T ATE370262T1 AT E370262 T1 ATE370262 T1 AT E370262T1 AT 01952049 T AT01952049 T AT 01952049T AT 01952049 T AT01952049 T AT 01952049T AT E370262 T1 ATE370262 T1 AT E370262T1
Authority
AT
Austria
Prior art keywords
sealing means
inner sealing
closing
lock
maintained
Prior art date
Application number
AT01952049T
Other languages
English (en)
Inventor
Ronaldus Kok
Michael Hompus
Marinus Evers
Anton Habraken
Franciscus Dings
Original Assignee
Otb Group Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Group Bv filed Critical Otb Group Bv
Application granted granted Critical
Publication of ATE370262T1 publication Critical patent/ATE370262T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H01F7/04—Means for releasing the attractive force

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electron Tubes For Measurement (AREA)
  • Details Of Valves (AREA)
  • Element Separation (AREA)
  • Magnetically Actuated Valves (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
AT01952049T 2000-07-12 2001-06-26 Vorrichtung zur durchführung mindestens einer behandlung eines substrates ATE370262T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1015690A NL1015690C2 (nl) 2000-07-12 2000-07-12 Sluis voor vacu³mkamer.

Publications (1)

Publication Number Publication Date
ATE370262T1 true ATE370262T1 (de) 2007-09-15

Family

ID=19771725

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01952049T ATE370262T1 (de) 2000-07-12 2001-06-26 Vorrichtung zur durchführung mindestens einer behandlung eines substrates

Country Status (11)

Country Link
US (2) US7198678B2 (de)
EP (2) EP1299571B1 (de)
JP (2) JP2004502869A (de)
CN (1) CN1291061C (de)
AT (1) ATE370262T1 (de)
AU (1) AU2001272844A1 (de)
DE (2) DE60129975T2 (de)
ES (1) ES2291331T3 (de)
HK (1) HK1043161B (de)
NL (1) NL1015690C2 (de)
WO (1) WO2002004697A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004027752A1 (de) 2004-06-08 2006-01-05 Leybold Optics Gmbh Schleusenvorrichtung
US7611322B2 (en) 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
EA008187B1 (ru) * 2005-06-07 2007-04-27 Владимир Яковлевич ШИРИПОВ Способ очистки теневых масок в производстве дисплеев (варианты) и устройство для его реализации
EP1862624B1 (de) * 2006-06-01 2017-02-15 Pilz Auslandsbeteiligungen GmbH Zuhalteeinrichtung für eine Zugangsschutzvorrichtung
JP6282917B2 (ja) 2014-04-11 2018-02-21 株式会社Ihi 真空処理装置
DE102016107990A1 (de) * 2016-04-29 2017-11-02 Von Ardenne Gmbh Vakuumprozesskammer
CN117026189B (zh) * 2023-08-15 2026-03-03 北京维开科技有限公司 一种孪生工艺腔室的磁控溅射系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207313A (en) * 1981-06-16 1982-12-20 Toshiba Corp Method of demagnetizing induction electric equipment
US4676884A (en) * 1986-07-23 1987-06-30 The Boc Group, Inc. Wafer processing machine with evacuated wafer transporting and storage system
US4842683A (en) * 1986-12-19 1989-06-27 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
EP0448782B1 (de) 1990-03-26 1993-06-16 Leybold Aktiengesellschaft Vorrichtung zum Ein- und Ausschleusen eines Werkstücks in eine Vakuumkammer
US5451131A (en) * 1992-06-19 1995-09-19 International Business Machines Corporation Dockable interface airlock between process enclosure and interprocess transfer container
JP3873100B2 (ja) * 1994-04-25 2007-01-24 芝浦メカトロニクス株式会社 真空装置でのディスクの保持方法及び保持装置
JPH07292740A (ja) 1994-04-25 1995-11-07 Tokai Rika Co Ltd 弁駆動装置及び衛生器具の自動洗浄装置
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
DE19605598C1 (de) * 1996-02-15 1996-10-31 Singulus Technologies Gmbh Vorrichtung zum Greifen und Halten von Substraten
JP3076775B2 (ja) * 1997-07-31 2000-08-14 芝浦メカトロニクス株式会社 真空処理装置
DE19742923A1 (de) * 1997-09-29 1999-04-01 Leybold Systems Gmbh Vorrichtung zum Beschichten eines im wesentlichen flachen, scheibenförmigen Substrats
DE19814834A1 (de) * 1998-04-02 1999-10-07 Leybold Systems Gmbh Vorrichtung zum Greifen und Halten eines flachen Substrats

Also Published As

Publication number Publication date
EP1299571A1 (de) 2003-04-09
HK1043161A1 (en) 2002-09-06
ES2291331T3 (es) 2008-03-01
CN1455827A (zh) 2003-11-12
US7198678B2 (en) 2007-04-03
US6615547B2 (en) 2003-09-09
CN1291061C (zh) 2006-12-20
WO2002004697A1 (en) 2002-01-17
JP2002139166A (ja) 2002-05-17
JP2004502869A (ja) 2004-01-29
AU2001272844A1 (en) 2002-01-21
EP1172456A1 (de) 2002-01-16
HK1043161B (en) 2011-02-18
DE60129975T2 (de) 2008-05-15
US20040083968A1 (en) 2004-05-06
JP3757239B2 (ja) 2006-03-22
EP1299571B1 (de) 2007-08-15
DE60129975D1 (de) 2007-09-27
EP1172456B1 (de) 2010-05-05
DE60142012D1 (de) 2010-06-17
US20020021542A1 (en) 2002-02-21
NL1015690C2 (nl) 2002-01-15

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties