ATE434265T1 - Kondensatorstruktur mit einer vielzahl von anschlüssen - Google Patents

Kondensatorstruktur mit einer vielzahl von anschlüssen

Info

Publication number
ATE434265T1
ATE434265T1 AT02008769T AT02008769T ATE434265T1 AT E434265 T1 ATE434265 T1 AT E434265T1 AT 02008769 T AT02008769 T AT 02008769T AT 02008769 T AT02008769 T AT 02008769T AT E434265 T1 ATE434265 T1 AT E434265T1
Authority
AT
Austria
Prior art keywords
capacitor structure
providing
electrode layer
terminals
film electrode
Prior art date
Application number
AT02008769T
Other languages
English (en)
Inventor
David R Brown
Original Assignee
Paratek Microwave Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paratek Microwave Inc filed Critical Paratek Microwave Inc
Application granted granted Critical
Publication of ATE434265T1 publication Critical patent/ATE434265T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
AT02008769T 2001-04-19 2002-04-18 Kondensatorstruktur mit einer vielzahl von anschlüssen ATE434265T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/838,412 US6549396B2 (en) 2001-04-19 2001-04-19 Multiple terminal capacitor structure

Publications (1)

Publication Number Publication Date
ATE434265T1 true ATE434265T1 (de) 2009-07-15

Family

ID=25277033

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02008769T ATE434265T1 (de) 2001-04-19 2002-04-18 Kondensatorstruktur mit einer vielzahl von anschlüssen

Country Status (5)

Country Link
US (1) US6549396B2 (de)
EP (1) EP1251559B1 (de)
AT (1) ATE434265T1 (de)
CA (1) CA2381117C (de)
DE (1) DE60232619D1 (de)

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US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
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US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
JP2005527823A (ja) 2002-05-23 2005-09-15 カスケード マイクロテック インコーポレイテッド デバイスのテスト用プローブ
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
DE10260352A1 (de) * 2002-12-20 2004-07-15 Infineon Technologies Ag Verfahren zum Herstellen einer Kondensatoranordnung und Kondensatoranordnung
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
DE10326087B4 (de) 2003-06-10 2008-03-20 Infineon Technologies Ag Bauelement mit einer Nutzstruktur und einer Hilfsstruktur
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
JP2008502167A (ja) 2004-06-07 2008-01-24 カスケード マイクロテック インコーポレイテッド 熱光学チャック
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US20060157792A1 (en) * 2005-01-19 2006-07-20 Kyocera Corporation Laminated thin film capacitor and semiconductor apparatus
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20060274476A1 (en) * 2005-04-13 2006-12-07 Andrew Cervin-Lawry Low loss thin film capacitor and methods of manufacturing the same
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (de) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Breitbandige aktiv-passiv-differenzsignalsonde
DE102005052637A1 (de) * 2005-11-04 2007-05-24 Atmel Duisburg Gmbh Monolithisch integrierte Schaltung
US7609077B2 (en) 2006-06-09 2009-10-27 Cascade Microtech, Inc. Differential signal probe with integral balun
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
WO2008041565A1 (en) * 2006-09-27 2008-04-10 Kyocera Corporation Capacitor, capacitor device, electronic component, filter device, communication device and method for manufacturing capacitor device
US8169772B2 (en) 2007-05-01 2012-05-01 Avx Corporation Precision laser adjustable thin film capacitors
US20080304202A1 (en) * 2007-06-04 2008-12-11 Taiyo Yuden Co., Ltd. Multi-layer capacitor and integrated circuit module
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090230446A1 (en) 2008-03-17 2009-09-17 Technology Alliance Group, Inc. Semiconductor device and bypass capacitor module
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US20110007488A1 (en) * 2009-07-07 2011-01-13 Chin-Wei Liu Power supply current circuit structure
US9648727B2 (en) 2015-01-22 2017-05-09 Harris Corporation Fault detection optimized electronic circuit and method
US12406944B2 (en) * 2019-06-11 2025-09-02 Skyworks Solutions, Inc. Moisture barrier for metal insulator metal capacitors and integrated circuit having the same
US11990470B2 (en) * 2021-09-24 2024-05-21 International Business Machines Corporation Ferroelectric and paraelectric stack capacitors

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US4916576A (en) 1989-02-27 1990-04-10 Fmtt, Inc. Matrix capacitor
US5530722A (en) 1992-10-27 1996-06-25 Ericsson Ge Mobile Communications Inc. Quadrature modulator with integrated distributed RC filters
US5745335A (en) * 1996-06-27 1998-04-28 Gennum Corporation Multi-layer film capacitor structures and method
US5910879A (en) * 1996-06-27 1999-06-08 Herbert; Edward 3- and 4-terminal capacitors with "Faraday-shielded" connections
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US6266229B1 (en) * 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JP2000183286A (ja) * 1998-12-10 2000-06-30 Nec Corp 半導体集積回路

Also Published As

Publication number Publication date
EP1251559A2 (de) 2002-10-23
CA2381117C (en) 2006-11-14
EP1251559A3 (de) 2005-03-09
US20020163769A1 (en) 2002-11-07
EP1251559B1 (de) 2009-06-17
US6549396B2 (en) 2003-04-15
DE60232619D1 (de) 2009-07-30
CA2381117A1 (en) 2002-10-19

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