ATE464247T1 - Verpackugsbehältnis mit leistungshalbleitermodul - Google Patents

Verpackugsbehältnis mit leistungshalbleitermodul

Info

Publication number
ATE464247T1
ATE464247T1 AT04025144T AT04025144T ATE464247T1 AT E464247 T1 ATE464247 T1 AT E464247T1 AT 04025144 T AT04025144 T AT 04025144T AT 04025144 T AT04025144 T AT 04025144T AT E464247 T1 ATE464247 T1 AT E464247T1
Authority
AT
Austria
Prior art keywords
power semiconductor
semiconductor module
packaging container
module
cover surface
Prior art date
Application number
AT04025144T
Other languages
English (en)
Inventor
Marco Lederer
Rainer Popp
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of ATE464247T1 publication Critical patent/ATE464247T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/106—Elements projecting into a recess or through a hole in the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Packages (AREA)
  • Inverter Devices (AREA)
AT04025144T 2003-12-16 2004-10-22 Verpackugsbehältnis mit leistungshalbleitermodul ATE464247T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10358843A DE10358843B3 (de) 2003-12-16 2003-12-16 Verpackungsbehältnis für Leistungshalbleitermodule

Publications (1)

Publication Number Publication Date
ATE464247T1 true ATE464247T1 (de) 2010-04-15

Family

ID=34202467

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04025144T ATE464247T1 (de) 2003-12-16 2004-10-22 Verpackugsbehältnis mit leistungshalbleitermodul

Country Status (5)

Country Link
EP (1) EP1544130B1 (de)
AT (1) ATE464247T1 (de)
DE (2) DE10358843B3 (de)
DK (1) DK1544130T3 (de)
ES (1) ES2341106T3 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005052798B4 (de) * 2005-11-05 2007-12-13 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule
DE102006020636B4 (de) * 2006-05-04 2012-01-12 Semikron Elektronik Gmbh & Co. Kg Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3909898A1 (de) * 1989-03-25 1990-09-27 Semikron Elektronik Gmbh Verpackungsbehaelter und zuschnitte zum herstellen eines solchen behaelters
CH689554A5 (de) * 1994-02-15 1999-06-15 Schrack Components Ag Verpackung für mehrere hintereinander angeordnete Stückgüter.
US5518120A (en) * 1994-12-20 1996-05-21 Conductive Containers Inc. Anti-static package for protecting sensitive electronic components from electrostatic charges
JPH09290891A (ja) 1996-04-22 1997-11-11 Shin Etsu Polymer Co Ltd キャリアテープ
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
CA2372480C (en) 2002-02-15 2009-10-13 Forrest Smith Protective packaging enclosure for shock sensitive products
DE10306643B4 (de) * 2003-02-18 2005-08-25 Semikron Elektronik Gmbh Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
DE10320186B4 (de) * 2003-05-07 2008-02-14 Semikron Elektronik Gmbh & Co. Kg Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz

Also Published As

Publication number Publication date
DK1544130T3 (da) 2010-07-12
DE10358843B3 (de) 2005-03-24
ES2341106T3 (es) 2010-06-15
DE502004011027D1 (de) 2010-05-27
EP1544130A1 (de) 2005-06-22
EP1544130B1 (de) 2010-04-14

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Legal Events

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