ATE39367T1 - PROCESS FOR THE MANUFACTURE OF CIRCUIT BOARDS. - Google Patents

PROCESS FOR THE MANUFACTURE OF CIRCUIT BOARDS.

Info

Publication number
ATE39367T1
ATE39367T1 AT85107381T AT85107381T ATE39367T1 AT E39367 T1 ATE39367 T1 AT E39367T1 AT 85107381 T AT85107381 T AT 85107381T AT 85107381 T AT85107381 T AT 85107381T AT E39367 T1 ATE39367 T1 AT E39367T1
Authority
AT
Austria
Prior art keywords
baseboards
manufacture
cyclohexene
activated
way
Prior art date
Application number
AT85107381T
Other languages
German (de)
Inventor
Kirkor Dr Sirinyan
Gerhard Dieter Dr Wolf
Gizycki Ulrich Dr Von
Rudolf Dr Merten
Original Assignee
Bayer Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer Ag filed Critical Bayer Ag
Application granted granted Critical
Publication of ATE39367T1 publication Critical patent/ATE39367T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Paper (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Auxiliary Devices For Music (AREA)
  • Luminescent Compositions (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Electric Motors In General (AREA)
  • Networks Using Active Elements (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

1. Process for the manufacture of printed circuits by the wet-chemical metallizing of baseboards with the aid of organometallic activators, characterized in that a) the baseboards are activated, without prior etching, with a solution of 0.01-10 g/l of a complex compound of Pd, Au, Pt or Ag with a conjugated diene, alpha, beta unsaturated ketone, 4-cyclohexene-1,2-dicarboxylic anhydride or 4-cyclohexene-1,2-dicarboxylic imide, b) an electronically conductive metal coating with a layer thickness of 0.05-10 mu m and a stability to separation of at least 25 N/25 mm according to DIN 53 494 is applied to the boards activated in this way, by a wet chemical-electroless method or a combined wet chemical-electroless/electroplating method, and c) the baseboards metallized in this way, i. e. the so-called semi-finished products, are further processed in the customary manner to produce printed circuits.
AT85107381T 1984-06-26 1985-06-14 PROCESS FOR THE MANUFACTURE OF CIRCUIT BOARDS. ATE39367T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843423457 DE3423457A1 (en) 1984-06-26 1984-06-26 METHOD FOR THE PRODUCTION OF CIRCUIT BOARDS
EP85107381A EP0166327B1 (en) 1984-06-26 1985-06-14 Process for manufacturing printed circuit boards

Publications (1)

Publication Number Publication Date
ATE39367T1 true ATE39367T1 (en) 1989-01-15

Family

ID=6239138

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85107381T ATE39367T1 (en) 1984-06-26 1985-06-14 PROCESS FOR THE MANUFACTURE OF CIRCUIT BOARDS.

Country Status (6)

Country Link
EP (1) EP0166327B1 (en)
JP (1) JPS6118195A (en)
AT (1) ATE39367T1 (en)
DE (2) DE3423457A1 (en)
ES (1) ES8700538A1 (en)
FI (1) FI852488A7 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
CN117178076B (en) * 2021-03-29 2026-01-30 麦德美昂索有限公司 Acid washing of polyamide

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA956294A (en) * 1973-03-14 1974-10-15 Stanley J. Whittaker Rotary valve
JPS5694690A (en) * 1979-12-27 1981-07-31 Asahi Chemical Ind Method of manufacturing thick film fine pattern
DE3148280A1 (en) * 1981-12-05 1983-06-09 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATE SURFACES FOR ELECTRIC METALLIZATION
DE3324767A1 (en) * 1983-07-08 1985-01-17 Bayer Ag, 5090 Leverkusen METHOD FOR ACTIVATING SUBSTRATES FOR CURRENT METALIZATION

Also Published As

Publication number Publication date
FI852488L (en) 1985-12-27
ES544533A0 (en) 1986-10-16
FI852488A7 (en) 1985-12-27
EP0166327B1 (en) 1988-12-21
FI852488A0 (en) 1985-06-24
EP0166327A3 (en) 1986-10-08
ES8700538A1 (en) 1986-10-16
EP0166327A2 (en) 1986-01-02
JPS6118195A (en) 1986-01-27
DE3566905D1 (en) 1989-01-26
DE3423457A1 (en) 1986-01-02

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee