ES2341106T3 - Contenedor de empaquetado que contiene un modulo semiconductores de potencia. - Google Patents
Contenedor de empaquetado que contiene un modulo semiconductores de potencia. Download PDFInfo
- Publication number
- ES2341106T3 ES2341106T3 ES04025144T ES04025144T ES2341106T3 ES 2341106 T3 ES2341106 T3 ES 2341106T3 ES 04025144 T ES04025144 T ES 04025144T ES 04025144 T ES04025144 T ES 04025144T ES 2341106 T3 ES2341106 T3 ES 2341106T3
- Authority
- ES
- Spain
- Prior art keywords
- packaging container
- power semiconductor
- semiconductor module
- wall
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 79
- 238000004806 packaging method and process Methods 0.000 title claims description 44
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 6
- 238000011109 contamination Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 235000015927 pasta Nutrition 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/106—Elements projecting into a recess or through a hole in the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Packages (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10358843A DE10358843B3 (de) | 2003-12-16 | 2003-12-16 | Verpackungsbehältnis für Leistungshalbleitermodule |
| DE10358843 | 2003-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2341106T3 true ES2341106T3 (es) | 2010-06-15 |
Family
ID=34202467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES04025144T Expired - Lifetime ES2341106T3 (es) | 2003-12-16 | 2004-10-22 | Contenedor de empaquetado que contiene un modulo semiconductores de potencia. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1544130B1 (de) |
| AT (1) | ATE464247T1 (de) |
| DE (2) | DE10358843B3 (de) |
| DK (1) | DK1544130T3 (de) |
| ES (1) | ES2341106T3 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005052798B4 (de) * | 2005-11-05 | 2007-12-13 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule |
| DE102006020636B4 (de) * | 2006-05-04 | 2012-01-12 | Semikron Elektronik Gmbh & Co. Kg | Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3909898A1 (de) * | 1989-03-25 | 1990-09-27 | Semikron Elektronik Gmbh | Verpackungsbehaelter und zuschnitte zum herstellen eines solchen behaelters |
| CH689554A5 (de) * | 1994-02-15 | 1999-06-15 | Schrack Components Ag | Verpackung für mehrere hintereinander angeordnete Stückgüter. |
| US5518120A (en) * | 1994-12-20 | 1996-05-21 | Conductive Containers Inc. | Anti-static package for protecting sensitive electronic components from electrostatic charges |
| JPH09290891A (ja) | 1996-04-22 | 1997-11-11 | Shin Etsu Polymer Co Ltd | キャリアテープ |
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
| CA2372480C (en) | 2002-02-15 | 2009-10-13 | Forrest Smith | Protective packaging enclosure for shock sensitive products |
| DE10306643B4 (de) * | 2003-02-18 | 2005-08-25 | Semikron Elektronik Gmbh | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul |
| DE10320186B4 (de) * | 2003-05-07 | 2008-02-14 | Semikron Elektronik Gmbh & Co. Kg | Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz |
-
2003
- 2003-12-16 DE DE10358843A patent/DE10358843B3/de not_active Expired - Lifetime
-
2004
- 2004-10-22 AT AT04025144T patent/ATE464247T1/de not_active IP Right Cessation
- 2004-10-22 DK DK04025144.9T patent/DK1544130T3/da active
- 2004-10-22 DE DE502004011027T patent/DE502004011027D1/de not_active Expired - Lifetime
- 2004-10-22 EP EP04025144A patent/EP1544130B1/de not_active Expired - Lifetime
- 2004-10-22 ES ES04025144T patent/ES2341106T3/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DK1544130T3 (da) | 2010-07-12 |
| DE10358843B3 (de) | 2005-03-24 |
| ATE464247T1 (de) | 2010-04-15 |
| DE502004011027D1 (de) | 2010-05-27 |
| EP1544130A1 (de) | 2005-06-22 |
| EP1544130B1 (de) | 2010-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8083063B2 (en) | Reticle POD and supporting components therebetween | |
| ES2327964T3 (es) | Modulo semiconductor de potencia. | |
| ES2645788T3 (es) | Disyuntor y caja de soplado del arco con aparato de protección | |
| ES2870019T3 (es) | Disposición de paquete de enfriamiento para un conjunto de recipiente con aislamiento térmico | |
| JP4429823B2 (ja) | 半導体装置用トレイ | |
| KR20030093126A (ko) | 전자 부품용 트레이 | |
| KR20150057887A (ko) | 배터리 팩 | |
| ES2811801T3 (es) | Montaje de soporte físico electrónico | |
| CN103518258B (zh) | 用于基片的包装以及具有这种包装的包装单元 | |
| ES2341106T3 (es) | Contenedor de empaquetado que contiene un modulo semiconductores de potencia. | |
| KR102324344B1 (ko) | 배터리 팩 | |
| JP5732260B2 (ja) | 少なくとも1つのパワー半導体モジュールと輸送包装を備えて構成される配列装置 | |
| ES3053257T3 (en) | Battery module and battery pack including the same | |
| JP5732261B2 (ja) | 少なくとも1つのパワー半導体モジュールと輸送包装を備えて構成される配列装置 | |
| ES2292524T3 (es) | Modulo semiconductor de potencia. | |
| ES2348803T3 (es) | Conjunto de mã“dulos de semiconductores de potencia y dispositivo para la colocaciã“n y procedimiento de tratamiento de la superficie de dichos mã“dulos de semiconductores de potencia. | |
| JP2018129429A (ja) | チップトレイ、半導体チップの収納体および収納体の製造方法 | |
| JP6963059B2 (ja) | デュアルポート電子コンポーネント | |
| ES2736249T3 (es) | Módulo electrónico | |
| KR101150405B1 (ko) | 움직임이 줄어든 웨이퍼 박스 | |
| US7554807B2 (en) | Heat sink having protective device for thermal interface material spread thereon | |
| KR20110016026A (ko) | 적층 반도체 패키지 및 이의 제조 방법 | |
| TWI680925B (zh) | 半導體晶片載具及包裝方法 | |
| ES2856760T3 (es) | Contenedor de material de impresión con detección de cortocircuito | |
| US20080116107A1 (en) | Protective cover |