ATE455876T1 - Verfahren zur laserabscheidung - Google Patents

Verfahren zur laserabscheidung

Info

Publication number
ATE455876T1
ATE455876T1 AT01911008T AT01911008T ATE455876T1 AT E455876 T1 ATE455876 T1 AT E455876T1 AT 01911008 T AT01911008 T AT 01911008T AT 01911008 T AT01911008 T AT 01911008T AT E455876 T1 ATE455876 T1 AT E455876T1
Authority
AT
Austria
Prior art keywords
laser beam
carrier
moving
workpiece
relative
Prior art date
Application number
AT01911008T
Other languages
English (en)
Inventor
Kenneth Merdan
Vitaliy Shapovalov
Original Assignee
Boston Scient Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boston Scient Ltd filed Critical Boston Scient Ltd
Application granted granted Critical
Publication of ATE455876T1 publication Critical patent/ATE455876T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041—Digital printing on surfaces other than ordinary paper
    • B41M5/0052—Digital printing on surfaces other than ordinary paper by thermal printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Metallurgy (AREA)
  • Toxicology (AREA)
  • Media Introduction/Drainage Providing Device (AREA)
  • Chemical Vapour Deposition (AREA)
  • Materials For Medical Uses (AREA)
  • Physical Vapour Deposition (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Laser Beam Processing (AREA)
AT01911008T 2000-02-25 2001-02-21 Verfahren zur laserabscheidung ATE455876T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/513,547 US6440503B1 (en) 2000-02-25 2000-02-25 Laser deposition of elements onto medical devices
PCT/US2001/005437 WO2001063001A2 (en) 2000-02-25 2001-02-21 Laser deposition process

Publications (1)

Publication Number Publication Date
ATE455876T1 true ATE455876T1 (de) 2010-02-15

Family

ID=24043730

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01911008T ATE455876T1 (de) 2000-02-25 2001-02-21 Verfahren zur laserabscheidung

Country Status (8)

Country Link
US (2) US6440503B1 (de)
EP (1) EP1257682B1 (de)
JP (1) JP2003524074A (de)
AT (1) ATE455876T1 (de)
CA (1) CA2400928C (de)
DE (1) DE60141119D1 (de)
ES (1) ES2339217T3 (de)
WO (1) WO2001063001A2 (de)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7713297B2 (en) 1998-04-11 2010-05-11 Boston Scientific Scimed, Inc. Drug-releasing stent with ceramic-containing layer
US6583381B1 (en) * 1999-05-24 2003-06-24 Potomac Photonics, Inc. Apparatus for fabrication of miniature structures
AU2002345328A1 (en) 2001-06-27 2003-03-03 Remon Medical Technologies Ltd. Method and device for electrochemical formation of therapeutic species in vivo
US6911016B2 (en) * 2001-08-06 2005-06-28 Scimed Life Systems, Inc. Guidewire extension system
SG122749A1 (en) * 2001-10-16 2006-06-29 Inst Data Storage Method of laser marking and apparatus therefor
US6841213B2 (en) * 2002-12-27 2005-01-11 Scimed Life Systems, Inc Fiber pattern printing
US7306616B2 (en) 2003-05-05 2007-12-11 Boston Scientific Scimed, Inc. Balloon catheter and method of making same
US20050131522A1 (en) * 2003-12-10 2005-06-16 Stinson Jonathan S. Medical devices and methods of making the same
US20050181116A1 (en) * 2004-02-18 2005-08-18 Rob Worsham Method for coating a medical device using a matrix assisted pulsed-laser evaporation technique and associated system and medical device
US20050181141A1 (en) * 2004-02-18 2005-08-18 Aiden Flanagan Laser-induced explosive vaporization coating method, associated system, and device made by the method
US20050188921A1 (en) * 2004-02-27 2005-09-01 Anthony Malone Matrix assisted pulsed-laser evaporation technique for coating a medical device and associated system and medical device
US8202245B2 (en) * 2005-01-26 2012-06-19 Boston Scientific Scimed, Inc. Medical devices and methods of making the same
US7295879B2 (en) * 2005-06-24 2007-11-13 Kenergy, Inc. Double helical antenna assembly for a wireless intravascular medical device
US20070075060A1 (en) * 2005-09-30 2007-04-05 Shedlov Matthew S Method of manufacturing a medical device from a workpiece using a pulsed beam of radiation or particles having an adjustable pulse frequency
US7749265B2 (en) 2005-10-05 2010-07-06 Kenergy, Inc. Radio frequency antenna for a wireless intravascular medical device
US8840660B2 (en) 2006-01-05 2014-09-23 Boston Scientific Scimed, Inc. Bioerodible endoprostheses and methods of making the same
US8089029B2 (en) 2006-02-01 2012-01-03 Boston Scientific Scimed, Inc. Bioabsorbable metal medical device and method of manufacture
US20070224235A1 (en) 2006-03-24 2007-09-27 Barron Tenney Medical devices having nanoporous coatings for controlled therapeutic agent delivery
US8187620B2 (en) 2006-03-27 2012-05-29 Boston Scientific Scimed, Inc. Medical devices comprising a porous metal oxide or metal material and a polymer coating for delivering therapeutic agents
US8048150B2 (en) 2006-04-12 2011-11-01 Boston Scientific Scimed, Inc. Endoprosthesis having a fiber meshwork disposed thereon
US8815275B2 (en) 2006-06-28 2014-08-26 Boston Scientific Scimed, Inc. Coatings for medical devices comprising a therapeutic agent and a metallic material
US8771343B2 (en) 2006-06-29 2014-07-08 Boston Scientific Scimed, Inc. Medical devices with selective titanium oxide coatings
EP2054537A2 (de) 2006-08-02 2009-05-06 Boston Scientific Scimed, Inc. Endoprothese mit dreidimensionaler desintegrationssteuerung
ATE508708T1 (de) 2006-09-14 2011-05-15 Boston Scient Ltd Medizinprodukte mit wirkstofffreisetzender beschichtung
EP2121068B1 (de) 2006-09-15 2010-12-08 Boston Scientific Scimed, Inc. Biologisch erodierbare endoprothese mit biostabilen anorganischen schichten
EP2959925B1 (de) 2006-09-15 2018-08-29 Boston Scientific Limited Medizinische vorrichtungen und verfahren zu ihrer herstellung
CA2663250A1 (en) 2006-09-15 2008-03-20 Boston Scientific Limited Bioerodible endoprostheses and methods of making the same
JP2010503494A (ja) 2006-09-15 2010-02-04 ボストン サイエンティフィック リミテッド 生分解性内部人工器官およびその製造方法
US7633035B2 (en) * 2006-10-05 2009-12-15 Mu-Gahat Holdings Inc. Reverse side film laser circuit etching
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US7857786B2 (en) * 2006-11-03 2010-12-28 Cook Incorporated Balloon catheter having improved balloon folding capability
US7981150B2 (en) 2006-11-09 2011-07-19 Boston Scientific Scimed, Inc. Endoprosthesis with coatings
CA2674195A1 (en) 2006-12-28 2008-07-10 Boston Scientific Limited Bioerodible endoprostheses and methods of making same
US8431149B2 (en) 2007-03-01 2013-04-30 Boston Scientific Scimed, Inc. Coated medical devices for abluminal drug delivery
US8070797B2 (en) 2007-03-01 2011-12-06 Boston Scientific Scimed, Inc. Medical device with a porous surface for delivery of a therapeutic agent
US8067054B2 (en) 2007-04-05 2011-11-29 Boston Scientific Scimed, Inc. Stents with ceramic drug reservoir layer and methods of making and using the same
US7976915B2 (en) 2007-05-23 2011-07-12 Boston Scientific Scimed, Inc. Endoprosthesis with select ceramic morphology
US8002823B2 (en) 2007-07-11 2011-08-23 Boston Scientific Scimed, Inc. Endoprosthesis coating
US7942926B2 (en) 2007-07-11 2011-05-17 Boston Scientific Scimed, Inc. Endoprosthesis coating
JP2010533563A (ja) 2007-07-19 2010-10-28 ボストン サイエンティフィック リミテッド 吸着抑制表面を有する内部人工器官
US8815273B2 (en) 2007-07-27 2014-08-26 Boston Scientific Scimed, Inc. Drug eluting medical devices having porous layers
US7931683B2 (en) 2007-07-27 2011-04-26 Boston Scientific Scimed, Inc. Articles having ceramic coated surfaces
US8221822B2 (en) 2007-07-31 2012-07-17 Boston Scientific Scimed, Inc. Medical device coating by laser cladding
JP2010535541A (ja) 2007-08-03 2010-11-25 ボストン サイエンティフィック リミテッド 広い表面積を有する医療器具用のコーティング
US20090061251A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by additive deposition
US20090061112A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by subtractive deposition
US8052745B2 (en) 2007-09-13 2011-11-08 Boston Scientific Scimed, Inc. Endoprosthesis
US8029554B2 (en) 2007-11-02 2011-10-04 Boston Scientific Scimed, Inc. Stent with embedded material
US7938855B2 (en) 2007-11-02 2011-05-10 Boston Scientific Scimed, Inc. Deformable underlayer for stent
US8216632B2 (en) 2007-11-02 2012-07-10 Boston Scientific Scimed, Inc. Endoprosthesis coating
EP2271380B1 (de) 2008-04-22 2013-03-20 Boston Scientific Scimed, Inc. Medizinprodukte mit einer beschichtung aus anorganischem material
WO2009132176A2 (en) 2008-04-24 2009-10-29 Boston Scientific Scimed, Inc. Medical devices having inorganic particle layers
EP2276518A2 (de) * 2008-05-01 2011-01-26 Boston Scientific Scimed, Inc. Mit wirkstoff beladene medizinische vorrichtungen und verfahren zur herstellung von wirkstoffbeladenen medizinischen vorrichtungen
US8236046B2 (en) 2008-06-10 2012-08-07 Boston Scientific Scimed, Inc. Bioerodible endoprosthesis
US8449603B2 (en) 2008-06-18 2013-05-28 Boston Scientific Scimed, Inc. Endoprosthesis coating
US20090326525A1 (en) * 2008-06-26 2009-12-31 Jessica Hixon Laser fiber capillary apparatus and method
US7985252B2 (en) * 2008-07-30 2011-07-26 Boston Scientific Scimed, Inc. Bioerodible endoprosthesis
US8382824B2 (en) 2008-10-03 2013-02-26 Boston Scientific Scimed, Inc. Medical implant having NANO-crystal grains with barrier layers of metal nitrides or fluorides
US8231980B2 (en) 2008-12-03 2012-07-31 Boston Scientific Scimed, Inc. Medical implants including iridium oxide
US8267992B2 (en) 2009-03-02 2012-09-18 Boston Scientific Scimed, Inc. Self-buffering medical implants
US8071156B2 (en) 2009-03-04 2011-12-06 Boston Scientific Scimed, Inc. Endoprostheses
US8287937B2 (en) 2009-04-24 2012-10-16 Boston Scientific Scimed, Inc. Endoprosthese
US20110160839A1 (en) * 2009-12-29 2011-06-30 Boston Scientific Scimed, Inc. Endoprosthesis
WO2011119573A1 (en) 2010-03-23 2011-09-29 Boston Scientific Scimed, Inc. Surface treated bioerodible metal endoprostheses
DE102010027927B9 (de) * 2010-04-19 2012-05-03 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Laserbearbeitungsmaschine und Verfahren zum Umrüsten derselben
KR101669087B1 (ko) * 2011-07-29 2016-10-25 후루카와 덴키 고교 가부시키가이샤 전해 동합금박, 그 제조 방법, 그것의 제조에 이용하는 전해액, 그것을 이용한 2차 전지용 음극 집전체, 2차 전지 및 그 전극
US9450696B2 (en) * 2012-05-23 2016-09-20 Vadum, Inc. Photonic compressive sensing receiver
CN105705671B (zh) * 2013-10-14 2019-10-29 奥宝科技股份有限公司 多组成材料结构的lift印刷
US9624779B2 (en) 2013-10-15 2017-04-18 General Electric Company Thermal management article and method of forming the same, and method of thermal management of a substrate
US9925797B2 (en) 2014-08-07 2018-03-27 Orbotech Ltd. Lift printing system
WO2016063270A1 (en) 2014-10-19 2016-04-28 Orbotech Ltd. Llift printing of conductive traces onto a semiconductor substrate
US10633758B2 (en) 2015-01-19 2020-04-28 Orbotech Ltd. Printing of three-dimensional metal structures with a sacrificial support
US10471538B2 (en) 2015-07-09 2019-11-12 Orbotech Ltd. Control of lift ejection angle
WO2017085712A1 (en) 2015-11-22 2017-05-26 Orbotech Ltd Control of surface properties of printed three-dimensional structures
CN110582242B (zh) 2017-05-03 2023-03-10 美敦力瓦斯科尔勒公司 组织移除导管
US11690645B2 (en) 2017-05-03 2023-07-04 Medtronic Vascular, Inc. Tissue-removing catheter
TW201901887A (zh) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 於未事先圖樣化基板上電器互連電路元件
DE102018005010A1 (de) * 2017-07-13 2019-01-17 Wika Alexander Wiegand Se & Co. Kg Transfer und Aufschmelzen von Schichten
CN118697424A (zh) 2018-11-16 2024-09-27 美敦力瓦斯科尔勒公司 组织去除导管
US11819236B2 (en) 2019-05-17 2023-11-21 Medtronic Vascular, Inc. Tissue-removing catheter
US20220347778A1 (en) * 2020-06-28 2022-11-03 Orbotech Ltd. Laser Printing of Solder Pastes
US11999107B2 (en) * 2020-12-23 2024-06-04 Cornell University Controlled molten metal deposition

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4190759A (en) * 1975-08-27 1980-02-26 Hitachi, Ltd. Processing of photomask
US4752455A (en) * 1986-05-27 1988-06-21 Kms Fusion, Inc. Pulsed laser microfabrication
US4970196A (en) 1987-01-15 1990-11-13 The Johns Hopkins University Method and apparatus for the thin film deposition of materials with a high power pulsed laser
US4895735A (en) * 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
JPH0361366A (ja) * 1989-07-28 1991-03-18 Matsushita Electric Ind Co Ltd レーザースパッタリング装置
US4987006A (en) 1990-03-26 1991-01-22 Amp Incorporated Laser transfer deposition
JPH04104903A (ja) 1990-08-21 1992-04-07 Kokusai Chodendo Sangyo Gijutsu Kenkyu Center 酸化物高温超電導薄膜の製造方法
DE4232373A1 (de) 1992-09-03 1994-03-10 Deutsche Forsch Luft Raumfahrt Verfahren zum Auftragen strukturierter Schichten
DE4229399C2 (de) 1992-09-03 1999-05-27 Deutsch Zentr Luft & Raumfahrt Verfahren und Vorrichtung zum Herstellen einer Funktionsstruktur eines Halbleiterbauelements
JPH06172979A (ja) 1992-12-08 1994-06-21 Matsushita Electric Ind Co Ltd 薄膜パターン形成装置
FR2709763B1 (fr) 1993-09-08 1995-10-13 Commissariat Energie Atomique Dispositif de traitement d'un matériau, à tête photo-ionique miniaturisée.
US5683601A (en) 1994-10-24 1997-11-04 Panasonic Technologies, Inc. Laser ablation forward metal deposition with electrostatic assisted bonding
US5567336A (en) * 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US6025110A (en) * 1997-09-18 2000-02-15 Nowak; Michael T. Method and apparatus for generating three-dimensional objects using ablation transfer
US6121991A (en) * 1998-06-23 2000-09-19 Eastman Kodak Company Forming authenticated images in a receiver
US6583381B1 (en) * 1999-05-24 2003-06-24 Potomac Photonics, Inc. Apparatus for fabrication of miniature structures
US6649861B2 (en) * 2000-05-24 2003-11-18 Potomac Photonics, Inc. Method and apparatus for fabrication of miniature structures

Also Published As

Publication number Publication date
US20020182344A1 (en) 2002-12-05
WO2001063001A2 (en) 2001-08-30
JP2003524074A (ja) 2003-08-12
EP1257682B1 (de) 2010-01-20
EP1257682A2 (de) 2002-11-20
CA2400928A1 (en) 2001-08-30
CA2400928C (en) 2010-10-12
DE60141119D1 (de) 2010-03-11
ES2339217T3 (es) 2010-05-18
WO2001063001A3 (en) 2001-12-13
US6723390B2 (en) 2004-04-20
US6440503B1 (en) 2002-08-27

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