ATE401770T1 - Verbesserungen bei der wärmeabführung für elektronische gehäuse - Google Patents

Verbesserungen bei der wärmeabführung für elektronische gehäuse

Info

Publication number
ATE401770T1
ATE401770T1 AT04785110T AT04785110T ATE401770T1 AT E401770 T1 ATE401770 T1 AT E401770T1 AT 04785110 T AT04785110 T AT 04785110T AT 04785110 T AT04785110 T AT 04785110T AT E401770 T1 ATE401770 T1 AT E401770T1
Authority
AT
Austria
Prior art keywords
frame member
heat dissipation
support members
electronic circuit
circuit cards
Prior art date
Application number
AT04785110T
Other languages
English (en)
Inventor
Matthew Ferris
Cyle Petersen
Original Assignee
Adc Dsl Sys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Dsl Sys Inc filed Critical Adc Dsl Sys Inc
Application granted granted Critical
Publication of ATE401770T1 publication Critical patent/ATE401770T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Transmitters (AREA)
AT04785110T 2003-09-26 2004-09-24 Verbesserungen bei der wärmeabführung für elektronische gehäuse ATE401770T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/673,357 US6865085B1 (en) 2003-09-26 2003-09-26 Heat dissipation for electronic enclosures

Publications (1)

Publication Number Publication Date
ATE401770T1 true ATE401770T1 (de) 2008-08-15

Family

ID=34218167

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04785110T ATE401770T1 (de) 2003-09-26 2004-09-24 Verbesserungen bei der wärmeabführung für elektronische gehäuse

Country Status (8)

Country Link
US (1) US6865085B1 (de)
EP (1) EP1668970B1 (de)
AT (1) ATE401770T1 (de)
CA (1) CA2540154A1 (de)
DE (1) DE602004015127D1 (de)
ES (1) ES2309565T3 (de)
PL (1) PL1668970T3 (de)
WO (1) WO2005032231A1 (de)

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CN109841464B (zh) * 2017-11-27 2024-01-26 东莞市贡福电子有限公司 熔断器
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CN116437235B (zh) * 2023-06-13 2023-08-18 合肥岭雁科技有限公司 一种防潮防尘智能网关装置

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Also Published As

Publication number Publication date
ES2309565T3 (es) 2008-12-16
DE602004015127D1 (de) 2008-08-28
PL1668970T3 (pl) 2009-01-30
CA2540154A1 (en) 2005-04-07
EP1668970A1 (de) 2006-06-14
EP1668970B1 (de) 2008-07-16
US20050068743A1 (en) 2005-03-31
WO2005032231A1 (en) 2005-04-07
US6865085B1 (en) 2005-03-08

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