ATE401766T1 - Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren - Google Patents

Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren

Info

Publication number
ATE401766T1
ATE401766T1 AT99906923T AT99906923T ATE401766T1 AT E401766 T1 ATE401766 T1 AT E401766T1 AT 99906923 T AT99906923 T AT 99906923T AT 99906923 T AT99906923 T AT 99906923T AT E401766 T1 ATE401766 T1 AT E401766T1
Authority
AT
Austria
Prior art keywords
polymer film
film product
layer
metalized composite
layer metalized
Prior art date
Application number
AT99906923T
Other languages
English (en)
Inventor
Merwin Hoover
John Bradshaw
Thomas Burke
Original Assignee
Micrometal Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micrometal Technologies Inc filed Critical Micrometal Technologies Inc
Application granted granted Critical
Publication of ATE401766T1 publication Critical patent/ATE401766T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Woven Fabrics (AREA)
AT99906923T 1998-03-26 1999-02-08 Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren ATE401766T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/053,859 US6042929A (en) 1998-03-26 1998-03-26 Multilayer metalized composite on polymer film product and process

Publications (1)

Publication Number Publication Date
ATE401766T1 true ATE401766T1 (de) 2008-08-15

Family

ID=21987036

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99906923T ATE401766T1 (de) 1998-03-26 1999-02-08 Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren

Country Status (11)

Country Link
US (1) US6042929A (de)
EP (1) EP0989914B1 (de)
JP (1) JP2002511809A (de)
KR (1) KR20010013051A (de)
CN (1) CN1198692C (de)
AT (1) ATE401766T1 (de)
BR (1) BR9904886A (de)
CA (1) CA2306786C (de)
DE (1) DE69939087D1 (de)
IL (1) IL133147A (de)
WO (1) WO1999048620A1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083628A (en) * 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
JP3606095B2 (ja) * 1998-10-06 2005-01-05 セイコーエプソン株式会社 半導体装置の製造方法
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
US6734455B2 (en) * 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
CA2445901A1 (en) * 2001-05-04 2002-11-14 Micrometal Technologies Inc. Metalized dielectric substrates for eas tags
JP3578116B2 (ja) * 2001-06-25 2004-10-20 Ｔｄｋ株式会社 スピンバルブ巨大磁気抵抗効果センサの製造方法及び薄膜磁気ヘッドの製造方法
TW532052B (en) * 2001-06-27 2003-05-11 Ngk Spark Plug Co Production method of a distribution substrate
US20040194691A1 (en) * 2001-07-18 2004-10-07 George Steven M Method of depositing an inorganic film on an organic polymer
US6872652B2 (en) * 2001-08-28 2005-03-29 Infineon Technologies Ag Method of cleaning an inter-level dielectric interconnect
JP2003221456A (ja) * 2002-01-29 2003-08-05 Japan Gore Tex Inc 高接着性液晶ポリマーフィルム
US7113131B2 (en) * 2002-05-02 2006-09-26 Micrometal Technologies, Inc. Metalized dielectric substrates for EAS tags
JP4517564B2 (ja) * 2002-05-23 2010-08-04 住友金属鉱山株式会社 ２層銅ポリイミド基板
EP1587862A1 (de) 2003-01-30 2005-10-26 Europlasma Verfahren zur bereitstellung einer beschichtung auf den oberflächen eines produkts mit offenzelliger struktur durch dessen gesamte struktur und verwendung eines derartigen verfahrens
US8133324B2 (en) * 2004-06-16 2012-03-13 Ppg Industries Ohio, Inc Methods for removal of polymeric coating layers from coated substrates
KR100807796B1 (ko) * 2005-05-19 2008-03-06 한덕수 미세 패턴용 연성다층인쇄회로기판
KR20070049278A (ko) * 2005-11-08 2007-05-11 삼성전자주식회사 배선, 이를 포함하는 박막 트랜지스터 기판과 그 제조 방법
KR100850212B1 (ko) * 2007-04-20 2008-08-04 삼성전자주식회사 균일한 무전해 도금 두께를 얻을 수 있는 반도체 소자의제조방법
US20100098960A1 (en) * 2007-06-18 2010-04-22 Dominguez Juan E Magnetic insulator nanolaminate device for integrated silicon voltage regulators
WO2009004774A1 (ja) * 2007-07-02 2009-01-08 Panasonic Corporation 金属積層ポリイミド基盤及びその製造方法
KR100906308B1 (ko) 2007-10-24 2009-07-07 성균관대학교산학협력단 미세 배선이 형성된 연성 전도성 폴리이미드 기판 및 이의제조방법
KR20120135354A (ko) * 2008-07-22 2012-12-12 가부시키가이샤 다이쇼덴시 배선 기판 및 그 제조 방법
EP2513686B1 (de) * 2009-12-15 2019-04-10 Carl Zeiss SMT GmbH Optisches reflexionselement für euv-lithographie
JP5781428B2 (ja) * 2011-12-20 2015-09-24 日東電工株式会社 導電性フィルムおよび導電性フィルムロール
CN102978570B (zh) * 2012-11-26 2014-10-08 蔡莳铨 金属蒸镀薄膜及其制作中间体和相关制作方法
US9614045B2 (en) * 2014-09-17 2017-04-04 Infineon Technologies Ag Method of processing a semiconductor device and chip package
CN104451955B (zh) * 2014-11-25 2017-02-22 中国科学院电子学研究所 一种具有分级结构的金属或金属氧化物及其制备方法
US10879177B2 (en) * 2015-06-19 2020-12-29 Applied Materials, Inc. PVD deposition and anneal of multi-layer metal-dielectric film
CN106413266B (zh) 2015-07-29 2018-11-23 苏州卫鹏机电科技有限公司 一种聚酰亚胺无胶柔性印刷线路板的制备方法
DE102016215709A1 (de) * 2015-08-28 2017-03-02 Tsubakimoto Chain Co. Kettenkomponente und Kette
CN107371338B (zh) * 2016-05-13 2019-08-20 苏州卫鹏机电科技有限公司 一种超薄金属层的印刷线路板的制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226932A (en) * 1979-07-05 1980-10-07 Gte Automatic Electric Laboratories Incorporated Titanium nitride as one layer of a multi-layered coating intended to be etched
DE3039821A1 (de) * 1980-10-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Mehrschichtsystem fuer waermeschutzanwendung
US4337279A (en) * 1981-01-23 1982-06-29 Uop Inc. Method for increasing the peel strength of metal-clad polymers
US4382101A (en) * 1981-01-23 1983-05-03 Uop Inc. Method for increasing the peel strength of metal-clad polymers
US4597828A (en) * 1985-03-25 1986-07-01 Firan Corporation Method of manufacturing printed circuit boards
US4806395A (en) * 1987-02-24 1989-02-21 Polyonics Corporation Textured polyimide film
US4868071A (en) * 1987-02-24 1989-09-19 Polyonics Corporation Thermally stable dual metal coated laminate products made from textured polyimide film
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
JP2788779B2 (ja) * 1990-03-09 1998-08-20 古河電気工業株式会社 回路基板用素材板
US5137791A (en) * 1990-09-13 1992-08-11 Sheldahl Inc. Metal-film laminate resistant to delamination
US5413687A (en) * 1991-11-27 1995-05-09 Rogers Corporation Method for metallizing fluoropolymer substrates
US5372848A (en) * 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
US5589280A (en) * 1993-02-05 1996-12-31 Southwall Technologies Inc. Metal on plastic films with adhesion-promoting layer
US5675310A (en) * 1994-12-05 1997-10-07 General Electric Company Thin film resistors on organic surfaces
JPH0971859A (ja) * 1995-09-06 1997-03-18 Nissin Electric Co Ltd 貴金属膜被覆高分子基体及びその製造方法
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers

Also Published As

Publication number Publication date
KR20010013051A (ko) 2001-02-26
JP2002511809A (ja) 2002-04-16
EP0989914A4 (de) 2005-05-25
CN1198692C (zh) 2005-04-27
IL133147A0 (en) 2001-03-19
WO1999048620A1 (en) 1999-09-30
EP0989914B1 (de) 2008-07-16
CA2306786A1 (en) 1999-09-30
US6042929A (en) 2000-03-28
BR9904886A (pt) 2002-01-15
EP0989914A1 (de) 2000-04-05
CA2306786C (en) 2005-01-11
DE69939087D1 (de) 2008-08-28
IL133147A (en) 2004-02-08
CN1272072A (zh) 2000-11-01

Similar Documents

Publication Publication Date Title
DE69939087D1 (de) Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren
ATE185745T1 (de) Bedruckbare folie
MY139405A (en) Printed circuit board and method for its production
WO2004008832A3 (en) Attachable modular electronic systems
EP0952762A4 (de) Leiterplatte und verfahren zur herstellung
WO2000052982A3 (en) Multifonctional laminate structure and process
WO2002049405A3 (en) Multi-layer circuits and methods of manufacture thereof
MY128632A (en) Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
AU4147093A (en) Piezoelectric element for keyboards
WO2002013258A3 (en) Backside contact for integrated circuit and method of forming same
EP1429590A4 (de) Dünnfilmleiterplatteneinrichtung und verfahren zu ihrer herstellung
EP1102522A3 (de) Substrat beschichtet mit einer leitfähigen Schicht und Verfahren zu dessen Herstellung
TW339473B (en) Electronic package with multilevel connections
TW200507009A (en) Method of forming high resolution electronic circuits on a substrate
SE9803392L (sv) Tryckt kretskort och förfarande för dess tillverkning
TW200520056A (en) Pattern formation method, electronic circuit manufactured by the same, and electronic apparatus using the same
ATE265693T1 (de) Mehrschichtige elektroleitende antireflektierende beschichtung
BR0110114A (pt) Elemento de contato elástico
AU2003224689A1 (en) Conductive polymer device and method of manufacturing same
CA2338670A1 (en) Resin/copper/metal laminate and method of producing same
MY128174A (en) Thin film capacitor and thin film electronic component and method for manufacturing the same.
EP0710062A4 (de) Mehrschichtige leiterplatte und ihre herstellung und übertragungsplatte und ihre herstellung
EP1461832A1 (de) Organischer halbleiter und verfahren
EP0782376A3 (de) Polyimid-Metallfolie-Verbundfilm
MY122963A (en) Cover tape for electronic part conveyance and electronic part conveying member

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties