ATE460436T1 - Fluorierte polymere mit polycyclischen gruppen mit annelierten 4-gliedrigen heterocyclischen ringen, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahren - Google Patents
Fluorierte polymere mit polycyclischen gruppen mit annelierten 4-gliedrigen heterocyclischen ringen, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahrenInfo
- Publication number
- ATE460436T1 ATE460436T1 AT03785133T AT03785133T ATE460436T1 AT E460436 T1 ATE460436 T1 AT E460436T1 AT 03785133 T AT03785133 T AT 03785133T AT 03785133 T AT03785133 T AT 03785133T AT E460436 T1 ATE460436 T1 AT E460436T1
- Authority
- AT
- Austria
- Prior art keywords
- microlithograpy
- annated
- membed
- photoresists
- methods
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- 229920002313 fluoropolymer Polymers 0.000 title 1
- 239000000203 mixture Substances 0.000 abstract 3
- 229920000642 polymer Polymers 0.000 abstract 3
- 125000001845 4 membered carbocyclic group Chemical group 0.000 abstract 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 150000001336 alkenes Chemical class 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 238000003384 imaging method Methods 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract 1
- 125000003367 polycyclic group Chemical group 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F14/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F14/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/26—Tetrafluoroethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
- C08F220/24—Esters containing halogen containing perhaloalkyl radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
- C08F232/08—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40235002P | 2002-08-09 | 2002-08-09 | |
| US44050403P | 2003-01-16 | 2003-01-16 | |
| PCT/US2003/025022 WO2004014964A2 (en) | 2002-08-09 | 2003-08-08 | PHOTORESISTS, FLUORINATED POLYMERS AND PROCESSES FOR 157 nm MICROLITHOGRAPHY |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE460436T1 true ATE460436T1 (de) | 2010-03-15 |
Family
ID=31720593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03785133T ATE460436T1 (de) | 2002-08-09 | 2003-08-08 | Fluorierte polymere mit polycyclischen gruppen mit annelierten 4-gliedrigen heterocyclischen ringen, die zur verwendung als photoresists geeignet sind, und mikrolithographieverfahren |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7264914B2 (de) |
| EP (1) | EP1546221B1 (de) |
| JP (1) | JP4610335B2 (de) |
| KR (1) | KR20050069979A (de) |
| CN (1) | CN1675264A (de) |
| AT (1) | ATE460436T1 (de) |
| AU (1) | AU2003259727A1 (de) |
| DE (1) | DE60331667D1 (de) |
| TW (1) | TW200418883A (de) |
| WO (1) | WO2004014964A2 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004078688A1 (ja) * | 2003-03-06 | 2004-09-16 | Nec Corporation | 脂環式不飽和化合物、重合体、化学増幅レジスト組成物、及び該組成物を用いたパターン形成方法 |
| EP1505439A3 (de) | 2003-07-24 | 2005-04-20 | Fuji Photo Film Co., Ltd. | Positiv arbeitende photoempfindliche Zusammensetzung und Verfahren zur Herstellung eines Resistmusters |
| KR20070119671A (ko) * | 2005-03-11 | 2007-12-20 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 광형상화가능, 열경화가능 불화 레지스트 |
| JP5225555B2 (ja) * | 2006-04-27 | 2013-07-03 | 東京応化工業株式会社 | 液浸露光用レジスト組成物およびレジストパターン形成方法 |
| JP4862033B2 (ja) * | 2007-12-19 | 2012-01-25 | 旭化成株式会社 | 光吸収性を有するモールド、該モールドを利用する感光性樹脂のパターン形成方法、及び印刷版の製造方法 |
| JP5449909B2 (ja) * | 2008-08-04 | 2014-03-19 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP2010106118A (ja) * | 2008-10-29 | 2010-05-13 | Sumitomo Chemical Co Ltd | 重合体及びフォトレジスト組成物 |
| WO2012084745A1 (en) * | 2010-12-21 | 2012-06-28 | Solvay Specialty Polymers Italy S.P.A. | Process for producing fluorinated organic compounds |
| KR102433038B1 (ko) * | 2014-06-03 | 2022-08-18 | 더 케무어스 컴퍼니 에프씨, 엘엘씨 | 광가교결합된 플루오로중합체를 포함하는 패시베이션 층 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2928865A (en) * | 1957-03-25 | 1960-03-15 | Du Pont | Fluorinated tricyclononanes and tetracycloundecanes |
| DE69022016T2 (de) * | 1989-07-07 | 1996-04-25 | Daikin Ind Ltd | Fluoriniertes copolymer und verfahren zu seiner herstellung. |
| US5229473A (en) * | 1989-07-07 | 1993-07-20 | Daikin Industries Ltd. | Fluorine-containing copolymer and method of preparing the same |
| US6232417B1 (en) * | 1996-03-07 | 2001-05-15 | The B. F. Goodrich Company | Photoresist compositions comprising polycyclic polymers with acid labile pendant groups |
| EP1131677B1 (de) * | 1998-09-23 | 2005-08-03 | E.I. Dupont De Nemours And Company | Photoresists, polymere und verfahren für die mikrolithographie |
| US6764809B2 (en) | 2000-10-12 | 2004-07-20 | North Carolina State University | CO2-processes photoresists, polymers, and photoactive compounds for microlithography |
| JP2004512396A (ja) * | 2000-10-18 | 2004-04-22 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | マイクロリソグラフィー用組成物 |
| US7045268B2 (en) * | 2000-11-29 | 2006-05-16 | E.I. Du Pont De Nemours And Company | Polymers blends and their use in photoresist compositions for microlithography |
| WO2002044815A2 (en) * | 2000-11-29 | 2002-06-06 | E. I. Du Pont De Nemours And Company | Multilayer elements containing photoresist compositions and their use in microlithography |
| EP1246013A3 (de) * | 2001-03-30 | 2003-11-19 | E.I. Du Pont De Nemours And Company | Photoresists, Polymere und Verfahren für die Mikrolithographie |
| KR20040018342A (ko) * | 2001-03-30 | 2004-03-03 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 미세석판인쇄를 위한 폴리시클릭 불소-함유 중합체 및포토레지스트 |
| JP2003252928A (ja) * | 2002-02-27 | 2003-09-10 | Nec Corp | フッ素含有アセタールまたはケタール構造を有する単量体、重合体、ならびに化学増幅型レジスト組成物 |
| KR20050099494A (ko) * | 2002-08-09 | 2005-10-13 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 플루오르화 단량체, 포토레지스트로서 유용한 4원헤테로시클릭 접합 고리를 갖는 폴리시클릭기를 함유하는플루오르화 중합체, 및 마이크로리소그래피법 |
-
2003
- 2003-08-08 AU AU2003259727A patent/AU2003259727A1/en not_active Abandoned
- 2003-08-08 US US10/523,491 patent/US7264914B2/en not_active Expired - Fee Related
- 2003-08-08 EP EP03785133A patent/EP1546221B1/de not_active Expired - Lifetime
- 2003-08-08 KR KR1020057002241A patent/KR20050069979A/ko not_active Withdrawn
- 2003-08-08 WO PCT/US2003/025022 patent/WO2004014964A2/en not_active Ceased
- 2003-08-08 DE DE60331667T patent/DE60331667D1/de not_active Expired - Lifetime
- 2003-08-08 CN CNA038192993A patent/CN1675264A/zh active Pending
- 2003-08-08 AT AT03785133T patent/ATE460436T1/de not_active IP Right Cessation
- 2003-08-08 JP JP2004527971A patent/JP4610335B2/ja not_active Expired - Fee Related
- 2003-08-11 TW TW092121993A patent/TW200418883A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1546221B1 (de) | 2010-03-10 |
| EP1546221A4 (de) | 2008-06-18 |
| AU2003259727A1 (en) | 2004-02-25 |
| EP1546221A2 (de) | 2005-06-29 |
| DE60331667D1 (de) | 2010-04-22 |
| AU2003259727A8 (en) | 2004-02-25 |
| US20050277052A1 (en) | 2005-12-15 |
| WO2004014964A2 (en) | 2004-02-19 |
| JP2005535753A (ja) | 2005-11-24 |
| TW200418883A (en) | 2004-10-01 |
| JP4610335B2 (ja) | 2011-01-12 |
| WO2004014964A3 (en) | 2004-03-18 |
| CN1675264A (zh) | 2005-09-28 |
| US7264914B2 (en) | 2007-09-04 |
| KR20050069979A (ko) | 2005-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |