ATE416236T1 - Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie - Google Patents
Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folieInfo
- Publication number
- ATE416236T1 ATE416236T1 AT03720898T AT03720898T ATE416236T1 AT E416236 T1 ATE416236 T1 AT E416236T1 AT 03720898 T AT03720898 T AT 03720898T AT 03720898 T AT03720898 T AT 03720898T AT E416236 T1 ATE416236 T1 AT E416236T1
- Authority
- AT
- Austria
- Prior art keywords
- resin
- conductive
- binder
- film
- silver
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 3
- 239000011230 binding agent Substances 0.000 abstract 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract 3
- 229940100890 silver compound Drugs 0.000 abstract 3
- 150000003379 silver compounds Chemical class 0.000 abstract 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- -1 phenol compound Chemical class 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 abstract 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 abstract 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 abstract 1
- 229920000180 alkyd Polymers 0.000 abstract 1
- 239000003973 paint Substances 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 abstract 1
- 229910001958 silver carbonate Inorganic materials 0.000 abstract 1
- 229910001923 silver oxide Inorganic materials 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2286—Oxides; Hydroxides of metals of silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002108178 | 2002-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE416236T1 true ATE416236T1 (de) | 2008-12-15 |
Family
ID=28786504
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08157328T ATE463538T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe |
| AT03720898T ATE416236T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung; leitfähige folie und verfahren zur hestellung der folie |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT08157328T ATE463538T1 (de) | 2002-04-10 | 2003-04-09 | Leitfähige zusammensetzung, leitfähige farbe und verfahren zur formung leitfähiger farbe |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7771627B2 (de) |
| EP (2) | EP1972660B1 (de) |
| JP (1) | JP3949658B2 (de) |
| KR (1) | KR100664718B1 (de) |
| CN (1) | CN100396730C (de) |
| AT (2) | ATE463538T1 (de) |
| DE (2) | DE60325033D1 (de) |
| TW (1) | TWI251018B (de) |
| WO (1) | WO2003085052A1 (de) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7625420B1 (en) | 1997-02-24 | 2009-12-01 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
| JP2005015289A (ja) * | 2003-06-27 | 2005-01-20 | Mitsui Mining & Smelting Co Ltd | 微粒酸化銀粉懸濁液及びその微粒酸化銀粉懸濁液の製造方法 |
| TW200640596A (en) | 2005-01-14 | 2006-12-01 | Cabot Corp | Production of metal nanoparticles |
| US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
| US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
| US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
| US7533361B2 (en) | 2005-01-14 | 2009-05-12 | Cabot Corporation | System and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
| US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
| DE102006017696A1 (de) | 2006-04-15 | 2007-10-18 | Bayer Technology Services Gmbh | Verfahren zur Herstellung von Metallpartikeln, hieraus hergestellte Metallpartikel und deren Verwendung |
| US20090263623A1 (en) * | 2006-05-17 | 2009-10-22 | Beijing Zbsd Patent & Trademark Agent Ltd. | Scribbling substrate |
| KR101485304B1 (ko) | 2006-06-30 | 2015-01-23 | 미쓰비시 마테리알 가부시키가이샤 | 태양 전지의 전극 형성용 조성물 및 그 전극의 형성 방법, 그리고 그 형성 방법에 의해 얻어진 전극을 사용한 태양 전지 |
| JP5309521B2 (ja) | 2006-10-11 | 2013-10-09 | 三菱マテリアル株式会社 | 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法 |
| DE102007037079A1 (de) | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
| JP4895994B2 (ja) | 2006-12-28 | 2012-03-14 | 株式会社日立製作所 | 金属粒子を用いた接合方法及び接合材料 |
| JP5169389B2 (ja) | 2007-04-19 | 2013-03-27 | 三菱マテリアル株式会社 | 導電性反射膜の製造方法 |
| US8968608B2 (en) | 2008-01-17 | 2015-03-03 | Nichia Corporation | Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device |
| DE102008014690A1 (de) * | 2008-03-18 | 2009-09-24 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung von Schaltungsträgern |
| JP5053925B2 (ja) * | 2008-05-07 | 2012-10-24 | Dowaハイテック株式会社 | 酸化銀粉末 |
| JP5544774B2 (ja) * | 2008-08-27 | 2014-07-09 | 三菱マテリアル株式会社 | 多接合型太陽電池 |
| WO2010023920A1 (ja) * | 2008-08-27 | 2010-03-04 | 三菱マテリアル株式会社 | 太陽電池用透明導電膜及びその透明導電膜用組成物、多接合型太陽電池 |
| JP5778382B2 (ja) * | 2008-10-22 | 2015-09-16 | 東ソー株式会社 | 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法 |
| JP5611537B2 (ja) * | 2009-04-28 | 2014-10-22 | 日立化成株式会社 | 導電性接合材料、それを用いた接合方法、並びにそれによって接合された半導体装置 |
| JP5673536B2 (ja) * | 2009-07-21 | 2015-02-18 | 日亜化学工業株式会社 | 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、および発光装置 |
| WO2011024534A1 (ja) * | 2009-08-27 | 2011-03-03 | 独立行政法人産業技術総合研究所 | 多接合光電変換装置、集積型多接合光電変換装置、並びにその製造方法 |
| US20130012379A1 (en) | 2010-01-08 | 2013-01-10 | Abs Materials, Inc. | Modified sol-gel derived sorbent material and method for using the same |
| WO2011085235A1 (en) | 2010-01-08 | 2011-07-14 | Abs Materials, Inc. | Porous, swellable, sol-gel derived sensor material and method for using same |
| WO2011100532A1 (en) | 2010-02-12 | 2011-08-18 | Abs Materials, Inc. | Sol-gel derived sorbent material containing a sorbate interactive material and method for using the same |
| WO2011162836A1 (en) | 2010-02-17 | 2011-12-29 | Abs Materials, Inc | Method for extracting a metal particulate from an aqueous solution using a sol-gel derived sorbent |
| PL2369597T3 (pl) | 2010-03-12 | 2015-03-31 | Clariant Int Ag | Wytwarzanie przewodzących powłok powierzchniowych z dyspersji zawierającej elektrostatycznie stabilizowane nanocząstki srebra |
| CN101800090B (zh) * | 2010-03-16 | 2011-08-17 | 彩虹集团公司 | 一种环保型导电浆料及其制备方法 |
| WO2011156663A1 (en) | 2010-06-10 | 2011-12-15 | Abs Materials,Inc | Method of treating a material using a sol-gel derived composition |
| EP2431438B1 (de) | 2010-09-20 | 2012-11-28 | Henkel AG & Co. KGaA | Elektrisch leitfähiger Klebstoff |
| CN102020762B (zh) * | 2010-10-20 | 2012-07-25 | 东华大学 | 一种新型含银pet基复合材料及其原位组装制备方法和应用 |
| EP2468826A1 (de) | 2010-12-21 | 2012-06-27 | Bayer MaterialScience AG | Pickering-Emulsion zur Herstellung elektrisch leitfähiger Beschichtungen und Verfahren zur Herstellung einer Pickering-Emulsion |
| JP2012151093A (ja) * | 2010-12-28 | 2012-08-09 | Tosoh Corp | 銅含有組成物、金属銅膜の製造方法、および金属銅膜 |
| CN102270514A (zh) * | 2011-05-03 | 2011-12-07 | 华中科技大学 | 一种均相导电浆料 |
| KR101884279B1 (ko) * | 2011-07-08 | 2018-08-01 | 삼성전자주식회사 | 비전도성 조성물이 코팅된 모재 및 그의 코팅 방법 |
| JP6138133B2 (ja) | 2011-09-06 | 2017-05-31 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 導電性材料およびプロセス |
| KR101276671B1 (ko) * | 2011-09-06 | 2013-06-19 | 주식회사 케이씨씨 | 수분산 비히클을 포함하는 태양전지 전면전극용 페이스트 조성물 |
| DE102011118720A1 (de) * | 2011-11-16 | 2013-05-16 | Admedes Schuessler Gmbh | Ethanollöslicher, elektrisch leitender Kleber |
| KR102007712B1 (ko) * | 2012-04-16 | 2019-08-06 | 가부시키가이샤 오사카소다 | 도전성 잉크 조성물 |
| ES2703905T3 (es) | 2012-04-17 | 2019-03-13 | Heraeus Precious Metals North America Conshohocken Llc | Pasta para una película gruesa, conductora para contactos de células solares |
| EP2654087B1 (de) * | 2012-04-17 | 2018-02-14 | Heraeus Precious Metals North America Conshohocken LLC | Anorganische telluriumreaktionssysteme für leitfähige dicke filmpaste für solarzellenkontakte |
| JP5572669B2 (ja) * | 2012-06-08 | 2014-08-13 | Dowaハイテック株式会社 | 酸化銀粉末の製造方法 |
| US20140170427A1 (en) * | 2012-12-13 | 2014-06-19 | Carestream Health, Inc. | Anticorrosion agents for transparent conductive film |
| CN103050167A (zh) * | 2012-12-19 | 2013-04-17 | 青岛菲特电器科技有限公司 | 一种导电浆 |
| US20140186596A1 (en) * | 2012-12-28 | 2014-07-03 | Dip-Tech Ltd. | Ink |
| WO2015023370A1 (en) | 2013-08-16 | 2015-02-19 | Henkel IP & Holding GmbH | Submicron silver particle ink compositions, process and applications |
| CN106795375B (zh) * | 2014-10-24 | 2020-08-21 | 纳美仕股份有限公司 | 导电性组合物和使用该导电性组合物的电子部件 |
| EP3368204A1 (de) | 2015-10-30 | 2018-09-05 | Clariant International Ltd | Metalldispersion mit erhöhter stabilität |
| JP6901486B2 (ja) | 2015-12-23 | 2021-07-14 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 伝導性組成物用バインダーとしてのポリマーエマルション |
| CN114829042B (zh) * | 2019-12-19 | 2023-08-04 | 三菱综合材料株式会社 | 银膏及其制造方法以及接合体的制造方法 |
| CN111511099B (zh) * | 2020-03-25 | 2021-06-08 | 上海玖银电子科技有限公司 | 一种大键盘导电薄膜线路用快干银浆及其制备方法 |
| WO2022034755A1 (ja) * | 2020-08-13 | 2022-02-17 | 花王株式会社 | 金属ペースト |
| CN117198591B (zh) * | 2023-09-14 | 2025-09-23 | 苏州市贝特利高分子材料股份有限公司 | 高抗氧化性异质结银包铜浆料 |
| CN117352207A (zh) * | 2023-10-10 | 2024-01-05 | 苏州市贝特利高分子材料股份有限公司 | 低银含异质结银包铜浆料及其制备方法 |
| CN121075726A (zh) * | 2025-11-07 | 2025-12-05 | 深圳芯源新材料有限公司 | 一种增强温度循环抗性的低温固化浆料及其制备方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4049844A (en) * | 1974-09-27 | 1977-09-20 | General Electric Company | Method for making a circuit board and article made thereby |
| US4330821A (en) | 1980-05-09 | 1982-05-18 | Gte Products Corporation | Radiation switch for photoflash unit |
| JPS5719903A (en) | 1980-07-11 | 1982-02-02 | Alps Electric Co Ltd | Conductive paste |
| JPS6015474A (ja) * | 1983-07-06 | 1985-01-26 | Sekisui Chem Co Ltd | 導電性塗料組成物 |
| US4564563A (en) * | 1983-09-30 | 1986-01-14 | Electro Materials Corp. Of America | Solderable conductor |
| JPS6088027A (ja) * | 1983-10-20 | 1985-05-17 | Toyobo Co Ltd | 導電性樹脂組成物 |
| JPH07118217B2 (ja) * | 1986-09-29 | 1995-12-18 | 大塚化学株式会社 | 導電性組成物 |
| US4877512A (en) * | 1988-08-31 | 1989-10-31 | Advanced Products, Inc. | Silver/silver chloride compositions |
| US5098771A (en) * | 1989-07-27 | 1992-03-24 | Hyperion Catalysis International | Conductive coatings and inks |
| JPH0431463A (ja) | 1990-05-25 | 1992-02-03 | Asahi Chem Ind Co Ltd | 電気回路材料 |
| JPH0613756A (ja) | 1992-06-25 | 1994-01-21 | Matsushita Electric Ind Co Ltd | 導体ペースト組成物 |
| JP3015621B2 (ja) * | 1993-05-10 | 2000-03-06 | 松下電器産業株式会社 | 導体ペ−スト組成物 |
| US5391604A (en) * | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
| US5882722A (en) * | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| JPH10106350A (ja) | 1996-09-30 | 1998-04-24 | Tanaka Kikinzoku Kogyo Kk | 銀系導体ペースト |
| JP3634521B2 (ja) * | 1996-10-02 | 2005-03-30 | 東海電化工業株式会社 | 半導電性ポリエステル樹脂製シームレスベルト |
| JPH11172108A (ja) * | 1997-12-12 | 1999-06-29 | Shin Etsu Chem Co Ltd | 導電性フッ素樹脂組成物 |
| FR2773423B1 (fr) * | 1998-01-06 | 2001-10-19 | Alsthom Cge Alkatel | Procede et systeme de linearisation numerique d'un amplificateur |
| US6236837B1 (en) * | 1998-07-30 | 2001-05-22 | Motorola, Inc. | Polynomial Predistortion linearizing device, method, phone and base station |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| KR100369565B1 (ko) * | 1999-12-17 | 2003-01-29 | 대주정밀화학 주식회사 | 전기발열체용 저항 페이스트 조성물 |
| JP4739495B2 (ja) | 2000-10-10 | 2011-08-03 | ナミックス株式会社 | 金属ペースト |
| US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| US7141185B2 (en) * | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
| US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
-
2003
- 2003-04-07 TW TW092107916A patent/TWI251018B/zh not_active IP Right Cessation
- 2003-04-09 DE DE60325033T patent/DE60325033D1/de not_active Expired - Lifetime
- 2003-04-09 JP JP2003582235A patent/JP3949658B2/ja not_active Expired - Lifetime
- 2003-04-09 KR KR1020047015902A patent/KR100664718B1/ko not_active Expired - Fee Related
- 2003-04-09 WO PCT/JP2003/004514 patent/WO2003085052A1/ja not_active Ceased
- 2003-04-09 US US10/510,512 patent/US7771627B2/en not_active Expired - Lifetime
- 2003-04-09 DE DE60332065T patent/DE60332065D1/de not_active Expired - Lifetime
- 2003-04-09 AT AT08157328T patent/ATE463538T1/de not_active IP Right Cessation
- 2003-04-09 AT AT03720898T patent/ATE416236T1/de not_active IP Right Cessation
- 2003-04-09 EP EP08157328A patent/EP1972660B1/de not_active Expired - Lifetime
- 2003-04-09 EP EP03720898A patent/EP1493780B1/de not_active Expired - Lifetime
- 2003-04-09 CN CNB038077884A patent/CN100396730C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1972660A1 (de) | 2008-09-24 |
| JPWO2003085052A1 (ja) | 2005-08-11 |
| EP1493780A4 (de) | 2006-02-01 |
| DE60325033D1 (de) | 2009-01-15 |
| WO2003085052A1 (en) | 2003-10-16 |
| ATE463538T1 (de) | 2010-04-15 |
| TW200305619A (en) | 2003-11-01 |
| US7771627B2 (en) | 2010-08-10 |
| EP1972660B1 (de) | 2010-04-07 |
| EP1493780A1 (de) | 2005-01-05 |
| CN1646633A (zh) | 2005-07-27 |
| KR100664718B1 (ko) | 2007-01-03 |
| US20050116203A1 (en) | 2005-06-02 |
| DE60332065D1 (de) | 2010-05-20 |
| JP3949658B2 (ja) | 2007-07-25 |
| KR20040107491A (ko) | 2004-12-20 |
| EP1493780B1 (de) | 2008-12-03 |
| TWI251018B (en) | 2006-03-11 |
| CN100396730C (zh) | 2008-06-25 |
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| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |