ATE409960T1 - Lichtempfangseinrichtung - Google Patents

Lichtempfangseinrichtung

Info

Publication number
ATE409960T1
ATE409960T1 AT05790435T AT05790435T ATE409960T1 AT E409960 T1 ATE409960 T1 AT E409960T1 AT 05790435 T AT05790435 T AT 05790435T AT 05790435 T AT05790435 T AT 05790435T AT E409960 T1 ATE409960 T1 AT E409960T1
Authority
AT
Austria
Prior art keywords
light
receiving device
substrate
light receiving
receiving element
Prior art date
Application number
AT05790435T
Other languages
English (en)
Inventor
Junya Kusunoki
Takashi Hirano
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Application granted granted Critical
Publication of ATE409960T1 publication Critical patent/ATE409960T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Measuring Fluid Pressure (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
AT05790435T 2004-10-13 2005-10-05 Lichtempfangseinrichtung ATE409960T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004298670 2004-10-13
JP2005252886 2005-08-31

Publications (1)

Publication Number Publication Date
ATE409960T1 true ATE409960T1 (de) 2008-10-15

Family

ID=36148281

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05790435T ATE409960T1 (de) 2004-10-13 2005-10-05 Lichtempfangseinrichtung

Country Status (8)

Country Link
US (1) US20090008682A1 (de)
EP (1) EP1804296B1 (de)
JP (2) JP4760713B2 (de)
KR (1) KR100892204B1 (de)
AT (1) ATE409960T1 (de)
DE (1) DE602005010107D1 (de)
TW (1) TWI483389B (de)
WO (1) WO2006040986A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311454A (ja) * 2006-05-17 2007-11-29 Sony Corp 固体撮像装置
US9034729B2 (en) * 2006-08-25 2015-05-19 Semiconductor Components Industries, Llc Semiconductor device and method of manufacturing the same
US8653612B2 (en) 2006-08-25 2014-02-18 Sanyo Semiconductor Co., Ltd. Semiconductor device
JPWO2008023826A1 (ja) * 2006-08-25 2010-01-14 三洋電機株式会社 半導体装置及びその製造方法
DE102007001518B4 (de) * 2007-01-10 2016-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Häusen eines mikromechanischen oder mikrooptoelektronischen Systems
JP2008235490A (ja) * 2007-03-19 2008-10-02 Sumitomo Bakelite Co Ltd 中空構造体の製造方法および中空構造体
JP5338663B2 (ja) * 2007-06-19 2013-11-13 住友ベークライト株式会社 電子装置の製造方法
US20100193122A1 (en) * 2007-06-19 2010-08-05 Sumitomo Bakelite Co., Ltd. Process for manufacturing electronic device
JP5088373B2 (ja) * 2007-08-10 2012-12-05 株式会社村田製作所 電子部品の製造方法
JP5656349B2 (ja) * 2007-09-20 2015-01-21 プロメラス， エルエルシー チップを積層するために、そしてチップ及びウェハを接合させるために有用な方法及び材料
JP5344336B2 (ja) * 2008-02-27 2013-11-20 株式会社ザイキューブ 半導体装置
US20120187553A1 (en) * 2009-09-09 2012-07-26 Sumitomo Bakelite Company Limited Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor device
US20130061925A1 (en) * 2010-05-17 2013-03-14 Nippon Kayaku Kabushiki Kaisha Photoelectric Conversion Element Using Thermosetting Sealing Agent For Photoelectric Conversion Element
CN103201845A (zh) * 2010-09-22 2013-07-10 道康宁公司 电子制品及形成方法
JP5634380B2 (ja) * 2011-10-31 2014-12-03 アオイ電子株式会社 受光装置およびその製造方法
JP6138828B2 (ja) * 2012-01-16 2017-05-31 プロメラス， エルエルシー マイクロ電子及び光電子デバイス並びにそのアセンブリ用の熱酸化安定性の側鎖ポリエーテル官能化ポリノルボルネン
CN104081526B (zh) * 2012-01-25 2017-04-05 索尼公司 光电转换器件、制造光电转换器件的方法、固态成像装置和电子设备
TWI678387B (zh) * 2014-08-26 2019-12-01 日商琳得科股份有限公司 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999001519A1 (fr) * 1997-07-04 1999-01-14 Nippon Zeon Co., Ltd. Adhesif pour composants semi-conducteurs
DE19942470B4 (de) * 1998-09-08 2013-04-11 Fujitsu Ltd. Optisches Halbeitermodul und Verfahren zum Herstellen eines optischen Halbleitermoduls
US6335479B1 (en) * 1998-10-13 2002-01-01 Dai Nippon Printing Co., Ltd. Protective sheet for solar battery module, method of fabricating the same and solar battery module
US6706975B2 (en) * 2000-07-13 2004-03-16 Ngk Spark Plug Co., Ltd. Paste for filling throughhole and printed wiring board using same
TW499460B (en) * 2000-10-06 2002-08-21 Ind Tech Res Inst Resin composition with excellent dielectric property
JP3839271B2 (ja) * 2001-05-01 2006-11-01 富士写真フイルム株式会社 固体撮像装置及びその製造方法
JP2003147321A (ja) * 2001-11-09 2003-05-21 Fujitsu Ltd 接着剤
US20050203239A1 (en) * 2002-06-20 2005-09-15 Sumio Shibahara Transparent composite composition
US6744109B2 (en) * 2002-06-26 2004-06-01 Agilent Technologies, Inc. Glass attachment over micro-lens arrays
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
JP5030360B2 (ja) * 2002-12-25 2012-09-19 オリンパス株式会社 固体撮像装置の製造方法
JP2004277726A (ja) * 2003-02-27 2004-10-07 Sumitomo Bakelite Co Ltd 樹脂組成物および樹脂組成物の製造方法
KR20060059873A (ko) * 2003-08-22 2006-06-02 코니카 미놀타 옵토 인코포레이티드 고체 촬상 장치 및 상기 고체 촬상 장치를 구비한 촬상장치 및 고체 촬상 장치의 마이크로렌즈 어레이 제조 방법
US7875686B2 (en) * 2004-08-18 2011-01-25 Promerus Llc Polycycloolefin polymeric compositions for semiconductor applications

Also Published As

Publication number Publication date
KR100892204B1 (ko) 2009-04-07
TWI483389B (zh) 2015-05-01
KR20070067184A (ko) 2007-06-27
TW200709406A (en) 2007-03-01
EP1804296A1 (de) 2007-07-04
EP1804296A4 (de) 2008-02-20
JPWO2006040986A1 (ja) 2008-05-15
JP2011199294A (ja) 2011-10-06
US20090008682A1 (en) 2009-01-08
WO2006040986A1 (ja) 2006-04-20
JP4760713B2 (ja) 2011-08-31
EP1804296B1 (de) 2008-10-01
DE602005010107D1 (de) 2008-11-13

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Legal Events

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