ATE409208T1 - Silikonharz-zusammensetzung, härtbare harz- zusammensetzung und gehärtetes harz - Google Patents

Silikonharz-zusammensetzung, härtbare harz- zusammensetzung und gehärtetes harz

Info

Publication number: ATE409208T1
Authority: AT; Austria
Prior art keywords: resin composition; resin; relates; present; curtable
Prior art date: 2002-02-28

Application number

AT03705204T

Other languages

English (en)

Inventor

Yoshitsugu Morita

Hiroshi Ueki

Haruhiko Furukawa

Koji Nakanishi

Original Assignee

Dow Corning Toray Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-02-28

Filing date

2003-02-14

Publication date

2008-10-15

2003-02-14 Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd

2008-10-15 Application granted granted Critical

2008-10-15 Publication of ATE409208T1 publication Critical patent/ATE409208T1/de

Links

229920005989 resin Polymers 0.000 title abstract 4
239000011347 resin Substances 0.000 title abstract 4
239000011342 resin composition Substances 0.000 title abstract 4
229920002050 silicone resin Polymers 0.000 title abstract 2
RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 2
230000002411 adverse Effects 0.000 abstract 2
239000003063 flame retardant Substances 0.000 abstract 2
229910000410 antimony oxide Inorganic materials 0.000 abstract 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical class [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 abstract 1
230000009257 reactivity Effects 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Compositions Of Macromolecular Compounds (AREA)
Silicon Polymers (AREA)
Macromonomer-Based Addition Polymer (AREA)
Paints Or Removers (AREA)
Adhesives Or Adhesive Processes (AREA)

AT03705204T 2002-02-28 2003-02-14 Silikonharz-zusammensetzung, härtbare harz- zusammensetzung und gehärtetes harz ATE409208T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002054544A JP4050070B2 (ja)	2002-02-28	2002-02-28	シリコーンレジン組成物、硬化性樹脂組成物、および硬化物

Publications (1)

Publication Number	Publication Date
ATE409208T1 true ATE409208T1 (de)	2008-10-15

Family

ID=27764403

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT03705204T ATE409208T1 (de)	2002-02-28	2003-02-14	Silikonharz-zusammensetzung, härtbare harz- zusammensetzung und gehärtetes harz

Country Status (7)

Country	Link
US (1)	US7138467B2 (de)
EP (1)	EP1478695B1 (de)
JP (1)	JP4050070B2 (de)
AT (1)	ATE409208T1 (de)
AU (1)	AU2003208009A1 (de)
DE (1)	DE60323730D1 (de)
WO (1)	WO2003072656A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US10167418B2 (en)	2014-06-20	2019-01-01	Dow Corning Co., Ltd.	Hot melt silicone and curable hot melt composition

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI345576B (en)	2003-11-07	2011-07-21	Dow Corning Toray Silicone	Curable silicone composition and cured product thereof
PL1716201T3 (pl) *	2004-02-18	2017-08-31	Huntsman Advanced Materials Licensing (Switzerland) Gmbh	Kompozycja obniżająca palność z zastosowaniem siloksanów
JP2006188593A (ja) *	2005-01-05	2006-07-20	Dow Corning Toray Co Ltd	シリコーンレジン組成物、硬化性樹脂組成物、および硬化樹脂
JP4931350B2 (ja)	2005-01-05	2012-05-16	東レ・ダウコーニング株式会社	複合シリコーンゴム粉末、その製造方法、塗料、および化粧料
JP4042993B2 (ja) *	2005-03-09	2008-02-06	パイオニア株式会社	光検出半導体装置の製造方法
JP5004433B2 (ja) *	2005-04-27	2012-08-22	東レ・ダウコーニング株式会社	硬化性シリコーン組成物およびその硬化物
JP4931366B2 (ja) *	2005-04-27	2012-05-16	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品
JP4818646B2 (ja) *	2005-06-10	2011-11-16	東レ・ダウコーニング株式会社	シリコーンレジンの精製方法
JP5200386B2 (ja) *	2006-02-16	2013-06-05	東レ株式会社	電子材料用接着剤シート
US20080058460A1 (en) *	2006-09-05	2008-03-06	Dow Corning Corporation	Silicone hot melt additive for thermoplastics
JP5285846B2 (ja) *	2006-09-11	2013-09-11	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品
JP5306592B2 (ja) *	2006-12-04	2013-10-02	東レ・ダウコーニング株式会社	硬化性エポキシ樹脂組成物、硬化物、およびその用途
JP5171063B2 (ja) *	2007-02-23	2013-03-27	東レ・ダウコーニング株式会社	オルガノポリシロキサン樹脂の製造方法およびそのオルガノポリシロキサン樹脂からなるシリコーン系難燃剤
JP5547369B2 (ja) *	2007-09-28	2014-07-09	東レ・ダウコーニング株式会社	硬化性液状エポキシ樹脂組成物およびその硬化物
KR100918354B1 (ko) *	2007-11-22	2009-09-22	제일모직주식회사	신뢰성이 개선된 이방 도전성 필름용 조성물
WO2009075191A1 (ja) *	2007-12-12	2009-06-18	Dow Corning Toray Co., Ltd.	熱可塑性難燃樹脂組成物、該樹脂組成物からなる難燃繊維およびその製造方法、並びに熱可塑性樹脂用シリコーン系難燃剤およびその製造方法
JP2012116890A (ja) *	2010-11-29	2012-06-21	Hitachi Chemical Co Ltd	難燃性樹脂組成物並びにこれを用いたプリプレグ及び積層板
CN104487517B (zh) *	2012-07-27	2017-06-13	Lg化学株式会社	可固化组合物
JP5855552B2 (ja) *	2012-10-15	2016-02-09	信越化学工業株式会社	ポリオルガノシロキサンの製造方法
US9663664B2 (en) *	2013-02-27	2017-05-30	Asahi Rubber Inc.	Ink for white reflective film, powder coating material for white reflective film, production method of white reflective film, white reflective film, light source mount, and lighting device shade

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0620242B1 (de) *	1993-04-15	1998-08-19	Dow Corning Toray Silicone Company, Limited	Epoxygruppen enthaltendes Siliconharz und Massen auf seiner Basis
US5952439A (en) *	1993-04-15	1999-09-14	Dow Corning Toray Silicone Co., Ltd.	Epoxy group-containing silicone resin and compositions based thereon
JP3339910B2 (ja)	1993-04-15	2002-10-28	東レ・ダウコーニング・シリコーン株式会社	硬化性樹脂組成物
JPH08113696A (ja) *	1994-10-14	1996-05-07	Toray Dow Corning Silicone Co Ltd	粉体塗料用樹脂組成物
JP3592825B2 (ja) *	1996-02-07	2004-11-24	東レ・ダウコーニング・シリコーン株式会社	硬化性エポキシ樹脂組成物および電子部品
JP3614311B2 (ja)	1997-11-19	2005-01-26	信越化学工業株式会社	難燃性樹脂組成物
JP3388536B2 (ja)	1998-05-12	2003-03-24	信越化学工業株式会社	半導体封止用エポキシ樹脂組成物及び半導体装置

2002
- 2002-02-28 JP JP2002054544A patent/JP4050070B2/ja not_active Expired - Lifetime
2003
- 2003-02-14 AU AU2003208009A patent/AU2003208009A1/en not_active Abandoned
- 2003-02-14 US US10/504,338 patent/US7138467B2/en not_active Expired - Lifetime
- 2003-02-14 AT AT03705204T patent/ATE409208T1/de not_active IP Right Cessation
- 2003-02-14 EP EP03705204A patent/EP1478695B1/de not_active Expired - Lifetime
- 2003-02-14 WO PCT/JP2003/001608 patent/WO2003072656A1/en not_active Ceased
- 2003-02-14 DE DE60323730T patent/DE60323730D1/de not_active Expired - Lifetime

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US10167418B2 (en)	2014-06-20	2019-01-01	Dow Corning Co., Ltd.	Hot melt silicone and curable hot melt composition

Also Published As

Publication number	Publication date
JP2003253122A (ja)	2003-09-10
AU2003208009A1 (en)	2003-09-09
US7138467B2 (en)	2006-11-21
WO2003072656A1 (en)	2003-09-04
DE60323730D1 (de)	2008-11-06
JP4050070B2 (ja)	2008-02-20
EP1478695A1 (de)	2004-11-24
US20050080204A1 (en)	2005-04-14
EP1478695B1 (de)	2008-09-24

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Legal Events

Date	Code	Title	Description
2009-03-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties