PL2259164T3 - Rozwiązanie termiczne dla urządzeń elektronicznych - Google Patents

Rozwiązanie termiczne dla urządzeń elektronicznych

Info

Publication number
PL2259164T3
PL2259164T3 PL10178725T PL10178725T PL2259164T3 PL 2259164 T3 PL2259164 T3 PL 2259164T3 PL 10178725 T PL10178725 T PL 10178725T PL 10178725 T PL10178725 T PL 10178725T PL 2259164 T3 PL2259164 T3 PL 2259164T3
Authority
PL
Poland
Prior art keywords
thermal solution
electronic devices
electronic device
heat source
external surface
Prior art date
Application number
PL10178725T
Other languages
English (en)
Inventor
Martin David Smalc
Gary D. Shives
Robert Anderson Reynolds Iii
Original Assignee
Neograf Solutions, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34465685&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2259164(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Neograf Solutions, Llc filed Critical Neograf Solutions, Llc
Publication of PL2259164T3 publication Critical patent/PL2259164T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
PL10178725T 2003-11-25 2004-10-21 Rozwiązanie termiczne dla urządzeń elektronicznych PL2259164T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/722,364 US6982874B2 (en) 2003-11-25 2003-11-25 Thermal solution for electronic devices
EP08169306.1A EP2026164B1 (en) 2003-11-25 2004-10-21 Thermal solution for electronic devices
EP10178725.7A EP2259164B8 (en) 2003-11-25 2004-10-21 Thermal solution for electronic devices
EP04256484A EP1536313B1 (en) 2003-11-25 2004-10-21 Thermal solution for electronic devices

Publications (1)

Publication Number Publication Date
PL2259164T3 true PL2259164T3 (pl) 2018-06-29

Family

ID=34465685

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10178725T PL2259164T3 (pl) 2003-11-25 2004-10-21 Rozwiązanie termiczne dla urządzeń elektronicznych

Country Status (10)

Country Link
US (1) US6982874B2 (pl)
EP (3) EP2259164B8 (pl)
JP (1) JP2005159313A (pl)
KR (1) KR100555610B1 (pl)
CN (1) CN100559923C (pl)
AT (1) ATE438132T1 (pl)
DE (2) DE04256484T1 (pl)
HU (1) HUE035539T2 (pl)
PL (1) PL2259164T3 (pl)
TW (1) TWI278275B (pl)

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Also Published As

Publication number Publication date
EP2026164A1 (en) 2009-02-18
KR20050050565A (ko) 2005-05-31
HUE035539T2 (en) 2018-05-02
EP2259164A1 (en) 2010-12-08
EP2259164B8 (en) 2018-02-21
US20050111189A1 (en) 2005-05-26
KR100555610B1 (ko) 2006-03-03
HK1078955A1 (en) 2006-03-24
ATE438132T1 (de) 2009-08-15
DE04256484T1 (de) 2006-07-13
CN100559923C (zh) 2009-11-11
EP1536313A2 (en) 2005-06-01
TWI278275B (en) 2007-04-01
JP2005159313A (ja) 2005-06-16
EP2026164B1 (en) 2016-05-11
CN1622745A (zh) 2005-06-01
TW200529734A (en) 2005-09-01
EP2259164B1 (en) 2017-12-06
EP1536313A3 (en) 2006-08-02
DE602004022238D1 (de) 2009-09-10
EP1536313B1 (en) 2009-07-29
US6982874B2 (en) 2006-01-03

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