ATE383673T1 - Quarzoszillator - Google Patents

Quarzoszillator

Info

Publication number
ATE383673T1
ATE383673T1 AT05270026T AT05270026T ATE383673T1 AT E383673 T1 ATE383673 T1 AT E383673T1 AT 05270026 T AT05270026 T AT 05270026T AT 05270026 T AT05270026 T AT 05270026T AT E383673 T1 ATE383673 T1 AT E383673T1
Authority
AT
Austria
Prior art keywords
heating device
substrate
quartz oscillator
crystal
area enclosed
Prior art date
Application number
AT05270026T
Other languages
English (en)
Inventor
Takeo Oita
Minoru Fukuda
Original Assignee
Nihon Dempa Kogyo Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co filed Critical Nihon Dempa Kogyo Co
Application granted granted Critical
Publication of ATE383673T1 publication Critical patent/ATE383673T1/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0528—Holders or supports for bulk acoustic wave devices consisting of clips
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT05270026T 2004-06-29 2005-06-29 Quarzoszillator ATE383673T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191826A JP4354347B2 (ja) 2004-06-29 2004-06-29 水晶発振器

Publications (1)

Publication Number Publication Date
ATE383673T1 true ATE383673T1 (de) 2008-01-15

Family

ID=34941864

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05270026T ATE383673T1 (de) 2004-06-29 2005-06-29 Quarzoszillator

Country Status (6)

Country Link
US (1) US7088032B2 (de)
EP (1) EP1612930B8 (de)
JP (1) JP4354347B2 (de)
CN (1) CN100485991C (de)
AT (1) ATE383673T1 (de)
DE (1) DE602005004205T2 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060022556A1 (en) * 2004-07-29 2006-02-02 Bail David L Quartz resonator package having a housing with thermally coupled internal heating element
JP4591364B2 (ja) * 2006-01-27 2010-12-01 エプソントヨコム株式会社 水晶振動子、高精度水晶発振器
TW200744314A (en) * 2006-05-18 2007-12-01 Taitien Electronics Co Ltd Oscillator device capable of keeping constant temperature
JP2010502017A (ja) * 2006-08-22 2010-01-21 ブリリアント テレコミュニケーションズ， インコーポレイテッド 密閉筐体内ｐｃｂ実装電子部品の熱安定化用機器および方法
US20080102761A1 (en) * 2006-10-27 2008-05-01 Stratex Networks, Inc. System and method for compensation of phase hits
US7683727B2 (en) * 2007-03-15 2010-03-23 Honeywell International Inc. Acceleration feedback control for crystal oscillators
EP1990911A1 (de) 2007-05-09 2008-11-12 Taitien Electronics Co., Ltd. Quarzoszillatorvorrichtung mit Fähigkeit zum Beibehalten von konstanten Temperaturbedingungen
US10266392B2 (en) 2007-06-07 2019-04-23 E-Pack, Inc. Environment-resistant module, micropackage and methods of manufacturing same
US8049326B2 (en) 2007-06-07 2011-11-01 The Regents Of The University Of Michigan Environment-resistant module, micropackage and methods of manufacturing same
US7782147B2 (en) * 2007-06-20 2010-08-24 Motorola, Inc. Apparatus for providing oscillator frequency stability
GB2455918B (en) 2007-06-27 2010-07-07 Fluke Corp Method of providing a thermally stabilized fixed frequency piezoelectric optical modulator
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
JP4803758B2 (ja) * 2008-11-21 2011-10-26 日本電波工業株式会社 発振装置
JP4955042B2 (ja) * 2009-05-18 2012-06-20 日本電波工業株式会社 恒温型の水晶発振器
JP5468327B2 (ja) * 2009-07-30 2014-04-09 京セラクリスタルデバイス株式会社 圧電デバイス
TWI454053B (zh) 2010-10-08 2014-09-21 Nihon Dempa Kogyo Co 附恆溫槽水晶振盪器
US9917028B2 (en) * 2011-09-09 2018-03-13 Assa Abloy Ab Method and apparatus for maintaining operational temperature of an integrated circuit
US20130321088A1 (en) * 2012-06-01 2013-12-05 Pierino Vidoni Surface mount ovenized oscillator assembly
US9576868B2 (en) * 2012-07-30 2017-02-21 General Electric Company Semiconductor device and method for reduced bias temperature instability (BTI) in silicon carbide devices
JP6013069B2 (ja) * 2012-07-31 2016-10-25 京セラクリスタルデバイス株式会社 圧電デバイス
JP5429653B2 (ja) * 2012-09-06 2014-02-26 セイコーエプソン株式会社 発振器、及び発振器の製造方法
CN102902288B (zh) * 2012-09-26 2015-12-02 广东大普通信技术有限公司 一种恒温控制晶体振荡器及其恒温槽温度控制方法
JP6083214B2 (ja) * 2012-11-30 2017-02-22 セイコーエプソン株式会社 発振器、電子機器、及び移動体
US9287882B2 (en) * 2013-11-07 2016-03-15 Kyocera Crystal Device Corporation Temperature compensated crystal oscillator
JP2015119378A (ja) * 2013-12-19 2015-06-25 日本電波工業株式会社 高安定発振器
JP2015122607A (ja) * 2013-12-24 2015-07-02 セイコーエプソン株式会社 発振器、電子機器および移動体
JP6341362B2 (ja) 2013-12-24 2018-06-13 セイコーエプソン株式会社 発熱体、振動デバイス、電子機器及び移動体
JP6323652B2 (ja) 2013-12-24 2018-05-16 セイコーエプソン株式会社 発熱体、振動デバイス、電子機器及び移動体
JP6376330B2 (ja) * 2014-03-25 2018-08-22 セイコーエプソン株式会社 電子部品、電子機器および移動体
WO2015170484A1 (ja) * 2014-05-07 2015-11-12 株式会社村田製作所 水晶振動装置
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
JP6507565B2 (ja) * 2014-10-28 2019-05-08 セイコーエプソン株式会社 電子デバイス、電子機器および移動体
JP6561487B2 (ja) * 2015-02-16 2019-08-21 セイコーエプソン株式会社 発振回路、発振器、電子機器および移動体
JP6538401B2 (ja) * 2015-04-01 2019-07-03 京セラ株式会社 圧電デバイス及びその製造方法
US10069500B2 (en) * 2016-07-14 2018-09-04 Murata Manufacturing Co., Ltd. Oven controlled MEMS oscillator
US20180131324A1 (en) * 2016-08-15 2018-05-10 Bliley Technologies, Inc. High-Efficiency Ovenized Oscillator
CN106559070A (zh) * 2016-10-18 2017-04-05 北京无线电计量测试研究所 一种恒温晶体振荡器
CN114167567B (zh) * 2017-04-06 2024-05-03 Lg伊诺特有限公司 透镜驱动单元以及包括其的摄像装置模块和光学装置
CN109981052A (zh) * 2019-04-17 2019-07-05 南京信息职业技术学院 双层恒温槽晶体振荡器结构及其制造方法
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
JP7426286B2 (ja) * 2020-05-25 2024-02-01 日本電波工業株式会社 水晶発振器
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
JP7492882B2 (ja) * 2020-08-19 2024-05-30 日本電波工業株式会社 恒温槽付水晶発振器
WO2022050414A1 (ja) * 2020-09-07 2022-03-10 株式会社大真空 恒温槽型圧電発振器
JP7581730B2 (ja) * 2020-09-24 2024-11-13 株式会社大真空 圧電発振器
JP7544247B2 (ja) * 2021-02-25 2024-09-03 株式会社大真空 恒温槽型圧電発振器
CN113125023A (zh) * 2021-03-05 2021-07-16 深圳市福浪电子有限公司 一种用于检测晶体振荡器温度的检测装置
CN113315472B (zh) * 2021-04-30 2023-06-09 武汉海创电子股份有限公司 一种航天用恒温晶体振荡器专用厚膜电路
CN116938184A (zh) * 2023-09-19 2023-10-24 广东昕海科技有限公司 一种晶体振荡器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4259606A (en) * 1979-05-25 1981-03-31 The United States Of America As Represented By The Secretary Of The Army Fast warm-up oven controlled piezoelectric oscillator
US5041800A (en) * 1989-05-19 1991-08-20 Ppa Industries, Inc. Lower power oscillator with heated resonator (S), with dual mode or other temperature sensing, possibly with an insulative support structure disposed between the resonator (S) and a resonator enclosure
US5696423A (en) 1995-06-29 1997-12-09 Motorola, Inc. Temperature compenated resonator and method
US5729181A (en) 1996-08-23 1998-03-17 Hewlett-Packard Company High thermal gain oven with reduced probability of temperature gradient formation for the operation of a thermally stable oscillator
CA2283963C (en) * 1998-01-20 2005-06-07 Toyo Communication Equipment Co., Ltd. Piezo-oscillator
US5917272A (en) * 1998-06-11 1999-06-29 Vectron, Inc. Oven-heated crystal resonator and oscillator assembly
US6060692A (en) 1998-09-02 2000-05-09 Cts Corporation Low power compact heater for piezoelectric device
US6133674A (en) * 1998-10-27 2000-10-17 Cts Low profile integrated oscillator having a stepped cavity
US6049256A (en) * 1998-09-10 2000-04-11 Cts Corporation Low profile ovenized oscillator packing having a high thermal conductivity substrate
US6731180B1 (en) * 2000-10-20 2004-05-04 Deleware Capital Formation Inc. Evacuated hybrid ovenized oscillator
US6501340B1 (en) * 2002-02-11 2002-12-31 Acr Electronics, Inc. Oscillator with frequency stabilizing circuit and method of constructing same

Also Published As

Publication number Publication date
EP1612930A1 (de) 2006-01-04
CN1716656A (zh) 2006-01-04
US7088032B2 (en) 2006-08-08
DE602005004205D1 (de) 2008-02-21
CN100485991C (zh) 2009-05-06
DE602005004205T2 (de) 2008-04-17
EP1612930B8 (de) 2008-04-30
EP1612930B1 (de) 2008-01-09
JP4354347B2 (ja) 2009-10-28
US20050285482A1 (en) 2005-12-29
JP2006014208A (ja) 2006-01-12

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Legal Events

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