ATE456419T1 - Laserbearbeitungsvorrichtung - Google Patents

Laserbearbeitungsvorrichtung

Info

Publication number
ATE456419T1
ATE456419T1 AT08251289T AT08251289T ATE456419T1 AT E456419 T1 ATE456419 T1 AT E456419T1 AT 08251289 T AT08251289 T AT 08251289T AT 08251289 T AT08251289 T AT 08251289T AT E456419 T1 ATE456419 T1 AT E456419T1
Authority
AT
Austria
Prior art keywords
incident
laser beams
paths
laser
passed
Prior art date
Application number
AT08251289T
Other languages
English (en)
Inventor
Kyu Dong Sung
Original Assignee
Eo Technics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eo Technics Co Ltd filed Critical Eo Technics Co Ltd
Application granted granted Critical
Publication of ATE456419T1 publication Critical patent/ATE456419T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multi-focusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Laser Surgery Devices (AREA)
  • Mechanical Optical Scanning Systems (AREA)
AT08251289T 2007-05-02 2008-04-02 Laserbearbeitungsvorrichtung ATE456419T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070042752A KR100817825B1 (ko) 2007-05-02 2007-05-02 레이저 가공장치

Publications (1)

Publication Number Publication Date
ATE456419T1 true ATE456419T1 (de) 2010-02-15

Family

ID=39412063

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08251289T ATE456419T1 (de) 2007-05-02 2008-04-02 Laserbearbeitungsvorrichtung

Country Status (10)

Country Link
US (1) US7688877B2 (de)
EP (1) EP1987911B1 (de)
JP (1) JP2008272830A (de)
KR (1) KR100817825B1 (de)
CN (1) CN101298118B (de)
AT (1) ATE456419T1 (de)
DE (1) DE602008000601D1 (de)
MY (1) MY145353A (de)
SG (1) SG147371A1 (de)
TW (1) TWI392553B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100945167B1 (ko) * 2009-04-28 2010-03-08 주식회사 루트로닉 펄스로 동작하는 레이저 시스템에서의 제2 조화파 펄스 출력 안정화 장치
DE202009006589U1 (de) * 2009-05-06 2009-08-27 Mauser-Werke Oberndorf Maschinenbau Gmbh Laserstation und Laseranlage
CN102248805B (zh) * 2010-05-21 2015-05-27 深圳泰德激光科技有限公司 激光打标装置及打标分光方法
JP2012040573A (ja) * 2010-08-16 2012-03-01 Fuji Electric Co Ltd 試料の微細加工方法
EP2478990B1 (de) * 2011-01-21 2019-04-17 Leister Technologies AG Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens
US9442286B2 (en) 2011-12-22 2016-09-13 Intel Corporation Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate
KR101437540B1 (ko) * 2014-03-31 2014-09-05 (주)라메디텍 멀티 기능의 의료용 레이저 조사 장치
CN104297926A (zh) * 2014-11-12 2015-01-21 核工业理化工程研究院 高功率激光分光光纤装置
KR102131685B1 (ko) * 2018-02-08 2020-07-08 주식회사 이오테크닉스 이중 스캐너를 이용한 연속 가공 장치 및 연속 가공 방법
CN110977157B (zh) * 2019-12-20 2025-01-14 伊欧激光科技（苏州）有限公司 带有功率校正功能的激光加工系统
TWI705869B (zh) * 2019-12-31 2020-10-01 星雲電腦股份有限公司 雷射整合切換裝置
CN113146062A (zh) * 2020-01-03 2021-07-23 星云电脑股份有限公司 雷射整合切换装置
JP2022105463A (ja) * 2021-01-02 2022-07-14 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
DE102024112132A1 (de) * 2024-04-30 2025-10-30 TRUMPF Laser SE Bearbeitungskopf für eine Laserbearbeitungsanlage mit gemeinsamer Fokussierung mehrerer Teilstrahlen, Laserbearbeitungsanlage damit und Verfahren zu Materialbearbeitung

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101683A (ja) * 1985-10-30 1987-05-12 Nippon Denso Co Ltd 蓄熱装置
JPS62280714A (ja) * 1986-05-29 1987-12-05 Fuji Xerox Co Ltd マルチビ−ム走査光学系
US4710591A (en) * 1986-10-06 1987-12-01 Unisys Corporation EMI/RFI shielding assembly for cathode ray tube monitors
JPH0215887A (ja) * 1988-06-30 1990-01-19 Toshiba Corp レーザマーキング装置
JP2755400B2 (ja) * 1988-11-15 1998-05-20 シチズン時計株式会社 描画装置
JP2559947B2 (ja) * 1992-05-26 1996-12-04 新日本製鐵株式会社 薄肉鋳片鋳造用冷却ドラムのディンプル加工装置および加工方法
JPH05329677A (ja) * 1992-06-03 1993-12-14 Matsushita Electric Ind Co Ltd レーザ光学装置
DE4426107A1 (de) * 1993-08-11 1995-02-16 Asahi Optical Co Ltd Laser-Zeicheneinrichtung
EP0749047A4 (de) * 1994-12-28 1997-06-11 Shinozaki Manufacturing Co Ltd Verfahren und vorrichtung zum bearbeiten von walzen und dergleichen mittels laserstrahlbehandlung
DE19707834A1 (de) * 1996-04-09 1997-10-16 Zeiss Carl Fa Materialbestrahlungsgerät und Verfahren zum Betrieb von Materialbestrahlungsgeräten
DE19630607C1 (de) * 1996-07-29 1997-10-23 Microlas Lasersystem Gmbh Vorrichtung zum Überwachen der Energie eines Laserstrahls
DE69737991T2 (de) 1996-11-20 2008-04-30 Ibiden Co., Ltd., Ogaki Laserbearbeitungsvorrichtung, verfahren und vorrichtung zur herstellung einer mehrschichtigen, gedruckten leiterplatte
US5798867A (en) * 1997-02-04 1998-08-25 Miyachi Technos Corporation Laser beam-splitting apparatus
JP3213882B2 (ja) * 1997-03-21 2001-10-02 住友重機械工業株式会社 レーザ加工装置及び加工方法
JP3468660B2 (ja) * 1997-03-27 2003-11-17 三菱電機株式会社 レーザビーム分岐装置
JPH115186A (ja) * 1997-06-13 1999-01-12 Minolta Co Ltd レーザー加工機
JP2000108141A (ja) * 1998-10-07 2000-04-18 Shinozaki Seisakusho:Kk 金型の残渣除去方法及び残渣除去装置
JP4038988B2 (ja) * 2001-02-06 2008-01-30 株式会社トッパンＮｅｃサーキットソリューションズ 多層プリント配線板用レーザ孔あけ加工機
US6770546B2 (en) * 2001-07-30 2004-08-03 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP2003200279A (ja) * 2001-10-24 2003-07-15 Seiko Epson Corp 基板の電気配線切断方法及びその装置、並びに電子デバイスの製造方法及びその装置
KR100457565B1 (ko) * 2002-07-29 2004-11-18 엘지전자 주식회사 레이저 수리 장치 및 방법
JP4662411B2 (ja) * 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
JP2004306101A (ja) * 2003-04-08 2004-11-04 Canon Sales Co Inc レーザ加工装置及びレーザ加工方法
JP2006026699A (ja) * 2004-07-16 2006-02-02 Mitsubishi Electric Corp レーザ加工装置および方法
KR100723935B1 (ko) * 2005-10-18 2007-05-31 주식회사 한광옵토 레이저 패턴 가공 장치
KR100709171B1 (ko) * 2005-11-08 2007-04-18 주식회사 이오테크닉스 레이저 빔 분할을 이용한 레이저 가공 장치
CN1820888A (zh) * 2006-03-24 2006-08-23 华中科技大学 一种医药用薄型材料的激光在线打孔的方法和装置

Also Published As

Publication number Publication date
MY145353A (en) 2012-01-31
TW200927349A (en) 2009-07-01
EP1987911A1 (de) 2008-11-05
CN101298118B (zh) 2012-08-22
KR100817825B1 (ko) 2008-03-31
TWI392553B (zh) 2013-04-11
DE602008000601D1 (de) 2010-03-18
US7688877B2 (en) 2010-03-30
JP2008272830A (ja) 2008-11-13
CN101298118A (zh) 2008-11-05
SG147371A1 (en) 2008-11-28
US20080279248A1 (en) 2008-11-13
EP1987911B1 (de) 2010-01-27

Similar Documents

Publication Publication Date Title
ATE456419T1 (de) Laserbearbeitungsvorrichtung
ATE439939T1 (de) Multilasersystem
JP2012192459A5 (ja) レーザ加工装置
IL246806B (en) Diode laser based broad band light sources for wafer inspection tools
TW201613710A (en) Method and device for laser-based machining of planar, crystalline substrates, in particular of semiconductor substrates
WO2007041460A3 (en) Method and system for laser machining
MX2015013690A (es) Aparato para inspeccion de porciones soldadas y metodo de inspeccion de las mismas.
MY177496A (en) Laser processing apparatus
TW200721285A (en) Laser processing method for wafer
JP2015529161A5 (de)
ATE507434T1 (de) Beleuchtungsvorrichtung
WO2014060270A3 (de) Optikanordnung und lichtmikroskop
BR112015024725B8 (pt) Aparelho para inspeção de porção soldada e método de inspeção da mesma
HUE059800T2 (hu) Eljárás anyagmegmunkáló gép lézernyalábjának terjedési útja mentén elhelyezett optikai elem mûködési állapotának detektálására, valamint az eljárást végrehajtó rendszerrel ellátott lézeres megmunkáló gép
EP1909366A4 (de) Lichtbestrahlungseinrichtung und schweissverfahren
EP2058688A3 (de) Strahleinstellungsoptik
TW201343298A (zh) 雷射加工裝置
WO2011032129A8 (en) Multiple laser beam focusing head
KR101262859B1 (ko) 레이저를 이용한 대상물 가공 장치
FI20115654A0 (fi) Valaistus valoherkkien biologisten prosessien aktivoimiseksi
EP2572183A4 (de) Vorrichtung zur auswahl eines bestimmten materials
TW200711773A (en) Laser beam machining method and apparatus
EA201490237A1 (ru) Устройство для маркировки
TW201611933A (en) Laser beam splitting angle pick-up device
TW200726565A (en) Laser processing apparatus using laser beam splitting

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties