ATE450888T1 - Herstellung von halbleiteranordnungen mit schottky sperrschichten - Google Patents
Herstellung von halbleiteranordnungen mit schottky sperrschichtenInfo
- Publication number
- ATE450888T1 ATE450888T1 AT02745754T AT02745754T ATE450888T1 AT E450888 T1 ATE450888 T1 AT E450888T1 AT 02745754 T AT02745754 T AT 02745754T AT 02745754 T AT02745754 T AT 02745754T AT E450888 T1 ATE450888 T1 AT E450888T1
- Authority
- AT
- Austria
- Prior art keywords
- schottky barrier
- schottky
- trench
- mask pattern
- electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/40—Devices controlled by magnetic fields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
- H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
- H10D8/605—Schottky-barrier diodes of the trench conductor-insulator-semiconductor barrier type, e.g. trench MOS barrier Schottky rectifiers [TMBS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/146—VDMOS having built-in components the built-in components being Schottky barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/22—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
Landscapes
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0118000.9A GB0118000D0 (en) | 2001-07-24 | 2001-07-24 | Manufacture of semiconductor devices with schottky barriers |
| PCT/IB2002/002892 WO2003010812A1 (en) | 2001-07-24 | 2002-07-24 | Manufacture of semiconductor devices with schottky barriers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE450888T1 true ATE450888T1 (de) | 2009-12-15 |
Family
ID=9919074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02745754T ATE450888T1 (de) | 2001-07-24 | 2002-07-24 | Herstellung von halbleiteranordnungen mit schottky sperrschichten |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6825105B2 (de) |
| EP (1) | EP1415334B1 (de) |
| JP (1) | JP2004522319A (de) |
| KR (1) | KR20040030836A (de) |
| AT (1) | ATE450888T1 (de) |
| DE (1) | DE60234606D1 (de) |
| GB (1) | GB0118000D0 (de) |
| WO (1) | WO2003010812A1 (de) |
Families Citing this family (90)
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|---|---|---|---|---|
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| KR100473476B1 (ko) * | 2002-07-04 | 2005-03-10 | 삼성전자주식회사 | 반도체 장치 및 그 제조방법 |
| US6833556B2 (en) | 2002-08-12 | 2004-12-21 | Acorn Technologies, Inc. | Insulated gate field effect transistor having passivated schottky barriers to the channel |
| US7084423B2 (en) | 2002-08-12 | 2006-08-01 | Acorn Technologies, Inc. | Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
| DE10301693B4 (de) * | 2003-01-17 | 2006-08-24 | Infineon Technologies Ag | MOSFET-Schaltung mit reduzierten Ausgangsspannungs-Schwingungen bei einem Abschaltvorgang |
| US7002187B1 (en) * | 2003-06-09 | 2006-02-21 | Micrel, Inc. | Integrated schottky diode using buried power buss structure and method for making same |
| US6987305B2 (en) * | 2003-08-04 | 2006-01-17 | International Rectifier Corporation | Integrated FET and schottky device |
| DE10342559B3 (de) * | 2003-09-15 | 2005-04-14 | Infineon Technologies Ag | Randstruktur eines Leistungshalbleiterbauelementes und ihr Herstellungsverfahren |
| US6949454B2 (en) * | 2003-10-08 | 2005-09-27 | Texas Instruments Incorporated | Guard ring structure for a Schottky diode |
| US7273771B2 (en) * | 2004-02-09 | 2007-09-25 | International Rectifier Corporation | Common MOSFET process for plural devices |
| US7466005B2 (en) * | 2004-03-11 | 2008-12-16 | International Rectifier Corporation | Recessed termination for trench schottky device without junction curvature |
| JP4832731B2 (ja) * | 2004-07-07 | 2011-12-07 | 株式会社東芝 | 電力用半導体装置 |
| US7492018B2 (en) * | 2004-09-17 | 2009-02-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Isolating substrate noise by forming semi-insulating regions |
| US7667264B2 (en) * | 2004-09-27 | 2010-02-23 | Alpha And Omega Semiconductor Limited | Shallow source MOSFET |
| JP4414863B2 (ja) * | 2004-10-29 | 2010-02-10 | トヨタ自動車株式会社 | 絶縁ゲート型半導体装置およびその製造方法 |
| US7737522B2 (en) * | 2005-02-11 | 2010-06-15 | Alpha & Omega Semiconductor, Ltd. | Trench junction barrier controlled Schottky device with top and bottom doped regions for enhancing forward current in a vertical direction |
| US7671439B2 (en) * | 2005-02-11 | 2010-03-02 | Alpha & Omega Semiconductor, Ltd. | Junction barrier Schottky (JBS) with floating islands |
| US7952139B2 (en) * | 2005-02-11 | 2011-05-31 | Alpha & Omega Semiconductor Ltd. | Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layout |
| CN100550383C (zh) | 2005-07-08 | 2009-10-14 | 松下电器产业株式会社 | 半导体装置和电气设备 |
| EP1909325A4 (de) | 2005-07-25 | 2009-05-06 | Panasonic Corp | Halbleiterelement und elektrische einrichtung |
| CN101233616B (zh) * | 2005-07-26 | 2010-04-14 | 松下电器产业株式会社 | 半导体元件和电气设备 |
| US7250666B2 (en) | 2005-11-15 | 2007-07-31 | International Business Machines Corporation | Schottky barrier diode and method of forming a Schottky barrier diode |
| JP5034461B2 (ja) * | 2006-01-10 | 2012-09-26 | 株式会社デンソー | 半導体装置 |
| US7335927B2 (en) | 2006-01-30 | 2008-02-26 | Internatioanl Business Machines Corporation | Lateral silicided diodes |
| JP2007311557A (ja) * | 2006-05-18 | 2007-11-29 | Toshiba Corp | 半導体装置及びその製造方法 |
| US20070293028A1 (en) * | 2006-06-16 | 2007-12-20 | Chip Integration Tech.Co.,Ltd. | Method of forming low forward voltage Shottky barrier diode with LOCOS structure therein |
| JP5222466B2 (ja) | 2006-08-09 | 2013-06-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP5171232B2 (ja) * | 2006-12-15 | 2013-03-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9437729B2 (en) * | 2007-01-08 | 2016-09-06 | Vishay-Siliconix | High-density power MOSFET with planarized metalization |
| US7800185B2 (en) * | 2007-01-28 | 2010-09-21 | Force-Mos Technology Corp. | Closed trench MOSFET with floating trench rings as termination |
| US20080206944A1 (en) * | 2007-02-23 | 2008-08-28 | Pan-Jit International Inc. | Method for fabricating trench DMOS transistors and schottky elements |
| US7564099B2 (en) * | 2007-03-12 | 2009-07-21 | International Rectifier Corporation | Monolithic MOSFET and Schottky diode device |
| JP2008235399A (ja) * | 2007-03-19 | 2008-10-02 | Toshiba Corp | トレンチ型電力用半導体装置及びその製造方法 |
| US9947770B2 (en) * | 2007-04-03 | 2018-04-17 | Vishay-Siliconix | Self-aligned trench MOSFET and method of manufacture |
| US8058127B2 (en) * | 2007-06-15 | 2011-11-15 | Tae Pok Rhee | Manufacturing method of semiconductor power devices |
| US9484451B2 (en) * | 2007-10-05 | 2016-11-01 | Vishay-Siliconix | MOSFET active area and edge termination area charge balance |
| JP4964797B2 (ja) * | 2008-02-12 | 2012-07-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US20090309181A1 (en) * | 2008-06-12 | 2009-12-17 | Force Mos Technology Co. Ltd. | Trench schottky with multiple epi structure |
| US9093521B2 (en) * | 2008-06-30 | 2015-07-28 | Alpha And Omega Semiconductor Incorporated | Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layout |
| US20100264488A1 (en) * | 2009-04-15 | 2010-10-21 | Force Mos Technology Co. Ltd. | Low Qgd trench MOSFET integrated with schottky rectifier |
| JP4858791B2 (ja) * | 2009-05-22 | 2012-01-18 | 住友電気工業株式会社 | 半導体装置およびその製造方法 |
| US9425306B2 (en) | 2009-08-27 | 2016-08-23 | Vishay-Siliconix | Super junction trench power MOSFET devices |
| US9443974B2 (en) | 2009-08-27 | 2016-09-13 | Vishay-Siliconix | Super junction trench power MOSFET device fabrication |
| US9431530B2 (en) * | 2009-10-20 | 2016-08-30 | Vishay-Siliconix | Super-high density trench MOSFET |
| TWI418015B (zh) * | 2010-05-13 | 2013-12-01 | 科軒微電子股份有限公司 | 具有場效整流元件之功率半導體結構及其製造方法 |
| JP2012174989A (ja) * | 2011-02-23 | 2012-09-10 | Toshiba Corp | 半導体装置の製造方法 |
| JP5639926B2 (ja) | 2011-02-28 | 2014-12-10 | 株式会社日立製作所 | 炭化珪素半導体装置及びその製造方法 |
| CN102184945A (zh) * | 2011-05-03 | 2011-09-14 | 成都芯源系统有限公司 | 一种槽栅型mosfet器件 |
| CN102184853B (zh) * | 2011-05-06 | 2015-12-02 | 上海华虹宏力半导体制造有限公司 | 肖特基二级管的制作方法 |
| US8362585B1 (en) | 2011-07-15 | 2013-01-29 | Alpha & Omega Semiconductor, Inc. | Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging |
| US9614043B2 (en) | 2012-02-09 | 2017-04-04 | Vishay-Siliconix | MOSFET termination trench |
| US9105492B2 (en) | 2012-05-08 | 2015-08-11 | LuxVue Technology Corporation | Compliant micro device transfer head |
| US9034754B2 (en) | 2012-05-25 | 2015-05-19 | LuxVue Technology Corporation | Method of forming a micro device transfer head with silicon electrode |
| US9842911B2 (en) | 2012-05-30 | 2017-12-12 | Vishay-Siliconix | Adaptive charge balanced edge termination |
| US8415768B1 (en) | 2012-07-06 | 2013-04-09 | LuxVue Technology Corporation | Compliant monopolar micro device transfer head with silicon electrode |
| US8569115B1 (en) | 2012-07-06 | 2013-10-29 | LuxVue Technology Corporation | Method of forming a compliant bipolar micro device transfer head with silicon electrodes |
| US8791530B2 (en) | 2012-09-06 | 2014-07-29 | LuxVue Technology Corporation | Compliant micro device transfer head with integrated electrode leads |
| US9255001B2 (en) | 2012-12-10 | 2016-02-09 | LuxVue Technology Corporation | Micro device transfer head array with metal electrodes |
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| JP2014157896A (ja) * | 2013-02-15 | 2014-08-28 | Toyota Central R&D Labs Inc | 半導体装置とその製造方法 |
| US20140335672A1 (en) * | 2013-05-08 | 2014-11-13 | United Microeletronics Corporation | Process for manufacturing semiconductor transistor device |
| WO2014201187A2 (en) | 2013-06-12 | 2014-12-18 | Rohinni, Inc. | Keyboard backlighting with deposited light-generating sources |
| CN104282550B (zh) * | 2013-07-03 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | 肖特基二极管的制造方法 |
| CN104425243B (zh) * | 2013-08-28 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | 一种肖特基二极管的制造工艺方法 |
| CN104517961B (zh) * | 2013-09-29 | 2020-06-05 | 无锡华润上华科技有限公司 | 整流器及其制造方法 |
| CN104701161B (zh) * | 2013-12-06 | 2017-10-24 | 上海华虹宏力半导体制造有限公司 | 一种沟槽型肖特基二极管的制备工艺方法 |
| US9887259B2 (en) | 2014-06-23 | 2018-02-06 | Vishay-Siliconix | Modulated super junction power MOSFET devices |
| CN115483211A (zh) | 2014-08-19 | 2022-12-16 | 维西埃-硅化物公司 | 电子电路 |
| CN106575666B (zh) | 2014-08-19 | 2021-08-06 | 维西埃-硅化物公司 | 超结金属氧化物半导体场效应晶体管 |
| JP6318973B2 (ja) * | 2014-08-20 | 2018-05-09 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| DE102014117780B4 (de) | 2014-12-03 | 2018-06-21 | Infineon Technologies Ag | Halbleiterbauelement mit einer Grabenelektrode und Verfahren zur Herstellung |
| DE102014119465B3 (de) | 2014-12-22 | 2016-05-25 | Infineon Technologies Ag | Halbleitervorrichtung mit streifenförmigen trenchgatestrukturen, transistormesas und diodenmesas |
| WO2017124109A1 (en) | 2016-01-15 | 2017-07-20 | Rohinni, LLC | Apparatus and method of backlighting through a cover on the apparatus |
| US9620611B1 (en) | 2016-06-17 | 2017-04-11 | Acorn Technology, Inc. | MIS contact structure with metal oxide conductor |
| US10170627B2 (en) | 2016-11-18 | 2019-01-01 | Acorn Technologies, Inc. | Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height |
| US10276445B2 (en) * | 2017-08-31 | 2019-04-30 | Taiwan Semiconductor Manfacturing Co., Ltd. | Leakage reduction methods and structures thereof |
| DE102018103973B4 (de) | 2018-02-22 | 2020-12-03 | Infineon Technologies Ag | Siliziumcarbid-halbleiterbauelement |
| JP7107718B2 (ja) * | 2018-03-28 | 2022-07-27 | 株式会社デンソー | スイッチング素子の製造方法 |
| DE102019111308A1 (de) | 2018-05-07 | 2019-11-07 | Infineon Technologies Ag | Siliziumcarbid halbleiterbauelement |
| US10573741B1 (en) * | 2018-09-21 | 2020-02-25 | Sanken Electric Co., Ltd. | Vertical power MOSFET device having doped regions between insulated trenches and a junction arranged therebetween |
| DE102018124740B4 (de) | 2018-10-08 | 2025-08-28 | Infineon Technologies Ag | Verfahren zur herstellung eines halbleiterbauelements |
| US10985248B2 (en) | 2018-11-16 | 2021-04-20 | Infineon Technologies Ag | SiC power semiconductor device with integrated Schottky junction |
| US10903322B2 (en) | 2018-11-16 | 2021-01-26 | Infineon Technologies Ag | SiC power semiconductor device with integrated body diode |
| US10586845B1 (en) | 2018-11-16 | 2020-03-10 | Infineon Technologies Ag | SiC trench transistor device and methods of manufacturing thereof |
| JP6995221B2 (ja) | 2018-12-10 | 2022-01-14 | 三菱電機株式会社 | 炭化珪素半導体装置およびその製造方法 |
| US12080790B2 (en) | 2020-10-28 | 2024-09-03 | Wolfspeed, Inc. | Power semiconductor devices including angled gate trenches |
| US11769828B2 (en) | 2020-10-28 | 2023-09-26 | Wolfspeed, Inc. | Gate trench power semiconductor devices having improved deep shield connection patterns |
| US11610991B2 (en) | 2020-10-28 | 2023-03-21 | Wolfspeed, Inc. | Gate trench power semiconductor devices having improved deep shield connection patterns |
| CN113410284A (zh) * | 2021-05-11 | 2021-09-17 | 松山湖材料实验室 | 碳化硅半导体结构和碳化硅半导体器件 |
| CN113380610A (zh) * | 2021-06-02 | 2021-09-10 | 西安交通大学 | 一种基于自对准工艺的条形沟槽结构GaN垂直肖特基二极管电学性能改善方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2111745B (en) * | 1981-12-07 | 1985-06-19 | Philips Electronic Associated | Insulated-gate field-effect transistors |
| GB2151844A (en) * | 1983-12-20 | 1985-07-24 | Philips Electronic Associated | Semiconductor devices |
| US5225359A (en) * | 1990-08-17 | 1993-07-06 | National Semiconductor Corporation | Method of fabricating Schottky barrier diodes and Schottky barrier diode-clamped transistors |
| US6049108A (en) * | 1995-06-02 | 2000-04-11 | Siliconix Incorporated | Trench-gated MOSFET with bidirectional voltage clamping |
| US5612567A (en) * | 1996-05-13 | 1997-03-18 | North Carolina State University | Schottky barrier rectifiers and methods of forming same |
| JP3618517B2 (ja) | 1997-06-18 | 2005-02-09 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| GB9808234D0 (en) * | 1998-04-17 | 1998-06-17 | Koninkl Philips Electronics Nv | Mnufacture of trench-gate semiconductor devices |
| US6351018B1 (en) * | 1999-02-26 | 2002-02-26 | Fairchild Semiconductor Corporation | Monolithically integrated trench MOSFET and Schottky diode |
| US6399413B1 (en) * | 2000-04-18 | 2002-06-04 | Agere Systems Guardian Corp. | Self aligned gated Schottky diode guard ring structures |
-
2001
- 2001-07-24 GB GBGB0118000.9A patent/GB0118000D0/en not_active Ceased
-
2002
- 2002-07-19 US US10/199,000 patent/US6825105B2/en not_active Expired - Lifetime
- 2002-07-24 JP JP2003516097A patent/JP2004522319A/ja active Pending
- 2002-07-24 EP EP02745754A patent/EP1415334B1/de not_active Expired - Lifetime
- 2002-07-24 WO PCT/IB2002/002892 patent/WO2003010812A1/en not_active Ceased
- 2002-07-24 AT AT02745754T patent/ATE450888T1/de not_active IP Right Cessation
- 2002-07-24 KR KR10-2004-7000956A patent/KR20040030836A/ko not_active Ceased
- 2002-07-24 DE DE60234606T patent/DE60234606D1/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6825105B2 (en) | 2004-11-30 |
| EP1415334B1 (de) | 2009-12-02 |
| JP2004522319A (ja) | 2004-07-22 |
| EP1415334A1 (de) | 2004-05-06 |
| US20030022474A1 (en) | 2003-01-30 |
| GB0118000D0 (en) | 2001-09-19 |
| WO2003010812A1 (en) | 2003-02-06 |
| DE60234606D1 (de) | 2010-01-14 |
| KR20040030836A (ko) | 2004-04-09 |
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