ATE431067T1 - Mittenebene in zwei stücken - Google Patents

Mittenebene in zwei stücken

Info

Publication number
ATE431067T1
ATE431067T1 AT05812154T AT05812154T ATE431067T1 AT E431067 T1 ATE431067 T1 AT E431067T1 AT 05812154 T AT05812154 T AT 05812154T AT 05812154 T AT05812154 T AT 05812154T AT E431067 T1 ATE431067 T1 AT E431067T1
Authority
AT
Austria
Prior art keywords
connector
pieces
center level
tails attached
receive
Prior art date
Application number
AT05812154T
Other languages
English (en)
Inventor
Steven Minich
Original Assignee
Framatome Connectors Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Framatome Connectors Int filed Critical Framatome Connectors Int
Application granted granted Critical
Publication of ATE431067T1 publication Critical patent/ATE431067T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R29/00—Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Steroid Compounds (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
AT05812154T 2004-11-12 2005-10-17 Mittenebene in zwei stücken ATE431067T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/988,029 US7052288B1 (en) 2004-11-12 2004-11-12 Two piece mid-plane
PCT/US2005/037183 WO2006055147A1 (en) 2004-11-12 2005-10-17 Two piece mid-plane

Publications (1)

Publication Number Publication Date
ATE431067T1 true ATE431067T1 (de) 2009-05-15

Family

ID=36386961

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05812154T ATE431067T1 (de) 2004-11-12 2005-10-17 Mittenebene in zwei stücken

Country Status (9)

Country Link
US (1) US7052288B1 (de)
EP (1) EP1813001B1 (de)
JP (1) JP2008520098A (de)
KR (1) KR20070084174A (de)
CN (1) CN100511874C (de)
AT (1) ATE431067T1 (de)
DE (1) DE602005014376D1 (de)
TW (1) TWI292644B (de)
WO (1) WO2006055147A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4047351B2 (ja) * 2005-12-12 2008-02-13 キヤノン株式会社 多層プリント回路板
US7540744B1 (en) 2008-01-08 2009-06-02 Fci Americas Technology, Inc. Shared hole orthogonal footprint with backdrilled vias
CN101730383B (zh) * 2008-10-23 2012-03-14 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8060682B1 (en) * 2008-11-14 2011-11-15 Qlogic, Corporation Method and system for multi-level switch configuration
WO2016115205A1 (en) * 2015-01-15 2016-07-21 Fci Asia Pte. Ltd Separator for electrical assembly

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3022480A (en) 1957-02-07 1962-02-20 Tiffany Frank Emery Sandwich circuit strips
US3284322A (en) * 1963-08-26 1966-11-08 Pearlstein Fred Splitting plated-through holes of printed circuit boards into two conductive segments
US3660726A (en) 1970-10-12 1972-05-02 Elfab Corp Multi-layer printed circuit board and method of manufacture
US4054939A (en) * 1975-06-06 1977-10-18 Elfab Corporation Multi-layer backpanel including metal plate ground and voltage planes
US4095866A (en) * 1977-05-19 1978-06-20 Ncr Corporation High density printed circuit board and edge connector assembly
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
US4230385A (en) * 1979-02-06 1980-10-28 Elfab Corporation Printed circuit board, electrical connector and method of assembly
US4431977A (en) * 1982-02-16 1984-02-14 Motorola, Inc. Ceramic bandpass filter
US4552422A (en) * 1983-03-14 1985-11-12 Amp Incorporated Modular receptacle pin grid array
US4524240A (en) * 1983-08-17 1985-06-18 Lucasfilm Ltd. Universal circuit prototyping board
US4817280A (en) * 1985-06-10 1989-04-04 O. Key Printed Wiring Co., Ltd. Method of manufacturing printed circuit boards
EP0236186A1 (de) * 1986-01-31 1987-09-09 Digital Equipment Corporation Einpressstift für die Verbindung einer Schaltplatte
US4961806A (en) * 1986-12-10 1990-10-09 Sanders Associates, Inc. Method of making a printed circuit
US4868980A (en) * 1986-12-23 1989-09-26 Ltv Aerospace & Defense Company Method of designing and manufacturing circuits using universal circuit board
US5184400A (en) * 1987-05-21 1993-02-09 Cray Computer Corporation Method for manufacturing a twisted wire jumper electrical interconnector
JPH0834340B2 (ja) * 1988-12-09 1996-03-29 日立化成工業株式会社 配線板およびその製造法
DE3910646A1 (de) * 1989-04-01 1990-10-04 Endress Hauser Gmbh Co Kapazitiver drucksensor und verfahren zu seiner herstellung
JPH0324789A (ja) * 1989-06-22 1991-02-01 Yazaki Corp 回路板の多層接続構造
JPH0377393A (ja) * 1989-08-21 1991-04-02 Ok Print:Kk 配線基板装置
JP2892514B2 (ja) * 1991-01-22 1999-05-17 ケル株式会社 電気コネクタ
JP3167141B2 (ja) * 1991-04-16 2001-05-21 日本特殊陶業株式会社 集積回路用パッケージ
US5199879A (en) * 1992-02-24 1993-04-06 International Business Machines Corporation Electrical assembly with flexible circuit
US5352123A (en) 1992-06-08 1994-10-04 Quickturn Systems, Incorporated Switching midplane and interconnection system for interconnecting large numbers of signals
JP2758787B2 (ja) * 1992-07-30 1998-05-28 日本電気株式会社 電子部品の実装構造
US5295869A (en) * 1992-12-18 1994-03-22 The Siemon Company Electrically balanced connector assembly
US5469330A (en) * 1994-02-14 1995-11-21 Karabatsos; Chris Heat sink header assembly
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
EP0677897A3 (de) * 1994-04-14 1996-09-11 Siemens Ag Leiterplattenanordnung für Steckverbindungen.
US5645433A (en) * 1994-05-09 1997-07-08 Johnstech International Corporation Contacting system for electrical devices
EP0692841B1 (de) * 1994-07-15 1998-09-30 Berg Electronics Manufacturing B.V. Zusammenbau eines abgeschirmten Verbinders und einer Leiterplatte mit kontaktierten Löchern
US5773195A (en) * 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
JPH09214088A (ja) * 1996-01-31 1997-08-15 Sumitomo Kinzoku Electro Device:Kk セラミック基板のプリント配線基板への実装構造
US5761050A (en) * 1996-08-23 1998-06-02 Cts Corporation Deformable pin connector for multiple PC boards
US5836792A (en) * 1996-11-26 1998-11-17 The Whitaker Corporation Board mountable electrical connector
US6388208B1 (en) * 1999-06-11 2002-05-14 Teradyne, Inc. Multi-connection via with electrically isolated segments
US6528737B1 (en) 2000-08-16 2003-03-04 Nortel Networks Limited Midplane configuration featuring surface contact connectors
US6538899B1 (en) 2001-01-02 2003-03-25 Juniper Networks, Inc. Traceless midplane
US6608762B2 (en) * 2001-06-01 2003-08-19 Hyperchip Inc. Midplane for data processing apparatus
US6593535B2 (en) 2001-06-26 2003-07-15 Teradyne, Inc. Direct inner layer interconnect for a high speed printed circuit board
US6541712B1 (en) * 2001-12-04 2003-04-01 Teradyhe, Inc. High speed multi-layer printed circuit board via
JP4016422B2 (ja) * 2002-12-09 2007-12-05 日本電気株式会社 Ｆｐｃ変換アダプタ、それを用いた電子機器およびｆｐｃ変換接続方法。
US20040108137A1 (en) * 2002-12-10 2004-06-10 Litton Systems, Inc. Cross connect via for multilayer printed circuit boards

Also Published As

Publication number Publication date
TW200635152A (en) 2006-10-01
WO2006055147A1 (en) 2006-05-26
US7052288B1 (en) 2006-05-30
KR20070084174A (ko) 2007-08-24
EP1813001A1 (de) 2007-08-01
DE602005014376D1 (de) 2009-06-18
US20060105596A1 (en) 2006-05-18
EP1813001B1 (de) 2009-05-06
JP2008520098A (ja) 2008-06-12
TWI292644B (en) 2008-01-11
CN101057377A (zh) 2007-10-17
CN100511874C (zh) 2009-07-08
EP1813001A4 (de) 2007-12-12

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Legal Events

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