ATE450345T1 - Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerung - Google Patents
Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerungInfo
- Publication number
- ATE450345T1 ATE450345T1 AT07011957T AT07011957T ATE450345T1 AT E450345 T1 ATE450345 T1 AT E450345T1 AT 07011957 T AT07011957 T AT 07011957T AT 07011957 T AT07011957 T AT 07011957T AT E450345 T1 ATE450345 T1 AT E450345T1
- Authority
- AT
- Austria
- Prior art keywords
- carrier
- housing
- retaining ring
- chemical
- wafer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 230000008878 coupling Effects 0.000 abstract 5
- 238000010168 coupling process Methods 0.000 abstract 5
- 238000005859 coupling reaction Methods 0.000 abstract 5
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 238000009499 grossing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/261,112 US6231428B1 (en) | 1999-03-03 | 1999-03-03 | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| US09/294,547 US6309290B1 (en) | 1999-03-03 | 1999-04-19 | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
| US09/390,142 US6368189B1 (en) | 1999-03-03 | 1999-09-03 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE450345T1 true ATE450345T1 (de) | 2009-12-15 |
Family
ID=22992002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07011957T ATE450345T1 (de) | 1999-03-03 | 2000-02-24 | Chemisch-mechanische polierkopfvorrichtung mit einem schwimmenden waferhaltering und waferträger mit mehrzoniger polierdrucksteuerung |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US6231428B1 (de) |
| JP (2) | JP2008302495A (de) |
| AT (1) | ATE450345T1 (de) |
| DE (1) | DE60043469D1 (de) |
Families Citing this family (74)
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| US6336845B1 (en) | 1997-11-12 | 2002-01-08 | Lam Research Corporation | Method and apparatus for polishing semiconductor wafers |
| US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
| US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
| TW477733B (en) * | 1999-12-17 | 2002-03-01 | Fujikoshi Machinery Corp | Abrasive machine |
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| KR100349216B1 (ko) * | 2000-04-19 | 2002-08-14 | 삼성전자 주식회사 | 화학적 기계적 연마장치의 연마헤드 |
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| KR101839453B1 (ko) * | 2011-08-02 | 2018-03-16 | 엘지디스플레이 주식회사 | 플렉시블 디스플레이 장치의 제조 장비 및 제조 방법 |
| US20130196572A1 (en) * | 2012-01-27 | 2013-08-01 | Sen-Hou Ko | Conditioning a pad in a cleaning module |
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| US9876129B2 (en) * | 2012-05-10 | 2018-01-23 | International Business Machines Corporation | Cone-shaped holes for high efficiency thin film solar cells |
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| JP2014223684A (ja) * | 2013-05-15 | 2014-12-04 | 株式会社東芝 | 研磨装置および研磨方法 |
| US9321143B2 (en) | 2013-10-08 | 2016-04-26 | Seagate Technology Llc | Lapping device with lapping control feature and method |
| JP2015188955A (ja) * | 2014-03-27 | 2015-11-02 | 株式会社荏原製作所 | 研磨装置 |
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| JP6447472B2 (ja) | 2015-11-26 | 2019-01-09 | 株式会社Sumco | ウェーハ研磨方法 |
| US11267099B2 (en) * | 2017-09-27 | 2022-03-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical planarization membrane |
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| JP6917966B2 (ja) * | 2017-10-25 | 2021-08-11 | 株式会社荏原製作所 | 弾性膜のストレッチ動作プログラム、弾性膜のストレッチ動作方法、および研磨装置 |
| JP7219009B2 (ja) * | 2018-03-27 | 2023-02-07 | 株式会社荏原製作所 | 基板保持装置およびドライブリングの製造方法 |
| CN109551365B (zh) * | 2019-01-15 | 2023-12-08 | 合肥哈工普利世智能装备有限公司 | 等离子抛光夹持组件、等离子抛光机及其抛光方法 |
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| CN114734338B (zh) * | 2022-04-07 | 2023-01-10 | 江阴市恒润传动科技有限公司 | 一种双向运动式快速作业的主轴轴承打磨设备 |
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| CN117884989A (zh) * | 2024-03-12 | 2024-04-16 | 成都洁立众泰科技有限公司 | 一种自动化上下料数控工具磨床及加工方法 |
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1999
- 1999-03-03 US US09/261,112 patent/US6231428B1/en not_active Expired - Lifetime
- 1999-04-19 US US09/294,547 patent/US6309290B1/en not_active Expired - Lifetime
-
2000
- 2000-02-24 DE DE60043469T patent/DE60043469D1/de not_active Expired - Fee Related
- 2000-02-24 AT AT07011957T patent/ATE450345T1/de not_active IP Right Cessation
-
2001
- 2001-02-13 US US09/782,818 patent/US20010007810A1/en not_active Abandoned
-
2008
- 2008-08-11 JP JP2008207305A patent/JP2008302495A/ja active Pending
-
2010
- 2010-02-01 JP JP2010020663A patent/JP5185958B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6231428B1 (en) | 2001-05-15 |
| JP2008302495A (ja) | 2008-12-18 |
| DE60043469D1 (de) | 2010-01-14 |
| JP2010120160A (ja) | 2010-06-03 |
| US6309290B1 (en) | 2001-10-30 |
| JP5185958B2 (ja) | 2013-04-17 |
| US20010007810A1 (en) | 2001-07-12 |
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| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |