ATE402419T1 - Baugruppe zum regeln der temperatur einer integrierten schaltung - Google Patents

Baugruppe zum regeln der temperatur einer integrierten schaltung

Info

Publication number
ATE402419T1
ATE402419T1 AT05824949T AT05824949T ATE402419T1 AT E402419 T1 ATE402419 T1 AT E402419T1 AT 05824949 T AT05824949 T AT 05824949T AT 05824949 T AT05824949 T AT 05824949T AT E402419 T1 ATE402419 T1 AT E402419T1
Authority
AT
Austria
Prior art keywords
temperature
assembly
controlling
integrated circuit
gimbal
Prior art date
Application number
AT05824949T
Other languages
English (en)
Inventor
Jerry Tustaniwskyj
James Babcock
Henry Kuo
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Application granted granted Critical
Publication of ATE402419T1 publication Critical patent/ATE402419T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of Temperature (AREA)
AT05824949T 2004-11-18 2005-11-17 Baugruppe zum regeln der temperatur einer integrierten schaltung ATE402419T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/992,308 US7243704B2 (en) 2004-11-18 2004-11-18 Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end

Publications (1)

Publication Number Publication Date
ATE402419T1 true ATE402419T1 (de) 2008-08-15

Family

ID=36129901

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05824949T ATE402419T1 (de) 2004-11-18 2005-11-17 Baugruppe zum regeln der temperatur einer integrierten schaltung

Country Status (6)

Country Link
US (1) US7243704B2 (de)
EP (1) EP1877809B1 (de)
CN (1) CN101115999A (de)
AT (1) ATE402419T1 (de)
DE (1) DE602005008482D1 (de)
WO (1) WO2006055906A2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
TWI300466B (en) 2002-11-01 2008-09-01 Cooligy Inc Channeled flat plate fin heat exchange system, device and method
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US20070175621A1 (en) * 2006-01-31 2007-08-02 Cooligy, Inc. Re-workable metallic TIM for efficient heat exchange
EP1987309B1 (de) * 2006-02-16 2014-04-16 Cooligy, Inc. Flüssigkeitskühlungsschleifen für serveranwendungen
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN101261295B (zh) * 2007-03-05 2010-08-25 海尔集团公司 用于lcd电视机调试生产线的自动插接工装及其控制电路
CN101715536A (zh) * 2007-05-02 2010-05-26 固利吉股份有限公司 用于电子冷却应用的微管/多端口逆流散热器设计
TW200924625A (en) 2007-08-07 2009-06-01 Cooligy Inc Deformable duct guides that accommodate electronic connection lines
CN101267013B (zh) * 2008-04-30 2011-09-28 晶能光电（江西）有限公司 半导体外延片的压焊结构
US9500701B2 (en) 2010-03-17 2016-11-22 Delta Design, Inc. Alignment mechanism
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN110879304B (zh) * 2018-09-06 2022-12-30 致茂电子股份有限公司 滑移式电子元件测试装置
US11378615B2 (en) 2020-04-20 2022-07-05 Aem Singapore Pte Ltd Thermal test head for an integrated circuit device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
US5880930A (en) * 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US6323665B1 (en) * 1997-10-07 2001-11-27 Reliability Incorporated Apparatus capable of high power dissipation during burn-in of a device under test
US6116331A (en) 1998-12-10 2000-09-12 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
US6774661B1 (en) 2003-03-18 2004-08-10 Unisys Corporation Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications

Also Published As

Publication number Publication date
EP1877809A2 (de) 2008-01-16
EP1877809B1 (de) 2008-07-23
WO2006055906A2 (en) 2006-05-26
CN101115999A (zh) 2008-01-30
US20060102999A1 (en) 2006-05-18
US7243704B2 (en) 2007-07-17
DE602005008482D1 (de) 2008-09-04
WO2006055906A3 (en) 2006-09-08

Similar Documents

Publication Publication Date Title
ATE402419T1 (de) Baugruppe zum regeln der temperatur einer integrierten schaltung
ATE532396T1 (de) Thermisches ableitsystem für tragbare elektronische vorrichtungen
ATE438132T1 (de) Termische lösung für elektronische geräte
ATE416502T1 (de) Lösbare verriegelungshakenanordnung
TW200715506A (en) Thermally conductive member and cooling system using the same
ATE441089T1 (de) Navigationseinrichtung mit kamera-info
EP1767529A4 (de) Pyridazinverbindung und deren verwendung
WO2005048298A3 (en) Sandwiched thermal solution
TW200741932A (en) Mounting apparatus
TWI265271B (en) Thermal module capable of dusting fins off by vibration and electronic appliance thereof
ATE471240T1 (de) Thermisch stabile näherungsidentifikationskarte
DE602005022783D1 (de) Kühlbaugruppe
DE502007004917D1 (de) Halter für eine flexible leiterplatte
ATE369557T1 (de) Gaschromatographievorrichtung
TW200612808A (en) Heat sink fixing device
WO2005112112A3 (en) Captive socket actuator
DE602006006446D1 (de) Befestigungselement
ATE451825T1 (de) Elektronisches gerät mit einer elektrischen spule
TW200638854A (en) Heat-dissipation device and electronic device utilizing the same
TW200728697A (en) System for heat pipe temperature measurement
TW200743893A (en) Protective structure for camera and portable electronic device therewith
TW200706873A (en) Carrier for open/short testing device
TWI265776B (en) Electronic device
TW200724012A (en) Dissipating heat device
ATE507518T1 (de) Temperaturkompensierter i/p-umsetzer

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties