ATE402563T1 - Kameramodul - Google Patents
KameramodulInfo
- Publication number
- ATE402563T1 ATE402563T1 AT04252587T AT04252587T ATE402563T1 AT E402563 T1 ATE402563 T1 AT E402563T1 AT 04252587 T AT04252587 T AT 04252587T AT 04252587 T AT04252587 T AT 04252587T AT E402563 T1 ATE402563 T1 AT E402563T1
- Authority
- AT
- Austria
- Prior art keywords
- solid
- imaging device
- state imaging
- optical unit
- receiving elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L9/00—Disinfection, sterilisation or deodorisation of air
- A61L9/16—Disinfection, sterilisation or deodorisation of air using physical phenomena
- A61L9/22—Ionisation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/021—Power management, e.g. power saving
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/028—Generation of voltages supplied to electrode drivers in a matrix display other than LCD
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Veterinary Medicine (AREA)
- Physics & Mathematics (AREA)
- Epidemiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Public Health (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003130599A JP4510403B2 (ja) | 2003-05-08 | 2003-05-08 | カメラモジュール及びカメラモジュールの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE402563T1 true ATE402563T1 (de) | 2008-08-15 |
Family
ID=32985658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04252587T ATE402563T1 (de) | 2003-05-08 | 2004-05-04 | Kameramodul |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7570297B2 (de) |
| EP (2) | EP1475960B1 (de) |
| JP (1) | JP4510403B2 (de) |
| KR (1) | KR100614476B1 (de) |
| CN (1) | CN1323550C (de) |
| AT (1) | ATE402563T1 (de) |
| DE (2) | DE602004018852D1 (de) |
Families Citing this family (86)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
| US7061106B2 (en) * | 2004-04-28 | 2006-06-13 | Advanced Chip Engineering Technology Inc. | Structure of image sensor module and a method for manufacturing of wafer level package |
| CN1969539A (zh) | 2004-05-04 | 2007-05-23 | 德塞拉股份有限公司 | 紧凑透镜塔形组件 |
| US20060109366A1 (en) * | 2004-05-04 | 2006-05-25 | Tessera, Inc. | Compact lens turret assembly |
| WO2005125181A1 (ja) * | 2004-06-15 | 2005-12-29 | Renesas Technology Corp. | 光学モジュールの製造方法及び組立装置 |
| JP2006032886A (ja) | 2004-06-15 | 2006-02-02 | Fuji Photo Film Co Ltd | 固体撮像装置及びその製造方法及びカメラモジュール |
| EP1628493A1 (de) * | 2004-08-17 | 2006-02-22 | Dialog Semiconductor GmbH | Handhabungssystem für Kamera |
| JP2006100763A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法及び接合装置 |
| EP1648181A1 (de) | 2004-10-12 | 2006-04-19 | Dialog Semiconductor GmbH | Einzelbildabspeichervorrichtung |
| KR100630705B1 (ko) * | 2004-10-20 | 2006-10-02 | 삼성전자주식회사 | 카메라 모듈 및 그 제조방법 |
| JP4562538B2 (ja) * | 2005-01-31 | 2010-10-13 | モレックス インコーポレイテド | モジュール用ソケット |
| FR2881847A1 (fr) * | 2005-02-10 | 2006-08-11 | St Microelectronics Sa | Dispositif comportant un module de camera a mise au point automatique et procede de montage correspondant |
| DE102005006756A1 (de) * | 2005-02-15 | 2006-08-17 | Robert Bosch Gmbh | Bildaufnahmesystem |
| EP1713126A1 (de) * | 2005-04-14 | 2006-10-18 | Shih-Hsien Tseng | Bildaufnahmevorrichtung und deren Herstellungsverfahren |
| JP4684771B2 (ja) * | 2005-06-30 | 2011-05-18 | Hoya株式会社 | 像振れ補正装置 |
| US7531773B2 (en) | 2005-09-08 | 2009-05-12 | Flextronics Ap, Llc | Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group |
| FR2891088A1 (fr) * | 2005-09-20 | 2007-03-23 | St Microelectronics Sa | Structure de montage d'un objectif mobile au-dessus d'un capteur optique |
| KR100658149B1 (ko) | 2005-11-25 | 2006-12-15 | 삼성전기주식회사 | 이미지센서 모듈과 이를 포함하는 카메라 모듈 패키지 |
| WO2007096992A1 (ja) * | 2006-02-24 | 2007-08-30 | Matsushita Electric Industrial Co., Ltd. | 撮像装置及び携帯端末装置 |
| KR100770690B1 (ko) * | 2006-03-15 | 2007-10-29 | 삼성전기주식회사 | 카메라모듈 패키지 |
| KR100770684B1 (ko) * | 2006-05-18 | 2007-10-29 | 삼성전기주식회사 | 카메라 모듈 패키지 |
| KR100795181B1 (ko) | 2006-08-23 | 2008-01-16 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
| KR100823686B1 (ko) | 2006-08-23 | 2008-04-18 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
| KR100810284B1 (ko) * | 2006-09-28 | 2008-03-06 | 삼성전자주식회사 | 카메라 모듈과 그 제조 방법 |
| JP5154783B2 (ja) * | 2006-11-14 | 2013-02-27 | オリンパス株式会社 | 撮像モジュールの製造方法 |
| KR100868052B1 (ko) * | 2006-12-05 | 2008-11-10 | 삼성전기주식회사 | 카메라 모듈 패키지 및 그 조립방법 |
| JP2008148222A (ja) * | 2006-12-13 | 2008-06-26 | Matsushita Electric Ind Co Ltd | 固体撮像装置とその製造方法 |
| US20080170141A1 (en) * | 2007-01-11 | 2008-07-17 | Samuel Waising Tam | Folded package camera module and method of manufacture |
| JP2010525412A (ja) | 2007-04-24 | 2010-07-22 | フレックストロニクス エーピー エルエルシー | 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール |
| US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
| CN100592131C (zh) * | 2007-10-24 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | 摄像模组 |
| CN101420526B (zh) * | 2007-10-26 | 2011-06-08 | 鸿富锦精密工业(深圳)有限公司 | 影像感测器承载装置及相机模组 |
| DE102007055322B4 (de) * | 2007-11-20 | 2012-09-06 | Continental Automotive Gmbh | Herstellungsverfahren für eine Kamera |
| US9350976B2 (en) | 2007-11-26 | 2016-05-24 | First Sensor Mobility Gmbh | Imaging unit of a camera for recording the surroundings with optics uncoupled from a circuit board |
| DE102007057172B4 (de) * | 2007-11-26 | 2009-07-02 | Silicon Micro Sensors Gmbh | Stereokamera zur Umgebungserfassung |
| US8488046B2 (en) | 2007-12-27 | 2013-07-16 | Digitaloptics Corporation | Configurable tele wide module |
| US8031477B2 (en) * | 2008-02-15 | 2011-10-04 | Optoelectronics Co., Ltd. | System and method for coupling a lens to a printed circuit |
| JP4667480B2 (ja) * | 2008-03-07 | 2011-04-13 | Okiセミコンダクタ株式会社 | カメラモジュール |
| JP5165437B2 (ja) * | 2008-03-27 | 2013-03-21 | シャープ株式会社 | 固体撮像装置、および電子機器 |
| TWI459032B (zh) * | 2009-03-09 | 2014-11-01 | 鏡頭模組之組裝方法、組裝設備及檢測方法 | |
| TWI464477B (zh) * | 2009-12-22 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | 鏡頭模組及其組裝方法 |
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| WO2011111248A1 (ja) * | 2010-03-10 | 2011-09-15 | Smk株式会社 | カメラモジュール |
| DE112010005015A5 (de) * | 2010-04-01 | 2012-11-22 | Conti Temic Microelectronic Gmbh | Vorrichtung mit optischem Modul und Objektivhalter |
| JP5913284B2 (ja) * | 2010-04-01 | 2016-04-27 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH | 光学モジュール及び支持板を持つ装置 |
| KR20110127913A (ko) * | 2010-05-20 | 2011-11-28 | 삼성전자주식회사 | 카메라 모듈 |
| US8308379B2 (en) | 2010-12-01 | 2012-11-13 | Digitaloptics Corporation | Three-pole tilt control system for camera module |
| DE102011011527A1 (de) * | 2011-02-17 | 2012-08-23 | Conti Temic Microelectronic Gmbh | Kameramodul |
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| CN107210307B (zh) * | 2015-02-16 | 2021-05-14 | 索尼公司 | 相机模块和电子设备 |
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| JP2020004901A (ja) * | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
| JP2020150207A (ja) | 2019-03-15 | 2020-09-17 | キヤノン株式会社 | 電子部品およびその製造方法、機器 |
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| AT522995B1 (de) * | 2019-10-07 | 2021-05-15 | Vexcel Imaging Gmbh | Sensoranordnung |
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| KR102380310B1 (ko) * | 2020-08-26 | 2022-03-30 | 삼성전기주식회사 | 카메라 모듈 |
| KR102560901B1 (ko) * | 2020-11-16 | 2023-07-28 | (주)파트론 | 온도 센서 모듈 |
| AT525579B1 (de) | 2022-03-09 | 2023-05-15 | Vexcel Imaging Gmbh | Verfahren und Kamera zur Korrektur eines geometrischen Abbildungsfehlers in einer Bildaufnahme |
| US12149803B1 (en) * | 2022-08-10 | 2024-11-19 | Meta Platforms Technologies, Llc | Camera module with a folded flexible interconnect tape package |
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-
2003
- 2003-05-08 JP JP2003130599A patent/JP4510403B2/ja not_active Expired - Fee Related
-
2004
- 2004-05-04 EP EP04252587A patent/EP1475960B1/de not_active Expired - Lifetime
- 2004-05-04 DE DE602004018852T patent/DE602004018852D1/de not_active Expired - Lifetime
- 2004-05-04 DE DE602004015191T patent/DE602004015191D1/de not_active Expired - Lifetime
- 2004-05-04 EP EP07002705A patent/EP1796376B1/de not_active Expired - Lifetime
- 2004-05-04 AT AT04252587T patent/ATE402563T1/de not_active IP Right Cessation
- 2004-05-06 US US10/839,231 patent/US7570297B2/en not_active Expired - Fee Related
- 2004-05-07 KR KR1020040032333A patent/KR100614476B1/ko not_active Expired - Fee Related
- 2004-05-08 CN CNB200410042264XA patent/CN1323550C/zh not_active Expired - Fee Related
-
2007
- 2007-08-23 US US11/843,821 patent/US20080049127A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1475960A3 (de) | 2005-02-02 |
| EP1796376B1 (de) | 2008-12-31 |
| DE602004018852D1 (de) | 2009-02-12 |
| US20080049127A1 (en) | 2008-02-28 |
| KR20040095732A (ko) | 2004-11-15 |
| JP2004335794A (ja) | 2004-11-25 |
| JP4510403B2 (ja) | 2010-07-21 |
| CN1323550C (zh) | 2007-06-27 |
| DE602004015191D1 (de) | 2008-09-04 |
| CN1551619A (zh) | 2004-12-01 |
| US20040223072A1 (en) | 2004-11-11 |
| US7570297B2 (en) | 2009-08-04 |
| KR100614476B1 (ko) | 2006-08-22 |
| EP1796376A1 (de) | 2007-06-13 |
| EP1475960A2 (de) | 2004-11-10 |
| EP1475960B1 (de) | 2008-07-23 |
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