|
US7292441B2
(en)
*
|
2003-11-25 |
2007-11-06 |
Advanced Energy Technology Inc. |
Thermal solution for portable electronic devices
|
|
US7280359B2
(en)
*
|
2003-12-11 |
2007-10-09 |
Matsushita Electric Industrial Co., Ltd. |
Heat-radiating structure of electronic apparatus
|
|
US7228894B2
(en)
*
|
2004-04-30 |
2007-06-12 |
Hewlett-Packard Development Company, L.P. |
Heat spreader with controlled Z-axis conductivity
|
|
US20060070720A1
(en)
*
|
2004-09-17 |
2006-04-06 |
Capp Joseph P |
Heat riser
|
|
US7799428B2
(en)
*
|
2004-10-06 |
2010-09-21 |
Graftech International Holdings Inc. |
Sandwiched thermal solution
|
|
US7319590B1
(en)
*
|
2004-10-27 |
2008-01-15 |
Raytheon Company |
Conductive heat transfer system and method for integrated circuits
|
|
KR100760509B1
(ko)
*
|
2004-12-14 |
2007-09-20 |
삼성전자주식회사 |
폴더 타입 휴대용 무선단말기의 방열 장치
|
|
JP4556174B2
(ja)
*
|
2004-12-15 |
2010-10-06 |
日本電気株式会社 |
携帯端末機器及び放熱方法
|
|
US20090101632A1
(en)
|
2005-02-17 |
2009-04-23 |
David Naylor |
Heating unit for direct current applications
|
|
US7880121B2
(en)
*
|
2005-02-17 |
2011-02-01 |
David Naylor |
Modular radiant heating apparatus
|
|
US20070262073A1
(en)
*
|
2005-09-01 |
2007-11-15 |
David Naylor |
Modular heated cover
|
|
US20090302023A1
(en)
*
|
2008-05-12 |
2009-12-10 |
Thomas Caterina |
Heating unit for warming pallets of materials
|
|
US9392646B2
(en)
|
2005-02-17 |
2016-07-12 |
417 And 7/8, Llc |
Pallet warmer heating unit
|
|
US20090114634A1
(en)
*
|
2005-02-17 |
2009-05-07 |
David Naylor |
Heating unit for warming fluid conduits
|
|
US8258443B2
(en)
*
|
2005-02-17 |
2012-09-04 |
417 And 7/8, Llc |
Heating unit for warming pallets
|
|
US9945080B2
(en)
*
|
2005-02-17 |
2018-04-17 |
Greenheat Ip Holdings, Llc |
Grounded modular heated cover
|
|
US10920379B2
(en)
|
2005-02-17 |
2021-02-16 |
Greenheat Ip Holdings Llc |
Grounded modular heated cover
|
|
US20090107986A1
(en)
*
|
2005-02-17 |
2009-04-30 |
David Naylor |
Three layer glued laminate heating unit
|
|
US20090114633A1
(en)
*
|
2005-02-17 |
2009-05-07 |
David Naylor |
Portable Pouch Heating Unit
|
|
US20090107972A1
(en)
*
|
2005-02-17 |
2009-04-30 |
David Naylor |
Heating unit for warming propane tanks
|
|
US8633425B2
(en)
|
2005-02-17 |
2014-01-21 |
417 And 7/8, Llc |
Systems, methods, and devices for storing, heating, and dispensing fluid
|
|
US20090107975A1
(en)
*
|
2005-02-17 |
2009-04-30 |
Thomas Caterina |
Heating unit for warming pallets
|
|
US9087669B2
(en)
*
|
2005-06-27 |
2015-07-21 |
Graftech International Holdings Inc. |
Display device having improved properties
|
|
JP2007012913A
(ja)
|
2005-06-30 |
2007-01-18 |
Polymatech Co Ltd |
放熱シート及び放熱構造
|
|
US7797808B2
(en)
*
|
2005-10-11 |
2010-09-21 |
General Electric Company |
Thermal management system and associated method
|
|
US20080019097A1
(en)
*
|
2005-10-11 |
2008-01-24 |
General Electric Company |
Thermal transport structure
|
|
US7297399B2
(en)
*
|
2005-10-11 |
2007-11-20 |
General Electric Company |
Thermal transport structure and associated method
|
|
KR100760770B1
(ko)
*
|
2006-03-29 |
2007-09-21 |
삼성에스디아이 주식회사 |
플라즈마 표시장치
|
|
US20070257359A1
(en)
*
|
2006-05-03 |
2007-11-08 |
Reis Bradley E |
Thermal Management Device For A Memory Module
|
|
US20070263352A1
(en)
*
|
2006-05-15 |
2007-11-15 |
Motorola, Inc. |
Plastics Utilizing Thermally Conductive Film
|
|
US7754184B2
(en)
*
|
2006-06-08 |
2010-07-13 |
Directa Plus Srl |
Production of nano-structures
|
|
US9034297B2
(en)
|
2006-06-08 |
2015-05-19 |
Directa Plus S.P.A. |
Production of nano-structures
|
|
KR100698727B1
(ko)
*
|
2006-07-27 |
2007-03-23 |
자화전자(주) |
흑연시트와 그 제조방법
|
|
EP2086872A2
(de)
*
|
2006-10-17 |
2009-08-12 |
Purdue Research Foundation |
Materialverbesserer für elektrothermische grenzflächen
|
|
JP2008205041A
(ja)
*
|
2007-02-16 |
2008-09-04 |
Toshiba Corp |
電子機器および熱伝導部材
|
|
USD574338S1
(en)
*
|
2007-03-29 |
2008-08-05 |
Luminus Devices, Inc. |
LED assembly
|
|
USD590784S1
(en)
*
|
2007-03-29 |
2009-04-21 |
Luminus Devices, Inc. |
LED assembly
|
|
USD578968S1
(en)
*
|
2007-03-29 |
2008-10-21 |
Luminus Devices, Inc. |
LED device
|
|
JP4934490B2
(ja)
*
|
2007-05-07 |
2012-05-16 |
株式会社リコー |
画像形成装置
|
|
US20100323177A1
(en)
*
|
2007-05-14 |
2010-12-23 |
Northwestern University |
Graphene oxide sheet laminate and method
|
|
US20090032218A1
(en)
*
|
2007-07-31 |
2009-02-05 |
Adc Telecommunications, Inc. |
Apparatus for transferring between two heat conducting surfaces
|
|
US8051896B2
(en)
*
|
2007-07-31 |
2011-11-08 |
Adc Telecommunications, Inc. |
Apparatus for spreading heat over a finned surface
|
|
US8235094B2
(en)
*
|
2007-07-31 |
2012-08-07 |
Adc Telecommunications, Inc. |
Apparatus for transferring heat in a fin of a heat sink
|
|
KR101390082B1
(ko)
|
2007-08-01 |
2014-05-28 |
삼성전자주식회사 |
프로젝터를 구비하는 이동통신 단말기
|
|
US8919428B2
(en)
*
|
2007-10-17 |
2014-12-30 |
Purdue Research Foundation |
Methods for attaching carbon nanotubes to a carbon substrate
|
|
US7764493B2
(en)
|
2008-01-04 |
2010-07-27 |
Apple Inc. |
Systems and methods for cooling electronic devices using airflow dividers
|
|
TWM336471U
(en)
*
|
2008-01-29 |
2008-07-11 |
Celsia Technologies Taiwan Inc |
Heat dissipating device used in memory module
|
|
WO2009115512A1
(en)
*
|
2008-03-20 |
2009-09-24 |
Dsm Ip Assets Bv |
Heatsinks of thermally conductive plastic materials
|
|
US20100009174A1
(en)
*
|
2008-07-10 |
2010-01-14 |
Reis Bradley E |
Heat Dissipation For Low Profile Devices
|
|
US7911780B2
(en)
*
|
2008-08-29 |
2011-03-22 |
Apple Inc. |
Methods and apparatus for cooling electronic devices through user interfaces
|
|
US8541058B2
(en)
*
|
2009-03-06 |
2013-09-24 |
Timothy S. Fisher |
Palladium thiolate bonding of carbon nanotubes
|
|
US8955580B2
(en)
|
2009-08-14 |
2015-02-17 |
Wah Hong Industrial Corp. |
Use of a graphite heat-dissipation device including a plating metal layer
|
|
TW201035513A
(en)
*
|
2009-03-25 |
2010-10-01 |
Wah Hong Ind Corp |
Method for manufacturing heat dissipation interface device and product thereof
|
|
US8477499B2
(en)
|
2009-06-05 |
2013-07-02 |
Laird Technologies, Inc. |
Assemblies and methods for dissipating heat from handheld electronic devices
|
|
US7965514B2
(en)
|
2009-06-05 |
2011-06-21 |
Laird Technologies, Inc. |
Assemblies and methods for dissipating heat from handheld electronic devices
|
|
US20100314081A1
(en)
*
|
2009-06-12 |
2010-12-16 |
Reis Bradley E |
High Temperature Graphite Heat Exchanger
|
|
US8081468B2
(en)
*
|
2009-06-17 |
2011-12-20 |
Laird Technologies, Inc. |
Memory modules including compliant multilayered thermally-conductive interface assemblies
|
|
US20100321897A1
(en)
*
|
2009-06-17 |
2010-12-23 |
Laird Technologies, Inc. |
Compliant multilayered thermally-conductive interface assemblies
|
|
US8405600B2
(en)
*
|
2009-12-04 |
2013-03-26 |
Graftech International Holdings Inc. |
Method for reducing temperature-caused degradation in the performance of a digital reader
|
|
WO2011146919A2
(en)
|
2010-05-21 |
2011-11-24 |
Graftech International Holdings Inc. |
Thermal solution for prismatic lithium ion battery pack
|
|
US8339787B2
(en)
|
2010-09-08 |
2012-12-25 |
Apple Inc. |
Heat valve for thermal management in a mobile communications device
|
|
US8773856B2
(en)
*
|
2010-11-08 |
2014-07-08 |
Graftech International Holdings Inc. |
Method of making an electronic device
|
|
EP2780775A4
(de)
*
|
2011-11-15 |
2015-08-26 |
Henkel IP & Holding GmbH |
Elektronische vorrichtungen mit thermisch isolierenden schichten
|
|
JP2015504602A
(ja)
*
|
2011-11-15 |
2015-02-12 |
ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング |
熱的絶縁層を用いて組み立てられた電子デバイス
|
|
US9899120B2
(en)
|
2012-11-02 |
2018-02-20 |
Nanotek Instruments, Inc. |
Graphene oxide-coated graphitic foil and processes for producing same
|
|
US10229862B2
(en)
*
|
2012-11-02 |
2019-03-12 |
Nanotek Instruments, Inc. |
Thermal management system containing a graphene oxide-coated graphitic foil laminate for electronic device application
|
|
US9533889B2
(en)
|
2012-11-26 |
2017-01-03 |
Nanotek Instruments, Inc. |
Unitary graphene layer or graphene single crystal
|
|
US9803124B2
(en)
|
2012-12-05 |
2017-10-31 |
Nanotek Instruments, Inc. |
Process for producing unitary graphene matrix composites containing carbon or graphite fillers
|
|
US9835390B2
(en)
|
2013-01-07 |
2017-12-05 |
Nanotek Instruments, Inc. |
Unitary graphene material-based integrated finned heat sink
|
|
US10566482B2
(en)
|
2013-01-31 |
2020-02-18 |
Global Graphene Group, Inc. |
Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications
|
|
US10087073B2
(en)
|
2013-02-14 |
2018-10-02 |
Nanotek Instruments, Inc. |
Nano graphene platelet-reinforced composite heat sinks and process for producing same
|
|
US9673494B2
(en)
*
|
2013-03-12 |
2017-06-06 |
Advanced Energy Technologies Llc |
Portable electronic device thermal management system
|
|
WO2014158339A1
(en)
*
|
2013-03-12 |
2014-10-02 |
Graftech International Holdings Inc. |
Thermal dissipation system
|
|
US9223363B2
(en)
|
2013-03-16 |
2015-12-29 |
Henkel IP & Holding GmbH |
Electronic devices assembled with heat absorbing and/or thermally insulating composition
|
|
CN103281888B
(zh)
*
|
2013-05-11 |
2015-08-19 |
深圳市同安泰电子科技有限公司 |
一种高导热天然石墨散热片的制备方法
|
|
US9411385B2
(en)
|
2013-05-13 |
2016-08-09 |
Google Technology Holdings LLC |
Electronic device assembly with compression gasket
|
|
TWM467917U
(zh)
*
|
2013-06-17 |
2013-12-11 |
Giant Technology Co Ltd |
運用於電子罩蓋之多重散熱組件結構
|
|
JP6125972B2
(ja)
|
2013-10-30 |
2017-05-10 |
東芝ホームテクノ株式会社 |
携帯情報端末
|
|
TWI657132B
(zh)
|
2013-12-19 |
2019-04-21 |
Henkel IP & Holding GmbH |
具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
|
|
US9282681B2
(en)
|
2014-01-21 |
2016-03-08 |
Seagate Technology Llc |
Dissipating heat during device operation
|
|
US20150334871A1
(en)
*
|
2014-05-19 |
2015-11-19 |
Laird Technologies, Inc. |
Thermal interface materials with thin film sealants
|
|
US10698458B2
(en)
*
|
2014-06-02 |
2020-06-30 |
Microsoft Technology Licensing, Llc |
Integrated vapor chamber for thermal management of computing devices
|
|
US10037202B2
(en)
|
2014-06-03 |
2018-07-31 |
Microsoft Technology Licensing, Llc |
Techniques to isolating a portion of an online computing service
|
|
WO2016015032A1
(en)
*
|
2014-07-25 |
2016-01-28 |
Graftech International Holdings Inc. |
Flexible circuit board with graphite substrate and circuit arrangements using same
|
|
US20160081226A1
(en)
*
|
2014-09-11 |
2016-03-17 |
Asia Vital Components Co., Ltd. |
Heat dissipation structure for mobile device
|
|
US9930785B2
(en)
*
|
2014-10-15 |
2018-03-27 |
AzTrong Inc. |
Configurable heat conducting path for portable electronic device
|
|
CN105704978A
(zh)
*
|
2014-11-26 |
2016-06-22 |
英业达科技有限公司 |
电子装置
|
|
US10088878B2
(en)
*
|
2014-12-15 |
2018-10-02 |
Dell Products L.P. |
Flexible heat spreader with differential thermal conductivity
|
|
US20180023904A1
(en)
*
|
2014-12-18 |
2018-01-25 |
Kaneka Corporation |
Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object
|
|
JP2018525669A
(ja)
|
2015-07-24 |
2018-09-06 |
スリーエム イノベイティブ プロパティズ カンパニー |
熱拡散層を有する反射性積層体
|
|
JP6543161B2
(ja)
*
|
2015-07-27 |
2019-07-10 |
積水化学工業株式会社 |
熱伝導部材、熱伝導部材積層体及び熱伝導部材成形体
|
|
CN108260366B
(zh)
*
|
2015-09-07 |
2020-01-14 |
朱鹤植 |
电磁波吸波及屏蔽用和电子设备超强散热用融合片及其制造方法
|
|
WO2017044712A1
(en)
|
2015-09-11 |
2017-03-16 |
Laird Technologies, Inc. |
Devices for absorbing energy from electronic components
|
|
US11416046B2
(en)
*
|
2015-11-05 |
2022-08-16 |
Henkel Ag & Co. Kgaa |
Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
|
|
JP6332289B2
(ja)
*
|
2016-01-18 |
2018-05-30 |
マツダ株式会社 |
電力制御機器の冷却構造
|
|
KR101823583B1
(ko)
*
|
2016-03-09 |
2018-01-31 |
(주)애드포휴 |
크린시트가 부착된 케이스 직접 방열식 분전함
|
|
EP3540770B1
(de)
*
|
2018-03-15 |
2022-06-01 |
Aptiv Technologies Limited |
Wärmeübertragungsvorrichtung
|
|
WO2019235983A1
(en)
|
2018-06-07 |
2019-12-12 |
Sht Smart High-Tech Ab |
Laminated graphene based thermally conductive film and method for manufacturing the film
|
|
DE112020002361B4
(de)
*
|
2019-05-15 |
2024-04-11 |
Aavid Thermal Corp. |
Dampfkammer-thermobandanordnung und verfahren
|
|
CN113994773A
(zh)
*
|
2019-06-19 |
2022-01-28 |
昭和电工材料株式会社 |
用户用装置及壳
|
|
US11439001B2
(en)
*
|
2019-11-14 |
2022-09-06 |
Dell Products L.P. |
System and method for heat removal using a thermal potting solution in an information handling system
|
|
WO2021206775A1
(en)
|
2020-04-09 |
2021-10-14 |
Hewlett-Packard Development Company |
Substrate coated with a thermal management material
|
|
JP7236167B2
(ja)
*
|
2020-06-10 |
2023-03-09 |
安立材料科技股▲ふん▼有限公司 |
高効率熱源管理を備えたケーシング構造
|
|
CN114610127A
(zh)
|
2020-12-09 |
2022-06-10 |
安立材料科技股份有限公司 |
具有高效热管理功能的机壳结构
|
|
US11592883B2
(en)
*
|
2021-07-30 |
2023-02-28 |
Dell Products L.P. |
Information handling system thermal management for dense structures
|
|
US12167573B2
(en)
*
|
2022-10-27 |
2024-12-10 |
Dell Products Lp |
Method and apparatus for an uneven thickness heat spreader
|