JPS6422095A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6422095A
JPS6422095A JP17938287A JP17938287A JPS6422095A JP S6422095 A JPS6422095 A JP S6422095A JP 17938287 A JP17938287 A JP 17938287A JP 17938287 A JP17938287 A JP 17938287A JP S6422095 A JPS6422095 A JP S6422095A
Authority
JP
Japan
Prior art keywords
copper circuit
nickel
temporarily bonded
coating metal
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17938287A
Other languages
Japanese (ja)
Inventor
Hiroshi Nomura
Koichi Kawamata
Kazunori Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP17938287A priority Critical patent/JPS6422095A/en
Publication of JPS6422095A publication Critical patent/JPS6422095A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To manufacture easily a printed wiring board having a copper circuit with high reliability, by method wherein a copper circuit is formed on a temporarily bonded base, three surfaces of the copper circuit are coated by plating of coating metal like nickel, the temporarily bonded base is exfoliated or eliminated, and the whole surface is plated with metal. CONSTITUTION:After a specified copper circuit 1 is formed on temporarily bonded bases 6, 7, the exposed surface of the copper circuit is plated with coating metal like nickel, by using an ordinary electroless plating method. On a coating 2a surface of the coated metal like nickel formed on the copper circuit 1, bonding base films 3, 4 are bonded, by using an ordinary bonding method, e.g., thermocompression roll method. After the bonding base films 3, 4 are bonded, the used temporarily bonded film 6, 7 are exfoliated or eliminated from the surface of the copper circuit 1, and the bonding base film having the copper circuit partially coated with coating metal like nickel is obtained. After the temporarily bonded bases 6, 7 are exfoliated or eliminated, plating of coating metal like nickel is again performed, and the copper circuit 1 is completely coated with coating metal like nickel.
JP17938287A 1987-07-17 1987-07-17 Manufacture of printed wiring board Pending JPS6422095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17938287A JPS6422095A (en) 1987-07-17 1987-07-17 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17938287A JPS6422095A (en) 1987-07-17 1987-07-17 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6422095A true JPS6422095A (en) 1989-01-25

Family

ID=16064882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17938287A Pending JPS6422095A (en) 1987-07-17 1987-07-17 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6422095A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074465A (en) * 2010-09-28 2012-04-12 Fujikura Ltd Transfer medium and method of manufacturing wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074465A (en) * 2010-09-28 2012-04-12 Fujikura Ltd Transfer medium and method of manufacturing wiring board

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