ATE439249T1 - Verfahren zum herstellen einer mikromechanisch bearbeiteten struktur - Google Patents

Verfahren zum herstellen einer mikromechanisch bearbeiteten struktur

Info

Publication number
ATE439249T1
ATE439249T1 AT00966870T AT00966870T ATE439249T1 AT E439249 T1 ATE439249 T1 AT E439249T1 AT 00966870 T AT00966870 T AT 00966870T AT 00966870 T AT00966870 T AT 00966870T AT E439249 T1 ATE439249 T1 AT E439249T1
Authority
AT
Austria
Prior art keywords
micromechanically
producing
machined structure
machined
micro machined
Prior art date
Application number
AT00966870T
Other languages
English (en)
Inventor
Lianzhong Yu
Howard Goldberg
Duli Yu
Original Assignee
Ion Geophysical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ion Geophysical Corp filed Critical Ion Geophysical Corp
Application granted granted Critical
Publication of ATE439249T1 publication Critical patent/ATE439249T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00142—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00865—Multistep processes for the separation of wafers into individual elements
    • B81C1/00896—Temporary protection during separation into individual elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Bridges Or Land Bridges (AREA)
  • Golf Clubs (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Slide Fasteners, Snap Fasteners, And Hook Fasteners (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
AT00966870T 1999-09-27 2000-09-25 Verfahren zum herstellen einer mikromechanisch bearbeiteten struktur ATE439249T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/406,158 US6458513B1 (en) 1999-07-13 1999-09-27 Temporary bridge for micro machined structures
PCT/US2000/026355 WO2001024228A2 (en) 1999-09-27 2000-09-25 Temporary bridge for micro machined structures

Publications (1)

Publication Number Publication Date
ATE439249T1 true ATE439249T1 (de) 2009-08-15

Family

ID=23606774

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00966870T ATE439249T1 (de) 1999-09-27 2000-09-25 Verfahren zum herstellen einer mikromechanisch bearbeiteten struktur

Country Status (9)

Country Link
US (1) US6458513B1 (de)
EP (1) EP1252028B1 (de)
JP (1) JP2003510194A (de)
AT (1) ATE439249T1 (de)
AU (1) AU7715200A (de)
CA (1) CA2384889C (de)
DE (1) DE60042757D1 (de)
NO (1) NO20021507D0 (de)
WO (1) WO2001024228A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693245B2 (en) * 2000-09-29 2004-02-17 Anritsu Corporation Electronic balance which is easily assembled, maintained, downsized and improved with respect to weighing performance, and method for manufacturing the same
US6818464B2 (en) * 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
WO2003098302A2 (en) * 2002-05-15 2003-11-27 Hymite A/S Optical device receiving substrate and optical device holding carrier
US7681306B2 (en) 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
JP4651476B2 (ja) * 2005-07-29 2011-03-16 株式会社リコー 光走査装置の組立方法および光走査装置ならびに画像形成装置
EP1967317A1 (de) * 2007-03-07 2008-09-10 Fujitsu Limited Verfahren zur Trennung eines Werkstücks und Laserbearbeitungsvorrichtung
CN103149684B (zh) * 2013-02-07 2015-01-28 东南大学 可双向扭转的交错梳齿静电驱动可变光衰减器及制备方法
US20230127991A1 (en) * 2020-03-26 2023-04-27 Wemems Co.,Ltd. Light scanner package and method for manufacturing same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62190748A (ja) * 1986-02-17 1987-08-20 Nissan Motor Co Ltd 半導体加速度センサ組立方法
US5060039A (en) * 1988-01-13 1991-10-22 The Charles Stark Draper Laboratory, Inc. Permanent magnet force rebalance micro accelerometer
US5534111A (en) * 1988-02-29 1996-07-09 Honeywell Inc. Thermal isolation microstructure
JPH04258175A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp シリコン半導体加速度センサの製造方法
JP3293194B2 (ja) * 1992-10-13 2002-06-17 株式会社デンソー 力学量センサ
JPH06350105A (ja) * 1993-06-07 1994-12-22 Nec Corp マイクロマシンとその製造方法
US5364497A (en) 1993-08-04 1994-11-15 Analog Devices, Inc. Method for fabricating microstructures using temporary bridges
JP2775578B2 (ja) * 1993-09-20 1998-07-16 仗祐 中田 加速度センサとその製造方法
US5369057A (en) * 1993-12-21 1994-11-29 Delco Electronics Corporation Method of making and sealing a semiconductor device having an air path therethrough
JPH07240395A (ja) * 1994-02-28 1995-09-12 Matsushita Electric Works Ltd 半導体装置の製造方法
US5481102A (en) * 1994-03-31 1996-01-02 Hazelrigg, Jr.; George A. Micromechanical/microelectromechanical identification devices and methods of fabrication and encoding thereof
JPH1096744A (ja) * 1996-09-20 1998-04-14 Zexel Corp 容量型加速度センサの製造方法
JPH10163505A (ja) * 1996-11-29 1998-06-19 Mitsubishi Materials Corp 半導体慣性センサ及びその製造方法
JPH1172505A (ja) * 1997-06-17 1999-03-16 Denso Corp 加速度センサおよびその製造方法
JPH1140820A (ja) * 1997-07-18 1999-02-12 Denso Corp 半導体力学量センサの製造方法
JP2001511608A (ja) * 1997-07-29 2001-08-14 シリコン ジェネシス コーポレイション プラズマ侵入型イオン注入を使用するクラスタツール方法及び装置
DE69916782D1 (de) * 1999-02-26 2004-06-03 St Microelectronics Srl Verfahren zur Herstellung mechanischer, elektromechanischer und opto-elektromechanischer Mikrostrukturen mit aufgehängten Regionen welche während des Zusammenbaus mechanischen Spannungen ausgesetzt sind
JP3580179B2 (ja) * 1999-05-26 2004-10-20 松下電工株式会社 半導体加速度センサの製造方法

Also Published As

Publication number Publication date
DE60042757D1 (de) 2009-09-24
EP1252028A4 (de) 2006-03-01
EP1252028B1 (de) 2009-08-12
AU7715200A (en) 2001-04-30
WO2001024228A2 (en) 2001-04-05
NO20021507L (no) 2002-03-26
CA2384889C (en) 2010-05-04
WO2001024228A3 (en) 2002-03-14
CA2384889A1 (en) 2001-04-05
JP2003510194A (ja) 2003-03-18
EP1252028A2 (de) 2002-10-30
US6458513B1 (en) 2002-10-01
NO20021507D0 (no) 2002-03-26

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Legal Events

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