ATE434082T1 - Verfahren zur applizierung eines metalls auf ein substrat - Google Patents

Verfahren zur applizierung eines metalls auf ein substrat

Info

Publication number
ATE434082T1
ATE434082T1 AT07727931T AT07727931T ATE434082T1 AT E434082 T1 ATE434082 T1 AT E434082T1 AT 07727931 T AT07727931 T AT 07727931T AT 07727931 T AT07727931 T AT 07727931T AT E434082 T1 ATE434082 T1 AT E434082T1
Authority
AT
Austria
Prior art keywords
metal
ions
substrate
circuits
possibility
Prior art date
Application number
AT07727931T
Other languages
English (en)
Inventor
Anders Hult
Karl-Gunnar Larsson
Original Assignee
Linea Tergi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linea Tergi Ltd filed Critical Linea Tergi Ltd
Application granted granted Critical
Publication of ATE434082T1 publication Critical patent/ATE434082T1/de

Links

Classifications

    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/02—Metal coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00—Coated paper; Coating material
    • D21H19/02—Metal coatings
    • D21H19/08—Metal coatings applied as vapour, e.g. in vacuum
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
    • D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
    • D21H23/22—Addition to the formed paper
    • D21H23/30—Pretreatment of the paper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1692—Heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
AT07727931T 2006-04-10 2007-04-10 Verfahren zur applizierung eines metalls auf ein substrat ATE434082T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US79114806P 2006-04-10 2006-04-10
SE0600805 2006-04-10
US85492206P 2006-10-27 2006-10-27
PCT/EP2007/053463 WO2007116057A2 (en) 2006-04-10 2007-04-10 Method for applying a metal on a substrate

Publications (1)

Publication Number Publication Date
ATE434082T1 true ATE434082T1 (de) 2009-07-15

Family

ID=38515559

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07727931T ATE434082T1 (de) 2006-04-10 2007-04-10 Verfahren zur applizierung eines metalls auf ein substrat

Country Status (8)

Country Link
US (1) US20090205853A1 (de)
EP (1) EP2004908B1 (de)
JP (1) JP2009533858A (de)
AT (1) ATE434082T1 (de)
DE (1) DE602007001344D1 (de)
DK (1) DK2004908T3 (de)
ES (1) ES2328749T3 (de)
WO (1) WO2007116057A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866579B2 (ja) * 2002-01-25 2007-01-10 富士フイルムホールディングス株式会社 薄層金属膜
JP4926238B2 (ja) * 2006-04-10 2012-05-09 リネア・テルジ・リミテッド 紙に金属を適用するための方法
US8826530B2 (en) 2009-03-31 2014-09-09 Ibiden Co., Ltd. Method for manufacturing substrate with metal film
US8563873B2 (en) 2009-03-31 2013-10-22 Ibiden Co., Ltd. Substrate with metal film and method for manufacturing the same
CN103328686A (zh) * 2010-11-16 2013-09-25 凯普卓尼克技术公司 采用等离子体聚合预处理对物件的金属涂覆
CN107475696A (zh) * 2012-05-07 2017-12-15 凯普卓尼克技术公司 一种金属涂覆工艺
WO2014086844A2 (en) 2012-12-05 2014-06-12 Cuptronic Technology Ltd. Metalization of polymeric cavity filters
US9023560B1 (en) * 2013-11-05 2015-05-05 Eastman Kodak Company Electroless plating method using non-reducing agent
US20150125674A1 (en) * 2013-11-05 2015-05-07 Thomas B. Brust Forming conductive metal patterns using reactive polymers
US9122161B2 (en) * 2013-11-05 2015-09-01 Eastman Kodak Company Electroless plating method using bleaching
US9128378B2 (en) * 2013-11-05 2015-09-08 Eastman Kodak Company Forming conductive metal patterns with reactive polymers
CN106460176B (zh) 2014-04-28 2020-02-07 凯普卓尼克技术公司 表面的金属化
WO2022018136A1 (en) 2020-07-21 2022-01-27 Ncapt Ab METHOD FOR SURFACE TREATMENT PRIOR TO COATING and GLUING
SE545002C2 (en) 2020-07-24 2023-02-21 Cuptronic Tech Ltd Method for surface treatment prior to metallization
US12342449B2 (en) * 2021-09-28 2025-06-24 The Board Of Trustees Of The University Of Illinois Multilayered nonpolar, chromium, copper material coatings of power electronics boards for thermal management
SE547313C2 (en) 2023-11-28 2025-07-01 Cuptronic Tech Ltd Metalization of surfaces
WO2025250607A1 (en) * 2024-05-29 2025-12-04 Yield Engineering Systems, Inc. Electroless deposition of metal on surface polymer films on substrate surfaces

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3333169A (en) * 1966-05-18 1967-07-25 Union Carbide Corp Electrical capacitor with a linear p-xylylene polymer dielectric
GB1222969A (en) * 1967-06-03 1971-02-17 Geigy Uk Ltd Plating process
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US3998602A (en) * 1975-02-07 1976-12-21 Carl Horowitz Metal plating of polymeric substrates
JPS54127573A (en) * 1978-03-28 1979-10-03 Shin Kobe Electric Machinery Method of producing printed circuit board
JPS5586744A (en) * 1978-12-26 1980-06-30 Fujitsu Ltd Method of making copperrcoated laminated board
JPH0740625B2 (ja) * 1984-02-13 1995-05-01 松下電器産業株式会社 印刷配線板の製造方法
JP2605010B2 (ja) * 1985-01-11 1997-04-30 インターナショナル・ビジネス・マシーンズ・コーポレーション 有機基板への金属付着方法
US4810326A (en) * 1987-08-31 1989-03-07 International Business Machines Corporation Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
US5114757A (en) * 1990-10-26 1992-05-19 Linde Harold G Enhancement of polyimide adhesion on reactive metals
US5225495A (en) * 1991-07-10 1993-07-06 Richard C. Stewart, II Conductive polymer film formation using initiator pretreatment
US5153986A (en) * 1991-07-17 1992-10-13 International Business Machines Method for fabricating metal core layers for a multi-layer circuit board
US5262208A (en) * 1992-04-06 1993-11-16 Plasma Plus Gas plasma treatment for archival preservation of manuscripts and the like
JP3493829B2 (ja) * 1994-10-28 2004-02-03 日本油脂Ｂａｓｆコーティングス株式会社 硬化性ベースコート塗料組成物、塗膜形成方法及び塗装物品
US6210537B1 (en) * 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
JPH0995705A (ja) * 1995-10-03 1997-04-08 Daido Steel Co Ltd Ａｇ−Ｐｄ共沈粉末およびその製造方法
JP3727717B2 (ja) * 1996-05-10 2005-12-14 Ｂａｓｆコーティングスジャパン株式会社 上塗り塗装方法
SE508280C2 (sv) * 1997-01-31 1998-09-21 Cuptronic Ab Förfarande för att öka vidhäftningsförmågan hos ledande material till ytskikt av polymermaterial
US6303278B1 (en) * 1997-01-31 2001-10-16 Cuptronic Ab Method of applying metal layers in distinct patterns
US6156221A (en) * 1998-10-02 2000-12-05 International Business Machines Corporation Copper etching compositions, processes and products derived therefrom
JP2000129454A (ja) * 1998-10-21 2000-05-09 Hitachi Chem Co Ltd 無電解パラジウムめっき液
US6899999B2 (en) * 2001-03-28 2005-05-31 Kabushiki Kaisha Toshiba Method of manufacturing composite member, photosensitive composition, porous base material, insulating body and composite member
EP1282175A3 (de) * 2001-08-03 2007-03-14 FUJIFILM Corporation Muster aus leitendem Material und Verfahren zur dessen Herstellung
US6893681B2 (en) * 2001-09-27 2005-05-17 Fujitsu Limited Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
JP3866579B2 (ja) * 2002-01-25 2007-01-10 富士フイルムホールディングス株式会社 薄層金属膜
JP2005037881A (ja) * 2003-04-21 2005-02-10 Fuji Photo Film Co Ltd パターン形成方法、画像形成方法、微粒子吸着パターン形成方法、導電性パターン形成方法、パターン形成材料、及び平版印刷版
US7291427B2 (en) * 2004-03-19 2007-11-06 Fujifilm Corporation Surface graft material, conductive pattern material, and production method thereof

Also Published As

Publication number Publication date
DK2004908T3 (da) 2009-10-19
EP2004908B1 (de) 2009-06-17
DE602007001344D1 (de) 2009-07-30
WO2007116057A2 (en) 2007-10-18
ES2328749T3 (es) 2009-11-17
EP2004908A2 (de) 2008-12-24
HK1122076A1 (en) 2009-05-08
JP2009533858A (ja) 2009-09-17
US20090205853A1 (en) 2009-08-20
WO2007116057A3 (en) 2007-12-21

Similar Documents

Publication Publication Date Title
ATE434082T1 (de) Verfahren zur applizierung eines metalls auf ein substrat
ATE434081T1 (de) Verfahren zur applizierung eines metalls auf papier
ATE529881T1 (de) Verfahren zur beschichtung von substraten mit diamantähnlichen kohlenstoffschichten
SE0402904D0 (sv) Coated product and method of production thereof
WO2008048840A3 (en) Methods of patterning a deposit metal on a polymeric substrate
EP1588989A3 (de) Verfahren zur Herstellung eines Masters, Master und Verfahren zur Herstellung von optischen Elementen sowie optisches Element
EP1921119A4 (de) Fleckenbeständige beschichtungszusammensetzung, fleckenbeständiger beschichtungsfilm, substrat mit dem beschichtungsfilm, verfahren zur formung einer beschichtung auf der oberfläche eines substrats und verfahren zur herstellung der fleckenbeständigkeit eines substrats
WO2008141158A3 (en) Substrate surface structures and processes for forming the same
DE50309800D1 (de) Verfahren zur herstellung von schichten und schichtsystemen sowie beschichtetes substrat
WO2008081585A1 (ja) スパッタリングターゲットとその製造方法
ATE402801T1 (de) Verfahren zum aufbringen einer imc-(in-mold- coating)-beschichtung auf einem oberflächenbereich eines spritzgegossenen substrates
DE59601270D1 (de) Verfahren zur mehrschichtlackierung
ATE327835T1 (de) Verfahren und grundierungszusammensetzung zur beschichtung eines unpolaren substrates
EP2174765A3 (de) Verfahren zum Folienhinterspritzen
DE602006011335D1 (de) Verfahren zur herstellung musterbildender metallstrukturen auf einem trägersubstrat
WO2004071677A3 (en) Continuous process for manufacturing electrostatically self-assembled coatings
SE0402865D0 (sv) Coated product and method of production thereof
DE602006013421D1 (de) Beschichtungszusammensetzungen mit einem polyesterpolyol, dazugehörige beschichtete substrate, mehrlagige beschichtungen und verfahren
TW200606036A (en) Thin metal sheet having a pattern and manufacturing method therefor
ATE542785T1 (de) Verfahren zur elektrophoretischen beschichtung
SE0402701D0 (sv) Coated product and method of production thereof
DE602004009108D1 (de) Verfahren zur herstellung eines mittels einer plasmaabscheidungstechnik überzogenen metalldrahts
ATE444937T1 (de) Verfahren zur beschichtung einer oberfläche mit nanoteilchen
EP1696481A3 (de) Verfahren zur Integration eines elektronischen Bauteils in einer Substratkavität
EP3882224C0 (de) Beschichtungsmaterial für glassubstrate, mit dem beschichtungsmaterial beschichtetes glassubstrat sowie verfahren zu deren herstellung

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties