ATE414801T1 - Metallisches material für elektronisches bauteil, elektronisches bauteil, elektronische einrichtung,verfahren zur bearbeitung von metallischem material, verfahren zur herstellung von elektronischem bauteil und elektronisches optisches bauteil - Google Patents

Metallisches material für elektronisches bauteil, elektronisches bauteil, elektronische einrichtung,verfahren zur bearbeitung von metallischem material, verfahren zur herstellung von elektronischem bauteil und elektronisches optisches bauteil

Info

Publication number
ATE414801T1
ATE414801T1 AT03794198T AT03794198T ATE414801T1 AT E414801 T1 ATE414801 T1 AT E414801T1 AT 03794198 T AT03794198 T AT 03794198T AT 03794198 T AT03794198 T AT 03794198T AT E414801 T1 ATE414801 T1 AT E414801T1
Authority
AT
Austria
Prior art keywords
electronic
electronic component
component
metallic material
metallic film
Prior art date
Application number
AT03794198T
Other languages
English (en)
Inventor
Takashi Ueno
Original Assignee
Dept Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=31973037&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE414801(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dept Corp filed Critical Dept Corp
Application granted granted Critical
Publication of ATE414801T1 publication Critical patent/ATE414801T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H10W20/4421—Conductive materials thereof based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H10W20/4424—Copper alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Liquid Crystal (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Led Device Packages (AREA)
  • Adornments (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
AT03794198T 2002-09-04 2003-09-03 Metallisches material für elektronisches bauteil, elektronisches bauteil, elektronische einrichtung,verfahren zur bearbeitung von metallischem material, verfahren zur herstellung von elektronischem bauteil und elektronisches optisches bauteil ATE414801T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002258690A JP3754011B2 (ja) 2002-09-04 2002-09-04 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品

Publications (1)

Publication Number Publication Date
ATE414801T1 true ATE414801T1 (de) 2008-12-15

Family

ID=31973037

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03794198T ATE414801T1 (de) 2002-09-04 2003-09-03 Metallisches material für elektronisches bauteil, elektronisches bauteil, elektronische einrichtung,verfahren zur bearbeitung von metallischem material, verfahren zur herstellung von elektronischem bauteil und elektronisches optisches bauteil

Country Status (10)

Country Link
US (1) US20040187984A1 (de)
EP (4) EP1559801B1 (de)
JP (1) JP3754011B2 (de)
KR (1) KR100673401B1 (de)
CN (1) CN1318626C (de)
AT (1) ATE414801T1 (de)
CA (3) CA2669987A1 (de)
DE (1) DE60324830D1 (de)
TW (1) TWI253475B (de)
WO (1) WO2004022803A1 (de)

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US7782413B2 (en) 2007-05-09 2010-08-24 Tohoku University Liquid crystal display device and manufacturing method therefor
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JP4913902B2 (ja) * 2008-08-05 2012-04-11 古河電気工業株式会社 電気・電子部品用銅合金材料の製造方法
JP5571887B2 (ja) 2008-08-19 2014-08-13 アルティアム サービシズ リミテッド エルエルシー 液晶表示装置及びその製造方法
US8790549B2 (en) 2009-04-10 2014-07-29 Hitachi, Ltd. Electronic component provided with Cu—Al—Co-based alloy electrode or wiring
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DE102009038589B4 (de) * 2009-08-26 2014-11-20 Heraeus Materials Technology Gmbh & Co. Kg TFT-Struktur mit Cu-Elektroden
US8895978B2 (en) 2010-07-02 2014-11-25 Advanced Interconnect Materials, Llc Semiconductor device
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CN103237910B (zh) * 2010-10-13 2015-06-24 大连理工大学 低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺
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CN102021358A (zh) * 2010-12-31 2011-04-20 黄曦 铜合金材料
US9393263B2 (en) 2011-06-03 2016-07-19 Allergan, Inc. Dermal filler compositions including antioxidants
CN102978431B (zh) * 2012-11-07 2014-07-30 江苏金源锻造股份有限公司 一种用于引线支架的铜铁合金的制造方法
CN102978432B (zh) * 2012-11-07 2014-12-10 江苏金源锻造股份有限公司 一种用于半导体器件的引线支架
CN102978429B (zh) * 2012-11-07 2014-12-10 江苏金源锻造股份有限公司 一种制造支架的铜合金
EP2941105B1 (de) * 2013-05-13 2022-02-16 ULVAC, Inc. Montagevorrichtung und herstellungsverfahren des gleichen
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KR20170116499A (ko) * 2016-04-11 2017-10-19 삼성전기주식회사 인덕터 제조방법 및 인덕터
CN110392909A (zh) 2017-04-13 2019-10-29 株式会社爱发科 液晶显示装置、有机el显示装置、半导体元件、布线膜、布线基板、靶材
JP6762333B2 (ja) * 2018-03-26 2020-09-30 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金条
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CN112616260B (zh) * 2020-11-30 2022-02-15 湖北中培电子科技有限公司 一种促使金属蚀刻且分离无效粒子的蚀刻夹持装置
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Also Published As

Publication number Publication date
DE60324830D1 (de) 2009-01-02
US20040187984A1 (en) 2004-09-30
EP1559801A4 (de) 2005-11-30
JP3754011B2 (ja) 2006-03-08
EP1559801A1 (de) 2005-08-03
KR20050083668A (ko) 2005-08-26
WO2004022803A1 (ja) 2004-03-18
CN1318626C (zh) 2007-05-30
EP1559801B1 (de) 2008-11-19
CA2497395A1 (en) 2004-03-18
CA2670068A1 (en) 2004-03-18
EP1956104A1 (de) 2008-08-13
JP2004091907A (ja) 2004-03-25
TWI253475B (en) 2006-04-21
EP1918391A3 (de) 2009-01-07
EP1918391A2 (de) 2008-05-07
EP1953250A1 (de) 2008-08-06
TW200404905A (en) 2004-04-01
CA2669987A1 (en) 2004-03-18
KR100673401B1 (ko) 2007-01-24
CN1678765A (zh) 2005-10-05

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