ATE449424T1 - Elektrisch löschbare und programmiebare nichtflüchtige halbleiterspeicheranordnung mit einschichtigem gatematerial und entsprechende speicherfläche - Google Patents
Elektrisch löschbare und programmiebare nichtflüchtige halbleiterspeicheranordnung mit einschichtigem gatematerial und entsprechende speicherflächeInfo
- Publication number
- ATE449424T1 ATE449424T1 AT03709915T AT03709915T ATE449424T1 AT E449424 T1 ATE449424 T1 AT E449424T1 AT 03709915 T AT03709915 T AT 03709915T AT 03709915 T AT03709915 T AT 03709915T AT E449424 T1 ATE449424 T1 AT E449424T1
- Authority
- AT
- Austria
- Prior art keywords
- gate
- transistor
- zone
- memory cell
- active
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000002356 single layer Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 238000002955 isolation Methods 0.000 abstract 1
- 230000010287 polarization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/60—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the control gate being a doped region, e.g. single-poly memory cell
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0204690A FR2838563B1 (fr) | 2002-04-15 | 2002-04-15 | Dispositif semiconducteur de memoire, non volatile, programmable et effacable electriquement, a une seule couche de materiau de grille |
| FR0209454A FR2838554B1 (fr) | 2002-04-15 | 2002-07-25 | Dispositif semiconducteur de memoire, non volatile, programmable et effacable electriquement, a une seule couche de materiau de grille, et plan memoire correspondant |
| PCT/FR2003/000311 WO2003088366A1 (fr) | 2002-04-15 | 2003-01-31 | Dispositif semiconducteur de memoire, non volatile, programmable et effacable electriquement, a une seule couche de materiau de grille, et plan memoire correspondant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE449424T1 true ATE449424T1 (de) | 2009-12-15 |
Family
ID=28676465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03709915T ATE449424T1 (de) | 2002-04-15 | 2003-01-31 | Elektrisch löschbare und programmiebare nichtflüchtige halbleiterspeicheranordnung mit einschichtigem gatematerial und entsprechende speicherfläche |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7333362B2 (de) |
| EP (1) | EP1495496B1 (de) |
| JP (1) | JP4662529B2 (de) |
| AT (1) | ATE449424T1 (de) |
| DE (1) | DE60330130D1 (de) |
| FR (1) | FR2838554B1 (de) |
| WO (1) | WO2003088366A1 (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI231039B (en) * | 2004-04-30 | 2005-04-11 | Yield Microelectronics Corp | Non-volatile memory and its operational method |
| GB0415995D0 (en) * | 2004-07-16 | 2004-08-18 | Song Aimin | Memory array |
| JP4881552B2 (ja) * | 2004-09-09 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2006202834A (ja) * | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 半導体記憶装置および半導体記憶装置の製造方法 |
| US7402874B2 (en) * | 2005-04-29 | 2008-07-22 | Texas Instruments Incorporated | One time programmable EPROM fabrication in STI CMOS technology |
| JP2006344735A (ja) * | 2005-06-08 | 2006-12-21 | Seiko Epson Corp | 半導体装置 |
| FR2891398A1 (fr) * | 2005-09-23 | 2007-03-30 | St Microelectronics Sa | Memoire non volatile reprogrammable |
| JP2007149947A (ja) * | 2005-11-28 | 2007-06-14 | Nec Electronics Corp | 不揮発性メモリセル及びeeprom |
| JP4435095B2 (ja) * | 2006-01-04 | 2010-03-17 | 株式会社東芝 | 半導体システム |
| US20070247915A1 (en) * | 2006-04-21 | 2007-10-25 | Intersil Americas Inc. | Multiple time programmable (MTP) PMOS floating gate-based non-volatile memory device for a general-purpose CMOS technology with thick gate oxide |
| CN100508169C (zh) * | 2006-08-02 | 2009-07-01 | 联华电子股份有限公司 | 单层多晶硅可电除可程序只读存储单元的制造方法 |
| US7759727B2 (en) | 2006-08-21 | 2010-07-20 | Intersil Americas Inc. | Method and apparatus for shielding tunneling circuit and floating gate for integration of a floating gate voltage reference in a general purpose CMOS technology |
| JP4282705B2 (ja) * | 2006-09-28 | 2009-06-24 | 株式会社東芝 | エージングデバイス及びその製造方法 |
| ES2322418B1 (es) * | 2006-10-02 | 2010-03-22 | Universidad De Almeria | Sistema de coexpresion enzimatica para la produccion de d-aminoacidos. |
| US7663173B1 (en) * | 2007-01-12 | 2010-02-16 | National Semiconductor Corporation | Non-volatile memory cell with poly filled trench as control gate and fully isolated substrate as charge storage |
| US7808034B1 (en) * | 2007-01-12 | 2010-10-05 | National Semiconductor Corporation | Non-volatile memory cell with fully isolated substrate as charge storage |
| US7688627B2 (en) * | 2007-04-24 | 2010-03-30 | Intersil Americas Inc. | Flash memory array of floating gate-based non-volatile memory cells |
| US7903465B2 (en) * | 2007-04-24 | 2011-03-08 | Intersil Americas Inc. | Memory array of floating gate-based non-volatile memory cells |
| US8339862B2 (en) | 2007-12-25 | 2012-12-25 | Genusion, Inc. | Nonvolatile semiconductor memory device |
| US8390052B2 (en) * | 2008-04-02 | 2013-03-05 | Sharp Kabushiki Kaisha | Nonvolatile semiconductor memory device |
| TWI416713B (zh) * | 2008-09-30 | 2013-11-21 | 國立大學法人九州工業大學 | Floating Gate Type Nonvolatile Memory Configuration |
| US7983081B2 (en) * | 2008-12-14 | 2011-07-19 | Chip.Memory Technology, Inc. | Non-volatile memory apparatus and method with deep N-well |
| US9324866B2 (en) | 2012-01-23 | 2016-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for transistor with line end extension |
| JP5856836B2 (ja) * | 2011-12-16 | 2016-02-10 | セイコーインスツル株式会社 | 不揮発性半導体記憶装置 |
| US10573751B2 (en) | 2012-01-23 | 2020-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for providing line end extensions for fin-type active regions |
| JP2013187534A (ja) * | 2012-03-08 | 2013-09-19 | Ememory Technology Inc | 消去可能プログラマブル単一ポリ不揮発性メモリ |
| EP2639817A1 (de) * | 2012-03-12 | 2013-09-18 | eMemory Technology Inc. | Verfahren zum Herstellen einer Floating-gate-Speichervorrichtung mit einer einzelnen Polysiliziumschicht |
| CN102723333B (zh) * | 2012-07-11 | 2014-09-03 | 无锡来燕微电子有限公司 | 一种具有p+浮栅电极的非挥发性记忆体及其制备方法 |
| KR102166525B1 (ko) * | 2014-04-18 | 2020-10-15 | 에스케이하이닉스 주식회사 | 단일층의 게이트를 갖는 불휘발성 메모리소자 및 그 동작방법과, 이를 이용한 메모리 셀어레이 |
| CN108257963A (zh) * | 2016-12-29 | 2018-07-06 | 北京同方微电子有限公司 | 一种闪存存储单元 |
| US12051756B2 (en) * | 2021-07-16 | 2024-07-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Flash memory device and method thereof |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2677327B2 (ja) * | 1988-07-11 | 1997-11-17 | 株式会社日立製作所 | 半導体装置 |
| JPH03179780A (ja) * | 1989-12-07 | 1991-08-05 | Fujitsu Ltd | 半導体装置 |
| US5712180A (en) * | 1992-01-14 | 1998-01-27 | Sundisk Corporation | EEPROM with split gate source side injection |
| JP2596695B2 (ja) * | 1993-05-07 | 1997-04-02 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Eeprom |
| JPH06334194A (ja) * | 1993-05-25 | 1994-12-02 | Fuji Electric Co Ltd | 不揮発性半導体メモリ |
| JPH07183410A (ja) * | 1993-12-24 | 1995-07-21 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置 |
| US5761121A (en) * | 1996-10-31 | 1998-06-02 | Programmable Microelectronics Corporation | PMOS single-poly non-volatile memory structure |
| US5892709A (en) * | 1997-05-09 | 1999-04-06 | Motorola, Inc. | Single level gate nonvolatile memory device and method for accessing the same |
| US6936849B1 (en) * | 1997-07-29 | 2005-08-30 | Micron Technology, Inc. | Silicon carbide gate transistor |
| US6243289B1 (en) * | 1998-04-08 | 2001-06-05 | Micron Technology Inc. | Dual floating gate programmable read only memory cell structure and method for its fabrication and operation |
| EP0975022A1 (de) * | 1998-07-22 | 2000-01-26 | STMicroelectronics S.r.l. | Herstellungsverfahren für elektronische Bauelemente mit Festwertspeicherzellen und Niederspannungstransistoren, die selbstjustierte Silizidübergänge aufweisen |
| US6025625A (en) * | 1999-02-25 | 2000-02-15 | Worldwide Semiconductor Manufacturing Corporation | Single-poly EEPROM cell structure operations and array architecture |
| WO2000060672A1 (en) * | 1999-03-31 | 2000-10-12 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a non-volatile memory cell |
| US6559007B1 (en) * | 2000-04-06 | 2003-05-06 | Micron Technology, Inc. | Method for forming flash memory device having a tunnel dielectric comprising nitrided oxide |
| WO2003005371A1 (en) * | 2001-07-02 | 2003-01-16 | Infineon Technologies Ag | Charge coupled eeprom device and corresponding method of operation |
| US6700154B1 (en) * | 2002-09-20 | 2004-03-02 | Lattice Semiconductor Corporation | EEPROM cell with trench coupling capacitor |
| JP4390480B2 (ja) * | 2003-06-04 | 2009-12-24 | パナソニック株式会社 | 不揮発性半導体記憶装置 |
-
2002
- 2002-07-25 FR FR0209454A patent/FR2838554B1/fr not_active Expired - Fee Related
-
2003
- 2003-01-31 JP JP2003585189A patent/JP4662529B2/ja not_active Expired - Lifetime
- 2003-01-31 AT AT03709915T patent/ATE449424T1/de not_active IP Right Cessation
- 2003-01-31 WO PCT/FR2003/000311 patent/WO2003088366A1/fr not_active Ceased
- 2003-01-31 US US10/511,712 patent/US7333362B2/en not_active Expired - Lifetime
- 2003-01-31 EP EP03709915A patent/EP1495496B1/de not_active Expired - Lifetime
- 2003-01-31 DE DE60330130T patent/DE60330130D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60330130D1 (de) | 2009-12-31 |
| EP1495496B1 (de) | 2009-11-18 |
| FR2838554B1 (fr) | 2004-07-09 |
| EP1495496A1 (de) | 2005-01-12 |
| FR2838554A1 (fr) | 2003-10-17 |
| JP2005522884A (ja) | 2005-07-28 |
| US7333362B2 (en) | 2008-02-19 |
| US20050219912A1 (en) | 2005-10-06 |
| JP4662529B2 (ja) | 2011-03-30 |
| WO2003088366A1 (fr) | 2003-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |