ATE440329T1 - Mehrkanalmodule und bus-systeme - Google Patents

Mehrkanalmodule und bus-systeme

Info

Publication number
ATE440329T1
ATE440329T1 AT01937344T AT01937344T ATE440329T1 AT E440329 T1 ATE440329 T1 AT E440329T1 AT 01937344 T AT01937344 T AT 01937344T AT 01937344 T AT01937344 T AT 01937344T AT E440329 T1 ATE440329 T1 AT E440329T1
Authority
AT
Austria
Prior art keywords
bus systems
channel modules
modules
channel
bus
Prior art date
Application number
AT01937344T
Other languages
English (en)
Inventor
Donald Perino
Belgacem Haba
Sayeh Khalili
Richard Perego
David Nguyen
Billy Garrett
Ely Tsern
Craig Hampel
Wai-Yeung Yip
Ravindran Kollipara
Original Assignee
Rambus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rambus Inc filed Critical Rambus Inc
Priority claimed from PCT/US2001/015413 external-priority patent/WO2001086455A2/en
Application granted granted Critical
Publication of ATE440329T1 publication Critical patent/ATE440329T1/de

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/40Bus structure
    • G06F13/4063Device-to-bus coupling
    • G06F13/409Mechanical coupling
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1459Circuit configuration, e.g. routing signals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/148Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Steering-Linkage Mechanisms And Four-Wheel Steering (AREA)
  • Bus Control (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
AT01937344T 2000-05-10 2001-05-10 Mehrkanalmodule und bus-systeme ATE440329T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/568,424 US6545875B1 (en) 2000-05-10 2000-05-10 Multiple channel modules and bus systems using same
US09/817,828 US6590781B2 (en) 2000-05-10 2001-03-26 Clock routing in multiple channel modules and bus systems
US09/839,642 US6765800B2 (en) 2000-05-10 2001-04-20 Multiple channel modules and bus systems using same
PCT/US2001/015413 WO2001086455A2 (en) 2000-05-10 2001-05-10 Multiple channel modules and bus systems

Publications (1)

Publication Number Publication Date
ATE440329T1 true ATE440329T1 (de) 2009-09-15

Family

ID=24271232

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01937344T ATE440329T1 (de) 2000-05-10 2001-05-10 Mehrkanalmodule und bus-systeme

Country Status (4)

Country Link
US (10) US6545875B1 (de)
EP (1) EP2136300A1 (de)
AT (1) ATE440329T1 (de)
DE (1) DE60139623D1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4383601B2 (ja) * 1999-09-30 2009-12-16 株式会社東芝 高速メモリ装置、高速メモリ装置のソケット実装構造、及び高速メモリ装置の実装方法
US6833984B1 (en) 2000-05-03 2004-12-21 Rambus, Inc. Semiconductor module with serial bus connection to multiple dies
US6545875B1 (en) * 2000-05-10 2003-04-08 Rambus, Inc. Multiple channel modules and bus systems using same
US6963941B1 (en) * 2000-05-31 2005-11-08 Micron Technology, Inc. High speed bus topology for expandable systems
US6853557B1 (en) * 2000-09-20 2005-02-08 Rambus, Inc. Multi-channel memory architecture
US6675272B2 (en) 2001-04-24 2004-01-06 Rambus Inc. Method and apparatus for coordinating memory operations among diversely-located memory components
US8391039B2 (en) * 2001-04-24 2013-03-05 Rambus Inc. Memory module with termination component
US6950910B2 (en) * 2001-11-08 2005-09-27 Freescale Semiconductor, Inc. Mobile wireless communication device architectures and methods therefor
US6773284B2 (en) * 2002-03-12 2004-08-10 Westinghouse Lighting Corporation Lamp tube conversion apparatus
JP4094370B2 (ja) * 2002-07-31 2008-06-04 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
DE10250156A1 (de) * 2002-10-28 2004-05-13 Infineon Technologies Ag Speichermodul und Speicheranordnung mit abzweigfreien Signalleitungen und verteilten kapazitiven Lasten
KR100539237B1 (ko) * 2003-06-19 2005-12-27 삼성전자주식회사 메모리 모듈 또는 소켓에 장착되는 종단 제공장치 및 이를이용하는 메모리 시스템
US7038920B2 (en) * 2003-06-30 2006-05-02 Intel Corporation System to mount electrical modules
KR100532451B1 (ko) * 2003-07-19 2005-11-30 삼성전자주식회사 승압 전압이 인가되는 노드의 전압 강하를 방지하는구조를 가지는 반도체 메모리 장치
US7045720B2 (en) * 2003-09-19 2006-05-16 Intel Corporation Component lead system
US7230506B2 (en) * 2003-10-09 2007-06-12 Synopsys, Inc. Crosstalk reduction for a system of differential line pairs
US7180751B1 (en) * 2004-02-19 2007-02-20 Isothermal Systems Research, Inc. Input/output transition board system
DE102004008738A1 (de) * 2004-02-23 2005-09-08 BSH Bosch und Siemens Hausgeräte GmbH Elektronische Baugruppe und Verfahren zur Herstellung dieser
WO2005104324A2 (en) * 2004-04-15 2005-11-03 Smith Gary W Folded, fully buffered memory module
US7681023B2 (en) * 2004-04-30 2010-03-16 Hewlett-Packard Development Company, L.P. Method for ensuring optimal memory configuration in a computer
US7547213B2 (en) * 2004-08-26 2009-06-16 Micron Technology, Inc. Memory modules and methods for manufacturing memory modules
US7616452B2 (en) * 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7542297B2 (en) * 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7301831B2 (en) 2004-09-15 2007-11-27 Rambus Inc. Memory systems with variable delays for write data signals
US7425760B1 (en) * 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US7269025B2 (en) * 2004-12-30 2007-09-11 Intel Corporation Ballout for buffer
KR100688515B1 (ko) * 2005-01-06 2007-03-02 삼성전자주식회사 메모리 모듈 및 시스템
KR100666225B1 (ko) * 2005-02-17 2007-01-09 삼성전자주식회사 데이지 체인을 형성하는 멀티 디바이스 시스템 및 이의 구동방법
JP2006303003A (ja) * 2005-04-18 2006-11-02 Toshiba Corp プリント基板、および情報処理装置
US8726064B2 (en) * 2005-04-21 2014-05-13 Violin Memory Inc. Interconnection system
KR100735395B1 (ko) * 2005-05-10 2007-07-04 삼성전자주식회사 집적 회로를 이용한 인쇄회로기판의 라우팅 방법
US7414917B2 (en) * 2005-07-29 2008-08-19 Infineon Technologies Re-driving CAwD and rD signal lines
JP2007109932A (ja) * 2005-10-14 2007-04-26 Toshiba Corp 半導体装置
US7990737B2 (en) 2005-12-23 2011-08-02 Intel Corporation Memory systems with memory chips down and up
DE102006003376A1 (de) * 2006-01-24 2007-07-26 Infineon Technologies Ag Speichermodul mit einer elektronischen Leiterplatte und einer Mehrzahl von Halbleiterbausteinen und Verfahren
US7511969B2 (en) * 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
DE102006012446B3 (de) * 2006-03-17 2007-12-20 Infineon Technologies Ag Speichermodul mit einem Mittel zur Kühlung, Verfahren zur Herstellung des Speichermoduls mit einem Mittel zur Kühlung sowie Datenverarbeitungsgerät umfassend ein Speichermodul mit einem Mittel zur Kühlung
US7402048B2 (en) * 2006-03-30 2008-07-22 Intel Corporation Technique for blind-mating daughtercard to mainboard
US20070257699A1 (en) * 2006-04-20 2007-11-08 Moises Cases Multi-memory module circuit topology
US7732907B2 (en) * 2006-05-30 2010-06-08 Stats Chippac Ltd. Integrated circuit package system with edge connection system
US7540766B2 (en) * 2006-06-14 2009-06-02 Itron, Inc. Printed circuit board connector for utility meters
TWM302144U (en) * 2006-06-23 2006-12-01 Inventec Corp Front-to-back stack device for modulized circuit board
US20080002370A1 (en) * 2006-06-30 2008-01-03 Wai Shin Lau Scalable memory DIMM designs with vertical stackup connector
KR100818621B1 (ko) * 2006-08-11 2008-04-01 삼성전자주식회사 메모리 모듈, 메모리 모듈용 소켓 및 그를 구비한 메인보드
US20080123305A1 (en) * 2006-11-28 2008-05-29 Smart Modular Technologies, Inc. Multi-channel memory modules for computing devices
JP5322946B2 (ja) * 2006-12-04 2013-10-23 コンパニー ゼネラール デ エタブリッスマン ミシュラン 複数の遠隔測定システムのためのバックドア式データ同期
US7724540B1 (en) 2007-03-13 2010-05-25 Yazaki North America, Inc. Spacer for circuit boards
US20110119425A1 (en) * 2007-08-28 2011-05-19 Rambus Inc. Detachable interconnect for configurable width memory system
US8537563B2 (en) * 2007-09-21 2013-09-17 Hewlett-Packard Development Company, L.P. Memory system
JP5696301B2 (ja) * 2007-09-28 2015-04-08 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. アドレス線配線構造及びこれを有するプリント配線基板
TW200939242A (en) * 2008-03-11 2009-09-16 Nanya Technology Corp Memory module and method for accessing memory module
US20090296444A1 (en) * 2008-05-29 2009-12-03 Chih-Hui Yeh Memory module and method for accessing memory module
KR101170871B1 (ko) * 2008-08-08 2012-08-02 삼성전기주식회사 전자부품 실장용 전극 패드 및 전자부품의 실장 구조
JP5404261B2 (ja) * 2009-04-16 2014-01-29 モレックス インコーポレイテド 冷却装置、電子基板、電子機器
EP2419971A4 (de) * 2009-04-17 2013-03-27 Hewlett Packard Co Verfahren und system zur verringerung der trace-länge und kapazität in einem hintergrund grosser speichergrundfläche
US8694947B1 (en) * 2009-12-09 2014-04-08 The Mathworks, Inc. Resource sharing workflows within executable graphical models
US20110211310A1 (en) * 2010-03-01 2011-09-01 Seagate Technology Llc Signal path interconnection and assembly
TW201314445A (zh) * 2011-09-16 2013-04-01 Hon Hai Prec Ind Co Ltd 固態硬碟及安裝有該固態硬碟的電腦系統
US9077311B2 (en) * 2011-12-29 2015-07-07 Futurewei Technologies, Inc. Acoustic filter and method of acoustic filter manufacture
KR20130090643A (ko) * 2012-02-06 2013-08-14 삼성전자주식회사 정보 저장 장치 및 그것을 이용하는 사용자 장치
JP6257881B2 (ja) * 2012-05-31 2018-01-10 株式会社ミクニ エンジンコントロールユニット
KR20130139082A (ko) * 2012-06-12 2013-12-20 삼성전자주식회사 반도체 장치
US9516755B2 (en) * 2012-12-28 2016-12-06 Intel Corporation Multi-channel memory module
US9798628B2 (en) 2014-04-25 2017-10-24 Rambus Inc. Memory mirroring
DE102014111375A1 (de) * 2014-08-08 2016-02-11 Endress + Hauser Gmbh + Co. Kg Feldgerät der Automatisierungstechnik
US20160118734A1 (en) * 2014-10-28 2016-04-28 Hamilton Sundstrand Corporation Single flex printed wiring board for electric system controller
US9980366B2 (en) * 2015-01-12 2018-05-22 Qualcomm Incorporated High speed signal routing topology for better signal quality
US9870035B2 (en) * 2015-07-01 2018-01-16 International Business Machines Corporation Device for high density connections
US10423733B1 (en) 2015-12-03 2019-09-24 The Mathworks, Inc. Systems and methods for sharing resources having different data types
US10010007B2 (en) * 2015-12-09 2018-06-26 Mellanox Technologies, Ltd. Multi-slot plug-in card
CN109196733B (zh) * 2016-05-16 2020-11-03 3M创新有限公司 用于印刷电路板的电连接器
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
JP2018116891A (ja) * 2017-01-20 2018-07-26 株式会社オートネットワーク技術研究所 配線モジュール
US10903594B2 (en) * 2018-10-01 2021-01-26 Te Connectivity Corporation Board-to-board connector assembly for add-in cards
US11657862B2 (en) * 2019-03-22 2023-05-23 Intel Corporation Electrically coupled trace routing configuration in multiple layers
US10673165B1 (en) * 2019-07-05 2020-06-02 Wbstudio Technology Media Co., Ltd. Power connector for building blocks
DE102020108239A1 (de) * 2020-03-25 2021-09-30 Phytec Meßtechnik GmbH Lötplatinenmodulsystem
TWM612388U (zh) * 2021-02-05 2021-05-21 微星科技股份有限公司 輸入輸出傳輸介面總成及主機板模組
US12154891B2 (en) * 2022-07-01 2024-11-26 Gm Cruise Holdings Llc Printed circuit board with single rank memory configuration using partially aligned memory circuits

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US680297A (en) * 1900-10-08 1901-08-13 Charles H Van Deusen Ironing-board.
US2904768A (en) * 1955-04-13 1959-09-15 Hughes Aircraft Co Circuit connector for printed circuit boards
JPS5951186B2 (ja) 1979-10-19 1984-12-12 日本電信電話株式会社 制御装置
GB2162362B (en) * 1984-07-26 1988-01-27 Gen Electric Co Plc Flexible electrical connectors
US4743868A (en) * 1985-04-03 1988-05-10 Nippondenso Co., Ltd. High frequency filter for electric instruments
US4709300A (en) * 1986-05-05 1987-11-24 Itt Gallium Arsenide Technology Center, A Division Of Itt Corporation Jumper for a semiconductor assembly
DE3707551A1 (de) * 1987-03-10 1988-09-22 Bayer Ag Substituierte 1-arylpyrazole
US5010515A (en) 1987-07-28 1991-04-23 Raster Technologies, Inc. Parallel graphics processor with workload distributing and dependency mechanisms and method for distributing workload
US5334962A (en) * 1987-09-18 1994-08-02 Q-Dot Inc. High-speed data supply pathway systems
DE8904936U1 (de) 1989-04-19 1989-06-01 Force Computers GmbH, 8012 Ottobrunn Computer mit einer Mehrzahl von steckbaren Baugruppen
US4998886A (en) * 1989-07-07 1991-03-12 Teledyne Kinetics High density stacking connector
US5051099A (en) 1990-01-10 1991-09-24 Amp Incorporated High speed card edge connector
JPH0827705B2 (ja) 1990-07-25 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション アダプタ
US5276817A (en) * 1990-08-16 1994-01-04 Technosales Company Establishment System for splitting and connecting computer bus lines
US5104324A (en) * 1991-06-26 1992-04-14 Amp Incorporated Multichip module connector
US5186632A (en) * 1991-09-20 1993-02-16 International Business Machines Corporation Electronic device elastomeric mounting and interconnection technology
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
JPH07135513A (ja) * 1993-09-17 1995-05-23 Fujitsu Ltd 電流駆動型回路の終端制御方法および装置
EP0973098A1 (de) * 1994-03-11 2000-01-19 The Panda Project Steckverbindersystem von hoher Dichte
US5536177A (en) * 1994-03-18 1996-07-16 The Whitaker Corporation Set of connectors for stacked circuit board array
JP3252605B2 (ja) * 1994-07-04 2002-02-04 株式会社村田製作所 電子部品及びその製造方法
CN1166893A (zh) * 1994-11-30 1997-12-03 美国3M公司 具有交错多层结构的电接插件组件及其制造方法
US5635761A (en) * 1994-12-14 1997-06-03 International Business Machines, Inc. Internal resistor termination in multi-chip module environments
US5680297A (en) * 1995-08-07 1997-10-21 Apple Computer, Inc. Connector interface including EMI filtering
US5664968A (en) * 1996-03-29 1997-09-09 The Whitaker Corporation Connector assembly with shielded modules
US5943573A (en) 1997-01-17 1999-08-24 United Microelectronics Corp. Method of fabricating semiconductor read-only memory device
US5903736A (en) * 1997-04-01 1999-05-11 Sun Microsystems, Inc. Method and apparatus for smooth inductive compensation of transmission bus capacitive parasitics
US5981870A (en) * 1997-05-15 1999-11-09 Chrysler Corporation Flexible circuit board interconnect with strain relief
US5908333A (en) * 1997-07-21 1999-06-01 Rambus, Inc. Connector with integral transmission line bus
US6442644B1 (en) * 1997-08-11 2002-08-27 Advanced Memory International, Inc. Memory system having synchronous-link DRAM (SLDRAM) devices and controller
US5928036A (en) * 1997-10-30 1999-07-27 The Whitaker Corporation Dual row memory card connector
US5910885A (en) 1997-12-03 1999-06-08 White Electronic Designs Corporation Electronic stack module
US5910151A (en) * 1997-12-31 1999-06-08 Adedokun; Emmanuel A. Instrument for cleaning the top of a tongue
US6005776A (en) 1998-01-05 1999-12-21 Intel Corporation Vertical connector based packaging solution for integrated circuits
JP3957237B2 (ja) * 1998-01-19 2007-08-15 富士通株式会社 集積回路装置モジュール
JPH11251539A (ja) * 1998-03-06 1999-09-17 Mitsubishi Electric Corp 回路モジュール
US6142830A (en) 1998-03-06 2000-11-07 Siemens Aktiengesellschaft Signaling improvement using extended transmission lines on high speed DIMMS
US6003121A (en) 1998-05-18 1999-12-14 Intel Corporation Single and multiple channel memory detection and sizing
US5982654A (en) * 1998-07-20 1999-11-09 Micron Technology, Inc. System for connecting semiconductor devices
US6144576A (en) * 1998-08-19 2000-11-07 Intel Corporation Method and apparatus for implementing a serial memory architecture
US6253332B1 (en) * 1998-12-02 2001-06-26 Sun Microsystems Apparatus for generating shifted down clock signals
KR100314644B1 (ko) * 1998-12-28 2001-12-12 박종섭 리페어퓨즈셀의과소거확인회로
US6061263A (en) * 1998-12-29 2000-05-09 Intel Corporation Small outline rambus in-line memory module
US6357018B1 (en) * 1999-01-26 2002-03-12 Dell Usa, L.P. Method and apparatus for determining continuity and integrity of a RAMBUS channel in a computer system
US6086427A (en) * 1999-04-02 2000-07-11 Pcd Inc. Edge connector receiving module for bussing interconnections
US6243272B1 (en) * 1999-06-18 2001-06-05 Intel Corporation Method and apparatus for interconnecting multiple devices on a circuit board
US6530033B1 (en) * 1999-10-28 2003-03-04 Hewlett-Packard Company Radial arm memory bus for a high availability computer system
US6172895B1 (en) 1999-12-14 2001-01-09 High Connector Density, Inc. High capacity memory module with built-in-high-speed bus terminations
US6404660B1 (en) * 1999-12-23 2002-06-11 Rambus, Inc. Semiconductor package with a controlled impedance bus and method of forming same
US6362974B1 (en) * 2000-03-20 2002-03-26 Hewlett-Packard Company Stacked processor construction and a method for producing same
US6756874B2 (en) * 2000-03-21 2004-06-29 Bechtel Nevada Corporation Series transmission line transformer
US6545875B1 (en) * 2000-05-10 2003-04-08 Rambus, Inc. Multiple channel modules and bus systems using same
US6381164B1 (en) * 2000-08-24 2002-04-30 High Connection Density, Inc. Low profile, high density memory system
JP2003050256A (ja) * 2001-08-08 2003-02-21 Hitachi Ltd プリント基板検査装置
US6930506B2 (en) * 2002-10-22 2005-08-16 International Business Machines Corporation Terminating resistor driver for high speed data communication
JP4657695B2 (ja) 2004-12-10 2011-03-23 株式会社北電子 障害部材傾斜測定装置
US7988558B2 (en) 2006-04-27 2011-08-02 Nintendo Co., Ltd. Game apparatus and storage medium storing game program
EP2049210A4 (de) 2006-06-09 2010-09-08 Mattel Inc Interaktives dvd-spielsystem
JP5127242B2 (ja) 2007-01-19 2013-01-23 任天堂株式会社 加速度データ処理プログラムおよびゲームプログラム

Also Published As

Publication number Publication date
US20030007337A1 (en) 2003-01-09
US20010053069A1 (en) 2001-12-20
US6590781B2 (en) 2003-07-08
US6545875B1 (en) 2003-04-08
US20050142950A1 (en) 2005-06-30
US20010040796A1 (en) 2001-11-15
US20040066636A1 (en) 2004-04-08
EP2136300A1 (de) 2009-12-23
US8050042B2 (en) 2011-11-01
DE60139623D1 (de) 2009-10-01
US20050254221A1 (en) 2005-11-17
US20070120575A1 (en) 2007-05-31
US7170314B2 (en) 2007-01-30
US20040105240A1 (en) 2004-06-03
US7027307B2 (en) 2006-04-11
US6657871B2 (en) 2003-12-02
US20120001670A1 (en) 2012-01-05
US6765800B2 (en) 2004-07-20
US6898085B2 (en) 2005-05-24

Similar Documents

Publication Publication Date Title
ATE440329T1 (de) Mehrkanalmodule und bus-systeme
DE59611245D1 (de) Leistungshalbleitermodul
DE69425521D1 (de) Halbleitermodulbauteil
DE59912676D1 (de) Leistungshalbleitermodul
DE69319026D1 (de) Halbleiter-Leistungsmodul
DE69325232D1 (de) Leistungshalbleitermodul
DE69325953D1 (de) Leistungshalbleitermodul
DE59304797D1 (de) Leistungshalbleiter-Modul
DE69935628D1 (de) Hybridmodul
DE69534889D1 (de) Optisches Halbleitermodul
DE59504782D1 (de) Niederinduktives Leistungshalbleitermodul
DE69320750D1 (de) Halbleiterlasermodul
BR0207606B1 (pt) estrutura de laser semicondutor de emissço de bordo
EP0654820A3 (de) Halbleiter-Modul.
DE69927552T2 (de) Mehrkanalige Integrationskugel
DE59008471D1 (de) Leistungshalbleitermodul.
DE59911223D1 (de) Kurzschlussfestes IGBT modul
DE69220653D1 (de) Halbleiterleistungsmodul
DE59406106D1 (de) Leistungshalbleiterbauelement
DE69922451D1 (de) Verbindermodul
DE59508681D1 (de) Leistungshalbleitermodul
DE10293997D2 (de) Leistungshalbleitermodul
DE59610548D1 (de) Leistungshalbleitermodul
DE50004627D1 (de) Leistungshalbleiter-Modul
PT1434632E (pt) Brinquedo automotor compreendendo elementos flexiveis

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties