ATE381249T1 - Träger für integrierte schaltungen mit aussparungen - Google Patents

Träger für integrierte schaltungen mit aussparungen

Info

Publication number
ATE381249T1
ATE381249T1 AT01977988T AT01977988T ATE381249T1 AT E381249 T1 ATE381249 T1 AT E381249T1 AT 01977988 T AT01977988 T AT 01977988T AT 01977988 T AT01977988 T AT 01977988T AT E381249 T1 ATE381249 T1 AT E381249T1
Authority
AT
Austria
Prior art keywords
receiving zone
carrier
cutouts
integrated circuit
integrated circuits
Prior art date
Application number
AT01977988T
Other languages
English (en)
Inventor
Kia Silverbrook
Original Assignee
Silverbrook Res Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Res Pty Ltd filed Critical Silverbrook Res Pty Ltd
Application granted granted Critical
Publication of ATE381249T1 publication Critical patent/ATE381249T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT01977988T 2000-10-20 2001-10-19 Träger für integrierte schaltungen mit aussparungen ATE381249T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/693,707 US7221043B1 (en) 2000-10-20 2000-10-20 Integrated circuit carrier with recesses

Publications (1)

Publication Number Publication Date
ATE381249T1 true ATE381249T1 (de) 2007-12-15

Family

ID=24785760

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01977988T ATE381249T1 (de) 2000-10-20 2001-10-19 Träger für integrierte schaltungen mit aussparungen

Country Status (12)

Country Link
US (4) US7221043B1 (de)
EP (1) EP1410700B1 (de)
JP (1) JP3761520B2 (de)
KR (1) KR100526330B1 (de)
CN (1) CN1235453C (de)
AT (1) ATE381249T1 (de)
AU (2) AU1025202A (de)
DE (1) DE60131906D1 (de)
IL (2) IL155466A0 (de)
SG (1) SG126771A1 (de)
WO (1) WO2002035896A1 (de)
ZA (1) ZA200303169B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7221043B1 (en) * 2000-10-20 2007-05-22 Silverbrook Research Pty Ltd Integrated circuit carrier with recesses
CN100401763C (zh) * 2003-05-16 2008-07-09 索尼株式会社 运动补偿设备和方法
TW201241941A (en) * 2010-10-21 2012-10-16 Sumitomo Bakelite Co A method for manufacturing an electronic equipment, and the electronic equipment obtained by using the method, as well as a method for manufacturing electronics and electronic parts, and the electronics and the electronic parts obtained using the method
US9513666B2 (en) * 2014-07-25 2016-12-06 VivaLnk, Inc. Highly compliant wearable wireless patch having stress-relief capability
CN105338727B (zh) * 2015-10-22 2018-05-25 北大方正集团有限公司 阶梯电路板的阶梯槽的制备方法以及阶梯电路板
CN105392306A (zh) * 2015-11-27 2016-03-09 北大方正集团有限公司 一种高频盲槽电路板及其加工方法
US10064275B1 (en) 2017-07-18 2018-08-28 Mellanox Technologies, Ltd. Extending the lifetime of a leadless SMT solder joint using pads comprising spring-shaped traces

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
JPH06503207A (ja) 1990-09-27 1994-04-07 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー 熱的歪み緩和複合超小形電子デバイス
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
JP3294740B2 (ja) 1995-07-31 2002-06-24 富士通株式会社 半導体装置
DE19540814A1 (de) 1995-11-02 1997-05-07 Vdo Schindling Platine
FR2745930B1 (fr) 1996-03-11 1998-04-10 Solaic Sa Carte a circuit integre comportant une zone desolidarisee par une rainure
US6064576A (en) 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
US6121678A (en) * 1997-12-19 2000-09-19 Stmicroelectronics, Inc. Wrap-around interconnect for fine pitch ball grid array
JP2997746B2 (ja) 1998-05-27 2000-01-11 亜南半導体株式会社 印刷回路基板
JP3020201B2 (ja) 1998-05-27 2000-03-15 亜南半導体株式会社 ボールグリッドアレイ半導体パッケージのモールディング方法
JP2000012732A (ja) 1998-06-24 2000-01-14 Rohm Co Ltd Ｂｇａ型半導体装置の構造
US6050832A (en) 1998-08-07 2000-04-18 Fujitsu Limited Chip and board stress relief interposer
TW399309B (en) * 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
US6341071B1 (en) 1999-03-19 2002-01-22 International Business Machines Corporation Stress relieved ball grid array package
JP2000312075A (ja) 1999-04-27 2000-11-07 Nec Corp プリント配線板への接続方法および構造
US6078505A (en) 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
JP2001036222A (ja) 1999-07-21 2001-02-09 Fuji Photo Film Co Ltd プリント回路基板
US6524115B1 (en) * 1999-08-20 2003-02-25 3M Innovative Properties Company Compliant interconnect assembly
JP2001094228A (ja) 1999-09-22 2001-04-06 Seiko Epson Corp 半導体装置の実装構造
US7221043B1 (en) * 2000-10-20 2007-05-22 Silverbrook Research Pty Ltd Integrated circuit carrier with recesses
US6775906B1 (en) * 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
US6710457B1 (en) * 2000-10-20 2004-03-23 Silverbrook Research Pty Ltd Integrated circuit carrier
US7443010B2 (en) * 2001-04-05 2008-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Matrix form semiconductor package substrate having an electrode of serpentine shape
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US6890185B1 (en) * 2003-11-03 2005-05-10 Kulicke & Soffa Interconnect, Inc. Multipath interconnect with meandering contact cantilevers

Also Published As

Publication number Publication date
IL155466A (en) 2010-05-31
KR20030082931A (ko) 2003-10-23
WO2002035896A1 (en) 2002-05-02
DE60131906D1 (de) 2008-01-24
JP3761520B2 (ja) 2006-03-29
US7974102B2 (en) 2011-07-05
AU2002210252B2 (en) 2004-12-09
AU1025202A (en) 2002-05-06
JP2004511922A (ja) 2004-04-15
EP1410700A4 (de) 2006-05-03
IL155466A0 (en) 2003-11-23
US20110226520A1 (en) 2011-09-22
US20070284725A1 (en) 2007-12-13
EP1410700A1 (de) 2004-04-21
US7221043B1 (en) 2007-05-22
US20080247144A1 (en) 2008-10-09
SG126771A1 (en) 2006-11-29
ZA200303169B (en) 2003-11-05
US7402896B2 (en) 2008-07-22
KR100526330B1 (ko) 2005-11-08
CN1235453C (zh) 2006-01-04
EP1410700B1 (de) 2007-12-12
CN1471804A (zh) 2004-01-28

Similar Documents

Publication Publication Date Title
AU2002211084A1 (en) Methods of manufacturing a printed circuit board shielded against interfering radiation
DE50211496D1 (de) Leistungshalbleitermodul in Druckkontaktierung
ES251739U (es) Ÿun elemento de contacto electricoŸ
ATE356532T1 (de) Leuchtdioden-leuchtpaneel und leiterplatte
DE59811322D1 (de) Elektrisches oder elektronisches gerät
KR20000012090A (en) Assembly having module type jack and radiation diode
DK1393605T3 (da) Printplade med mindst én elektronisk komponent
DE60219161D1 (de) Integration optoelektronischer bauelemente
SE9802157L (sv) Elektrisk komponent
ATE381249T1 (de) Träger für integrierte schaltungen mit aussparungen
ATE375702T1 (de) Träger für integrierte schaltungen
TW200501838A (en) Hybrid integrated circuit device
WO2002015651A3 (en) Low inductance transistor module with distributed bus
DE502004010730D1 (de) Elektronische Baugruppe
WO2002067322A3 (en) Semiconductor device having signal contacts and high current power contacts
TW200723972A (en) Circuit board module and forming method thereof
GB2324753B (en) Printed circuit and printed wiring boards and methods of manufacture
WO2000004585A3 (de) Chipträgeranordnung sowie verfahren zur herstellung einer chipträgeranordnung mit elektrischem test
EP1168897A3 (de) Folienleiterplatte sowie deren Herstellungs- und Montageverfahren
TW200638822A (en) Printed circuit board arrangement
NO20071957L (no) Elektrisk kretspakke med keramisk substrat, ledende grunnplate og lederlegeme
WO2003005091A3 (en) Packaged optoelectronic device
PT1305766E (pt) Dispositivo com um cartao inteligente
EP0804062A3 (de) Elektronische Einrichtung
KR910013007A (ko) Ic 카드

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties