ATE416236T1 - Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie - Google Patents

Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie

Info

Publication number: ATE416236T1
Authority: AT; Austria
Prior art keywords: resin; conductive; binder; film; silver
Prior art date: 2002-04-10

Application number

AT03720898T

Other languages

English (en)

Inventor

Katsuhiko Takahashi

Kiwako Ohmori

Masanori Endo

Hikaru Yasuhara

Takayuki Imai

Akinobu Ono

Toshiyuki Honda

Koji Okamoto

Masafumi Ito

Original Assignee

Fujikura Ltd

Fujikura Kasei Kk

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-04-10

Filing date

2003-04-09

Publication date

2008-12-15

2003-04-09 Application filed by Fujikura Ltd, Fujikura Kasei Kk filed Critical Fujikura Ltd

2008-12-15 Application granted granted Critical

2008-12-15 Publication of ATE416236T1 publication Critical patent/ATE416236T1/de

Links

239000000203 mixture Substances 0.000 title abstract 3
238000004519 manufacturing process Methods 0.000 title 1
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 3
239000011230 binding agent Substances 0.000 abstract 3
MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract 3
229940100890 silver compound Drugs 0.000 abstract 3
150000003379 silver compounds Chemical class 0.000 abstract 3
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
239000003638 chemical reducing agent Substances 0.000 abstract 2
239000002245 particle Substances 0.000 abstract 2
-1 phenol compound Chemical class 0.000 abstract 2
229920005989 resin Polymers 0.000 abstract 2
239000011347 resin Substances 0.000 abstract 2
NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 abstract 2
ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 abstract 1
JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 abstract 1
229920000180 alkyd Polymers 0.000 abstract 1
239000003973 paint Substances 0.000 abstract 1
239000005011 phenolic resin Substances 0.000 abstract 1
229920001225 polyester resin Polymers 0.000 abstract 1
239000004645 polyester resin Substances 0.000 abstract 1
229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
239000005020 polyethylene terephthalate Substances 0.000 abstract 1
239000000843 powder Substances 0.000 abstract 1
229910052709 silver Inorganic materials 0.000 abstract 1
239000004332 silver Substances 0.000 abstract 1
LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 abstract 1
229910001958 silver carbonate Inorganic materials 0.000 abstract 1
229910001923 silver oxide Inorganic materials 0.000 abstract 1
229920005992 thermoplastic resin Polymers 0.000 abstract 1
229920001187 thermosetting polymer Polymers 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2286—Oxides; Hydroxides of metals of silver
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Dispersion Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Life Sciences & Earth Sciences (AREA)
Materials Engineering (AREA)
Wood Science & Technology (AREA)
Spectroscopy & Molecular Physics (AREA)
Physics & Mathematics (AREA)
Microelectronics & Electronic Packaging (AREA)
Conductive Materials (AREA)
Paints Or Removers (AREA)
Compositions Of Macromolecular Compounds (AREA)
Non-Insulated Conductors (AREA)
Manufacturing Of Electric Cables (AREA)
Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)
Laminated Bodies (AREA)

AT03720898T 2002-04-10 2003-04-09 Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie ATE416236T1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002108178		2002-04-10

Publications (1)

Publication Number	Publication Date
ATE416236T1 true ATE416236T1 (de)	2008-12-15

Family

ID=28786504

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
AT08157328T ATE463538T1 (de)	2002-04-10	2003-04-09	Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe
AT03720898T ATE416236T1 (de)	2002-04-10	2003-04-09	Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
AT08157328T ATE463538T1 (de)	2002-04-10	2003-04-09	Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe

Country Status (9)

Country	Link
US (1)	US7771627B2 (de)
EP (2)	EP1493780B1 (de)
JP (1)	JP3949658B2 (de)
KR (1)	KR100664718B1 (de)
CN (1)	CN100396730C (de)
AT (2)	ATE463538T1 (de)
DE (2)	DE60332065D1 (de)
TW (1)	TWI251018B (de)
WO (1)	WO2003085052A1 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1007308B1 (de)	1997-02-24	2003-11-12	Superior Micropowders LLC	Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte
JP2005015289A (ja) *	2003-06-27	2005-01-20	Mitsui Mining & Smelting Co Ltd	微粒酸化銀粉懸濁液及びその微粒酸化銀粉懸濁液の製造方法
US7533361B2 (en)	2005-01-14	2009-05-12	Cabot Corporation	System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US8167393B2 (en)	2005-01-14	2012-05-01	Cabot Corporation	Printable electronic features on non-uniform substrate and processes for making same
WO2006076606A2 (en)	2005-01-14	2006-07-20	Cabot Corporation	Optimized multi-layer printing of electronics and displays
US8383014B2 (en)	2010-06-15	2013-02-26	Cabot Corporation	Metal nanoparticle compositions
WO2006076612A2 (en)	2005-01-14	2006-07-20	Cabot Corporation	A process for manufacturing application specific printable circuits (aspc’s) and other custom electronic devices
US7824466B2 (en)	2005-01-14	2010-11-02	Cabot Corporation	Production of metal nanoparticles
DE102006017696A1 (de)	2006-04-15	2007-10-18	Bayer Technology Services Gmbh	Verfahren zur Herstellung von Metallpartikeln, hieraus hergestellte Metallpartikel und deren Verwendung
US20090263623A1 (en) *	2006-05-17	2009-10-22	Beijing Zbsd Patent & Trademark Agent Ltd.	Scribbling substrate
KR101394704B1 (ko)	2006-06-30	2014-05-16	미쓰비시 마테리알 가부시키가이샤	태양 전지의 전극 형성용 조성물 및 그 전극의 형성 방법, 그리고 그 형성 방법에 의해 얻어진 전극을 사용한 태양 전지
JP5309521B2 (ja)	2006-10-11	2013-10-09	三菱マテリアル株式会社	電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
DE102007037079A1 (de)	2006-10-25	2008-04-30	Bayer Materialscience Ag	Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
JP4895994B2 (ja)	2006-12-28	2012-03-14	株式会社日立製作所	金属粒子を用いた接合方法及び接合材料
JP5169389B2 (ja)	2007-04-19	2013-03-27	三菱マテリアル株式会社	導電性反射膜の製造方法
CN101911219B (zh)	2008-01-17	2015-12-16	日亚化学工业株式会社	导电性材料及其制造方法、电子设备、发光装置及其制造方法
DE102008014690A1 (de) *	2008-03-18	2009-09-24	Conti Temic Microelectronic Gmbh	Verfahren zur Herstellung von Schaltungsträgern
JP5053925B2 (ja) *	2008-05-07	2012-10-24	Ｄｏｗａハイテック株式会社	酸化銀粉末
JP5544774B2 (ja) *	2008-08-27	2014-07-09	三菱マテリアル株式会社	多接合型太陽電池
WO2010023920A1 (ja) *	2008-08-27	2010-03-04	三菱マテリアル株式会社	太陽電池用透明導電膜及びその透明導電膜用組成物、多接合型太陽電池
JP5778382B2 (ja) *	2008-10-22	2015-09-16	東ソー株式会社	金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法
JP5611537B2 (ja) *	2009-04-28	2014-10-22	日立化成株式会社	導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置
US9011728B2 (en) *	2009-07-21	2015-04-21	Nichia Corporation	Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
WO2011024534A1 (ja) *	2009-08-27	2011-03-03	独立行政法人産業技術総合研究所	多接合光電変換装置、集積型多接合光電変換装置、並びにその製造方法
WO2011085235A1 (en)	2010-01-08	2011-07-14	Abs Materials, Inc.	Porous, swellable, sol-gel derived sensor material and method for using same
US20130012379A1 (en)	2010-01-08	2013-01-10	Abs Materials, Inc.	Modified sol-gel derived sorbent material and method for using the same
WO2011100532A1 (en)	2010-02-12	2011-08-18	Abs Materials, Inc.	Sol-gel derived sorbent material containing a sorbate interactive material and method for using the same
WO2011162836A1 (en)	2010-02-17	2011-12-29	Abs Materials, Inc	Method for extracting a metal particulate from an aqueous solution using a sol-gel derived sorbent
EP2369597B1 (de)	2010-03-12	2014-06-25	Clariant International AG	Herstellung leitfähiger Oberflächenbeschichtungen mit Dispersion mit elektrostatisch stabilisierten Silbernanopartikeln
CN101800090B (zh) *	2010-03-16	2011-08-17	彩虹集团公司	一种环保型导电浆料及其制备方法
WO2011156663A1 (en)	2010-06-10	2011-12-15	Abs Materials,Inc	Method of treating a material using a sol-gel derived composition
EP2431438B1 (de) *	2010-09-20	2012-11-28	Henkel AG & Co. KGaA	Elektrisch leitfähiger Klebstoff
CN102020762B (zh) *	2010-10-20	2012-07-25	东华大学	一种新型含银pet基复合材料及其原位组装制备方法和应用
EP2468826A1 (de)	2010-12-21	2012-06-27	Bayer MaterialScience AG	Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion
JP2012151093A (ja) *	2010-12-28	2012-08-09	Tosoh Corp	銅含有組成物、金属銅膜の製造方法、および金属銅膜
CN102270514A (zh) *	2011-05-03	2011-12-07	华中科技大学	一种均相导电浆料
KR101884279B1 (ko) *	2011-07-08	2018-08-01	삼성전자주식회사	비전도성 조성물이 코팅된 모재 및 그의 코팅 방법
KR101276671B1 (ko) *	2011-09-06	2013-06-19	주식회사 케이씨씨	수분산 비히클을 포함하는 태양전지 전면전극용 페이스트 조성물
CN104024351B (zh)	2011-09-06	2016-11-16	汉高知识产权控股有限责任公司	导电金属和方法
DE102011118720A1 (de) *	2011-11-16	2013-05-16	Admedes Schuessler Gmbh	Ethanollöslicher, elektrisch leitender Kleber
US9481804B2 (en) *	2012-04-16	2016-11-01	Osaka Soda Co., Ltd.	Electroconductive ink composition
TW201349254A (zh)	2012-04-17	2013-12-01	Heraeus Precious Metals North America Conshohocken Llc	用於太陽能電池接點的導電厚膜膏
TWI595510B (zh) *	2012-04-17	2017-08-11	賀利氏貴金屬北美康舍霍肯有限責任公司	用於太陽能電池接點之導電厚膜膏的碲無機反應系統
JP5572669B2 (ja) *	2012-06-08	2014-08-13	Ｄｏｗａハイテック株式会社	酸化銀粉末の製造方法
US20140170427A1 (en) *	2012-12-13	2014-06-19	Carestream Health, Inc.	Anticorrosion agents for transparent conductive film
CN103050167A (zh) *	2012-12-19	2013-04-17	青岛菲特电器科技有限公司	一种导电浆
US20140186596A1 (en) *	2012-12-28	2014-07-03	Dip-Tech Ltd.	Ink
EP3033401B1 (de)	2013-08-16	2019-06-05	Henkel IP & Holding GmbH	Tintenzusammensetzungen mit submikronsilberpartikeln, verfahren und anwendungen
WO2016063931A1 (ja) *	2014-10-24	2016-04-28	ナミックス株式会社	導電性組成物及びそれを用いた電子部品
WO2017071949A1 (de)	2015-10-30	2017-05-04	Clariant International Ltd	Metalldispersion mit erhöhter stabilität
KR102524435B1 (ko)	2015-12-23	2023-04-24	헨켈 아게 운트 코. 카게아아	전도성 조성물을 위한 결합제로서의 중합체 에멀젼
WO2021125161A1 (ja) *	2019-12-19	2021-06-24	三菱マテリアル株式会社	銀ペースト及びその製造方法並びに接合体の製造方法
CN111511099B (zh) *	2020-03-25	2021-06-08	上海玖银电子科技有限公司	一种大键盘导电薄膜线路用快干银浆及其制备方法
JP2022032971A (ja) *	2020-08-13	2022-02-25	花王株式会社	金属ペースト
CN117198591B (zh) *	2023-09-14	2025-09-23	苏州市贝特利高分子材料股份有限公司	高抗氧化性异质结银包铜浆料
CN117352207A (zh) *	2023-10-10	2024-01-05	苏州市贝特利高分子材料股份有限公司	低银含异质结银包铜浆料及其制备方法
CN121075726B (zh) *	2025-11-07	2026-05-12	深圳芯源新材料有限公司	一种增强温度循环抗性的低温固化浆料及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4049844A (en) *	1974-09-27	1977-09-20	General Electric Company	Method for making a circuit board and article made thereby
US4330821A (en)	1980-05-09	1982-05-18	Gte Products Corporation	Radiation switch for photoflash unit
JPS5719903A (en)	1980-07-11	1982-02-02	Alps Electric Co Ltd	Conductive paste
JPS6015474A (ja) *	1983-07-06	1985-01-26	Sekisui Chem Co Ltd	導電性塗料組成物
US4564563A (en) *	1983-09-30	1986-01-14	Electro Materials Corp. Of America	Solderable conductor
JPS6088027A (ja) *	1983-10-20	1985-05-17	Toyobo Co Ltd	導電性樹脂組成物
JPH07118217B2 (ja) *	1986-09-29	1995-12-18	大塚化学株式会社	導電性組成物
US4877512A (en) *	1988-08-31	1989-10-31	Advanced Products, Inc.	Silver/silver chloride compositions
US5098771A (en) *	1989-07-27	1992-03-24	Hyperion Catalysis International	Conductive coatings and inks
JPH0431463A (ja)	1990-05-25	1992-02-03	Asahi Chem Ind Co Ltd	電気回路材料
JPH0613756A (ja)	1992-06-25	1994-01-21	Matsushita Electric Ind Co Ltd	導体ペースト組成物
JP3015621B2 (ja) *	1993-05-10	2000-03-06	松下電器産業株式会社	導体ペ−スト組成物
US5391604A (en) *	1993-07-30	1995-02-21	Diemat, Inc.	Adhesive paste containing polymeric resin
US5882722A (en) *	1995-07-12	1999-03-16	Partnerships Limited, Inc.	Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
JPH10106350A (ja)	1996-09-30	1998-04-24	Tanaka Kikinzoku Kogyo Kk	銀系導体ペースト
JP3634521B2 (ja) *	1996-10-02	2005-03-30	東海電化工業株式会社	半導電性ポリエステル樹脂製シームレスベルト
JPH11172108A (ja) *	1997-12-12	1999-06-29	Shin Etsu Chem Co Ltd	導電性フッ素樹脂組成物
FR2773423B1 (fr) *	1998-01-06	2001-10-19	Alsthom Cge Alkatel	Procede et systeme de linearisation numerique d'un amplificateur
US6236837B1 (en) *	1998-07-30	2001-05-22	Motorola, Inc.	Polynomial Predistortion linearizing device, method, phone and base station
US20030148024A1 (en) *	2001-10-05	2003-08-07	Kodas Toivo T.	Low viscosity precursor compositons and methods for the depositon of conductive electronic features
KR100369565B1 (ko) *	1999-12-17	2003-01-29	대주정밀화학 주식회사	전기발열체용 저항 페이스트 조성물
JP4739495B2 (ja)	2000-10-10	2011-08-03	ナミックス株式会社	金属ペースト
US6951666B2 (en) *	2001-10-05	2005-10-04	Cabot Corporation	Precursor compositions for the deposition of electrically conductive features
US7211205B2 (en) *	2003-01-29	2007-05-01	Parelec, Inc.	High conductivity inks with improved adhesion
US7141185B2 (en) *	2003-01-29	2006-11-28	Parelec, Inc.	High conductivity inks with low minimum curing temperatures

2003
- 2003-04-07 TW TW092107916A patent/TWI251018B/zh not_active IP Right Cessation
- 2003-04-09 DE DE60332065T patent/DE60332065D1/de not_active Expired - Lifetime
- 2003-04-09 US US10/510,512 patent/US7771627B2/en not_active Expired - Lifetime
- 2003-04-09 AT AT08157328T patent/ATE463538T1/de not_active IP Right Cessation
- 2003-04-09 EP EP03720898A patent/EP1493780B1/de not_active Expired - Lifetime
- 2003-04-09 KR KR1020047015902A patent/KR100664718B1/ko not_active Expired - Fee Related
- 2003-04-09 EP EP08157328A patent/EP1972660B1/de not_active Expired - Lifetime
- 2003-04-09 AT AT03720898T patent/ATE416236T1/de not_active IP Right Cessation
- 2003-04-09 CN CNB038077884A patent/CN100396730C/zh not_active Expired - Lifetime
- 2003-04-09 WO PCT/JP2003/004514 patent/WO2003085052A1/ja not_active Ceased
- 2003-04-09 JP JP2003582235A patent/JP3949658B2/ja not_active Expired - Lifetime
- 2003-04-09 DE DE60325033T patent/DE60325033D1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
ATE463538T1 (de)	2010-04-15
JP3949658B2 (ja)	2007-07-25
DE60332065D1 (de)	2010-05-20
EP1972660B1 (de)	2010-04-07
TWI251018B (en)	2006-03-11
KR20040107491A (ko)	2004-12-20
TW200305619A (en)	2003-11-01
CN100396730C (zh)	2008-06-25
US7771627B2 (en)	2010-08-10
JPWO2003085052A1 (ja)	2005-08-11
KR100664718B1 (ko)	2007-01-03
EP1493780B1 (de)	2008-12-03
EP1972660A1 (de)	2008-09-24
DE60325033D1 (de)	2009-01-15
US20050116203A1 (en)	2005-06-02
CN1646633A (zh)	2005-07-27
EP1493780A1 (de)	2005-01-05
EP1493780A4 (de)	2006-02-01
WO2003085052A1 (en)	2003-10-16

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2009-06-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

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