ATE447764T1 - Substrat-behandlungsvorrichtung - Google Patents

Substrat-behandlungsvorrichtung

Info

Publication number
ATE447764T1
ATE447764T1 AT03008477T AT03008477T ATE447764T1 AT E447764 T1 ATE447764 T1 AT E447764T1 AT 03008477 T AT03008477 T AT 03008477T AT 03008477 T AT03008477 T AT 03008477T AT E447764 T1 ATE447764 T1 AT E447764T1
Authority
AT
Austria
Prior art keywords
block
main transport
substrates
transport mechanism
substrate
Prior art date
Application number
AT03008477T
Other languages
English (en)
Inventor
Yoshiteru Fukutomi
Kenji Sugimoto
Takashi Ito
Takeo Okamoto
Yukihiko Inagaki
Katsushi Yoshioka
Tsuyoshi Mitsuhashi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Application granted granted Critical
Publication of ATE447764T1 publication Critical patent/ATE447764T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Coating Apparatus (AREA)
  • Polarising Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT03008477T 2002-05-01 2003-04-11 Substrat-behandlungsvorrichtung ATE447764T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002129817A JP4342147B2 (ja) 2002-05-01 2002-05-01 基板処理装置

Publications (1)

Publication Number Publication Date
ATE447764T1 true ATE447764T1 (de) 2009-11-15

Family

ID=29243953

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03008477T ATE447764T1 (de) 2002-05-01 2003-04-11 Substrat-behandlungsvorrichtung

Country Status (7)

Country Link
US (1) US6893171B2 (de)
EP (1) EP1361600B1 (de)
JP (1) JP4342147B2 (de)
KR (1) KR100564780B1 (de)
CN (2) CN1266738C (de)
AT (1) ATE447764T1 (de)
DE (1) DE60329886D1 (de)

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JP6548513B2 (ja) * 2015-08-21 2019-07-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
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JP6195601B2 (ja) * 2015-12-03 2017-09-13 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6870944B2 (ja) 2016-09-26 2021-05-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
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JP7358044B2 (ja) * 2018-02-09 2023-10-10 東京エレクトロン株式会社 基板処理装置
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CN1734713A (zh) 2006-02-15
EP1361600A3 (de) 2006-10-25
US6893171B2 (en) 2005-05-17
CN1455438A (zh) 2003-11-12
KR100564780B1 (ko) 2006-03-27
JP2003324139A (ja) 2003-11-14
EP1361600B1 (de) 2009-11-04
EP1361600A2 (de) 2003-11-12
US20030213431A1 (en) 2003-11-20
JP4342147B2 (ja) 2009-10-14
CN100413019C (zh) 2008-08-20
KR20030086900A (ko) 2003-11-12
DE60329886D1 (de) 2009-12-17
CN1266738C (zh) 2006-07-26

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