ATE462290T1 - Konditionierung von durchgangslöchern - Google Patents

Konditionierung von durchgangslöchern

Info

Publication number
ATE462290T1
ATE462290T1 AT00992512T AT00992512T ATE462290T1 AT E462290 T1 ATE462290 T1 AT E462290T1 AT 00992512 T AT00992512 T AT 00992512T AT 00992512 T AT00992512 T AT 00992512T AT E462290 T1 ATE462290 T1 AT E462290T1
Authority
AT
Austria
Prior art keywords
composition
hole
holes
coated
carbon
Prior art date
Application number
AT00992512T
Other languages
English (en)
Inventor
Michael Carano
Frank Polakovic
Original Assignee
Omg Electronic Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omg Electronic Chemicals Inc filed Critical Omg Electronic Chemicals Inc
Application granted granted Critical
Publication of ATE462290T1 publication Critical patent/ATE462290T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Building Environments (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Detergent Compositions (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
  • Paints Or Removers (AREA)
AT00992512T 2000-01-06 2000-11-16 Konditionierung von durchgangslöchern ATE462290T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/478,587 US6375731B1 (en) 2000-01-06 2000-01-06 Conditioning of through holes and glass
PCT/US2000/042189 WO2001050821A2 (en) 2000-01-06 2000-11-16 Conditioning of through holes and glass

Publications (1)

Publication Number Publication Date
ATE462290T1 true ATE462290T1 (de) 2010-04-15

Family

ID=23900523

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00992512T ATE462290T1 (de) 2000-01-06 2000-11-16 Konditionierung von durchgangslöchern

Country Status (11)

Country Link
US (2) US6375731B1 (de)
EP (1) EP1257694B1 (de)
JP (1) JP5005867B2 (de)
KR (1) KR100744328B1 (de)
CN (1) CN1214134C (de)
AT (1) ATE462290T1 (de)
AU (1) AU4506701A (de)
CA (1) CA2396566C (de)
DE (1) DE60044067D1 (de)
TW (1) TWI280272B (de)
WO (1) WO2001050821A2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375731B1 (en) 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
US20020134684A1 (en) * 2000-10-25 2002-09-26 Shipley Company, L.L.C. Seed layer processes
US7211204B2 (en) 2003-12-12 2007-05-01 Electrochemicals, Inc. Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
US7858146B2 (en) 2007-06-29 2010-12-28 Rohm And Haas Electronic Materials Llc Method of electrolessly depositing metal on the walls of through-holes
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8955580B2 (en) * 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
CN103303020B (zh) * 2013-05-08 2014-11-19 福建农林大学 一种魔芋葡甘聚糖印刷薄膜及其制备方法
KR20160115915A (ko) * 2014-01-31 2016-10-06 스미토모덴키고교가부시키가이샤 도전화 수지 성형체, 구조체, 알루미늄 다공체, 알루미늄 다공체의 제조 방법, 집전체, 전극, 비수계 전기 이중층 커패시터 및 리튬 이온 커패시터
KR20200102535A (ko) * 2016-04-22 2020-08-31 한국과학기술연구원 Emi 차폐용 2차원 금속 탄화물, 질화물 및 탄질화물 필름 및 복합체
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
US10677856B2 (en) 2018-08-17 2020-06-09 International Business Machines Corporation Facilitating reliable circuit board press-fit connector assembly fabrication
CN116941027A (zh) 2021-02-08 2023-10-24 麦克德米德乐思公司 用于扩散阻挡层形成的方法和湿式化学组成
JP2025532808A (ja) * 2022-09-29 2025-10-03 マクダーミッド　インコーポレーテッド 炭素ベースのダイレクトめっきプロセス

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3556883A (en) 1967-07-21 1971-01-19 Mitsubishi Edogawa Kagaku Kk Method for chemically polishing copper or copper alloy
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
WO1992019092A1 (de) * 1991-04-22 1992-10-29 Atotech Deutschland Gmbh Verfahren zur selektiven beschichtung von nichtleitern mit kohlenstoff-partikeln und die verwendung von kupferhaltigen lösungen im verfahren
US5139642A (en) 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
TW222313B (en) * 1993-01-29 1994-04-11 Mekku Kk Electroplating method
US5690805A (en) 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
US5476580A (en) * 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5389270A (en) 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5725807A (en) 1993-05-17 1998-03-10 Electrochemicals Inc. Carbon containing composition for electroplating
JPH07268682A (ja) * 1994-03-28 1995-10-17 Mec Kk 非導電体表面に電気メッキする方法
US5585427A (en) 1994-11-07 1996-12-17 Ppg Industries, Inc. Pigment dispersing additive for coating compositions
US5626736A (en) * 1996-01-19 1997-05-06 Shipley Company, L.L.C. Electroplating process
US5800739A (en) * 1996-04-11 1998-09-01 Shipley Company, L.L.C. Stabilized dispersions of graphite particles
US6375731B1 (en) 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass

Also Published As

Publication number Publication date
JP2003519285A (ja) 2003-06-17
CN1214134C (zh) 2005-08-10
US6691912B2 (en) 2004-02-17
CA2396566C (en) 2010-03-23
US6375731B1 (en) 2002-04-23
US20020139686A1 (en) 2002-10-03
CA2396566A1 (en) 2001-07-12
EP1257694A4 (de) 2005-03-09
KR100744328B1 (ko) 2007-07-30
EP1257694A2 (de) 2002-11-20
TWI280272B (en) 2007-05-01
WO2001050821A2 (en) 2001-07-12
AU4506701A (en) 2001-07-16
WO2001050821A3 (en) 2002-02-21
KR20020079771A (ko) 2002-10-19
CN1437661A (zh) 2003-08-20
JP5005867B2 (ja) 2012-08-22
DE60044067D1 (de) 2010-05-06
EP1257694B1 (de) 2010-03-24

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties