ATE409543T1 - Laserbearbeitungseinrichtung und -verfahren unter verwendung eines polygonalischen spiegels mit simultan ablenkenden polygonfacetten - Google Patents

Laserbearbeitungseinrichtung und -verfahren unter verwendung eines polygonalischen spiegels mit simultan ablenkenden polygonfacetten

Info

Publication number
ATE409543T1
ATE409543T1 AT04027050T AT04027050T ATE409543T1 AT E409543 T1 ATE409543 T1 AT E409543T1 AT 04027050 T AT04027050 T AT 04027050T AT 04027050 T AT04027050 T AT 04027050T AT E409543 T1 ATE409543 T1 AT E409543T1
Authority
AT
Austria
Prior art keywords
laser beam
polygon mirror
processing apparatus
laser
reflection planes
Prior art date
Application number
AT04027050T
Other languages
English (en)
Inventor
You-Hie Han
Eun-Jeong Hong
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE409543T1 publication Critical patent/ATE409543T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
AT04027050T 2004-08-18 2004-11-13 Laserbearbeitungseinrichtung und -verfahren unter verwendung eines polygonalischen spiegels mit simultan ablenkenden polygonfacetten ATE409543T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040065066A KR100462359B1 (ko) 2004-08-18 2004-08-18 폴리곤 미러를 이용한 레이저 가공장치 및 방법

Publications (1)

Publication Number Publication Date
ATE409543T1 true ATE409543T1 (de) 2008-10-15

Family

ID=36079712

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04027050T ATE409543T1 (de) 2004-08-18 2004-11-13 Laserbearbeitungseinrichtung und -verfahren unter verwendung eines polygonalischen spiegels mit simultan ablenkenden polygonfacetten

Country Status (11)

Country Link
US (1) US7164519B2 (de)
EP (1) EP1629932B1 (de)
JP (1) JP4027930B2 (de)
KR (1) KR100462359B1 (de)
CN (1) CN100531999C (de)
AT (1) ATE409543T1 (de)
CA (1) CA2487121A1 (de)
DE (1) DE602004016844D1 (de)
MY (1) MY140212A (de)
SG (1) SG120207A1 (de)
TW (1) TWI273753B (de)

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JP4938339B2 (ja) * 2006-04-04 2012-05-23 株式会社ディスコ レーザー加工装置
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
KR20080028559A (ko) * 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
KR20080079828A (ko) * 2007-02-28 2008-09-02 주식회사 이오테크닉스 레이저 가공 장치 및 방법
KR101010601B1 (ko) 2008-07-31 2011-01-24 주식회사 이오테크닉스 보조 가스를 이용한 레이저 가공 방법
JP5382502B2 (ja) * 2009-01-23 2014-01-08 富士電機株式会社 薄膜太陽電池のレーザ加工装置および加工方法
KR100984727B1 (ko) * 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치
JP5906115B2 (ja) * 2012-03-29 2016-04-20 川崎重工業株式会社 光走査装置及びレーザ加工装置
US20130273717A1 (en) * 2012-04-17 2013-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and Method for the Singulation of a Semiconductor Wafer
JP5970680B2 (ja) * 2012-11-19 2016-08-17 アピックヤマダ株式会社 樹脂モールド品の製造方法、および樹脂除去装置
US9931713B2 (en) 2013-03-15 2018-04-03 Electro Scientific Industries, Inc. Laser systems and methods for AOD rout processing
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9855626B2 (en) * 2015-01-29 2018-01-02 Rohr, Inc. Forming a pattern of apertures in an object with a plurality of laser beams
JP7292006B2 (ja) 2015-03-24 2023-06-16 コーニング インコーポレイテッド ディスプレイガラス組成物のレーザ切断及び加工
JP6434360B2 (ja) * 2015-04-27 2018-12-05 株式会社ディスコ レーザー加工装置
JP6923284B2 (ja) * 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
JP7146770B2 (ja) 2016-12-30 2022-10-04 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工装置における光学部品の寿命を延ばすための方法及びシステム
CN110678423B (zh) 2017-03-22 2022-05-13 康宁股份有限公司 分离玻璃板条的方法
CN108387904B (zh) * 2018-03-22 2024-12-17 北京瑞特森传感科技有限公司 一种激光雷达装置
CN108515280A (zh) * 2018-03-29 2018-09-11 大族激光科技产业集团股份有限公司 激光打孔装置及打孔方法
CN109175728B (zh) * 2018-09-30 2021-02-23 大族激光科技产业集团股份有限公司 一种用于激光切割低温共烧陶瓷的装置及方法
CN113825588B (zh) * 2019-05-14 2023-12-22 日本制铁株式会社 槽加工装置以及槽加工方法
US12180111B2 (en) * 2020-03-02 2024-12-31 CONSEJO SUPERIOR DE INVESTIGACIONES CIENTÍFICAS and UNIVERSIDAD DE ZARAGOZA Method for modifying a vitreous material

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Also Published As

Publication number Publication date
CA2487121A1 (en) 2006-02-18
JP4027930B2 (ja) 2007-12-26
EP1629932A1 (de) 2006-03-01
US20060039057A1 (en) 2006-02-23
TWI273753B (en) 2007-02-11
JP2006055908A (ja) 2006-03-02
SG120207A1 (en) 2006-03-28
KR100462359B1 (ko) 2004-12-17
CN1736651A (zh) 2006-02-22
MY140212A (en) 2009-11-30
US7164519B2 (en) 2007-01-16
DE602004016844D1 (de) 2008-11-13
EP1629932B1 (de) 2008-10-01
TW200608657A (en) 2006-03-01
CN100531999C (zh) 2009-08-26

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