ES2341106T3 - Contenedor de empaquetado que contiene un modulo semiconductores de potencia. - Google Patents

Contenedor de empaquetado que contiene un modulo semiconductores de potencia. Download PDF

Info

Publication number
ES2341106T3
ES2341106T3 ES04025144T ES04025144T ES2341106T3 ES 2341106 T3 ES2341106 T3 ES 2341106T3 ES 04025144 T ES04025144 T ES 04025144T ES 04025144 T ES04025144 T ES 04025144T ES 2341106 T3 ES2341106 T3 ES 2341106T3
Authority
ES
Spain
Prior art keywords
packaging container
power semiconductor
semiconductor module
wall
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES04025144T
Other languages
English (en)
Spanish (es)
Inventor
Marco Lederer
Rainer Popp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Application granted granted Critical
Publication of ES2341106T3 publication Critical patent/ES2341106T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • B65D25/10Devices to locate articles in containers
    • B65D25/106Elements projecting into a recess or through a hole in the articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/025Containers made of sheet-like material and having a shape to accommodate contents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Packages (AREA)
  • Inverter Devices (AREA)
ES04025144T 2003-12-16 2004-10-22 Contenedor de empaquetado que contiene un modulo semiconductores de potencia. Expired - Lifetime ES2341106T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10358843A DE10358843B3 (de) 2003-12-16 2003-12-16 Verpackungsbehältnis für Leistungshalbleitermodule
DE10358843 2003-12-16

Publications (1)

Publication Number Publication Date
ES2341106T3 true ES2341106T3 (es) 2010-06-15

Family

ID=34202467

Family Applications (1)

Application Number Title Priority Date Filing Date
ES04025144T Expired - Lifetime ES2341106T3 (es) 2003-12-16 2004-10-22 Contenedor de empaquetado que contiene un modulo semiconductores de potencia.

Country Status (5)

Country Link
EP (1) EP1544130B1 (de)
AT (1) ATE464247T1 (de)
DE (2) DE10358843B3 (de)
DK (1) DK1544130T3 (de)
ES (1) ES2341106T3 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005052798B4 (de) * 2005-11-05 2007-12-13 Semikron Elektronik Gmbh & Co. Kg Anordnung mit Leistungshalbleitermodulen und mit Vorrichtung zu deren Positionierung sowie Verfahren zur Oberflächenbehandlung der Leistungshalbleitermodule
DE102006020636B4 (de) * 2006-05-04 2012-01-12 Semikron Elektronik Gmbh & Co. Kg Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3909898A1 (de) * 1989-03-25 1990-09-27 Semikron Elektronik Gmbh Verpackungsbehaelter und zuschnitte zum herstellen eines solchen behaelters
CH689554A5 (de) * 1994-02-15 1999-06-15 Schrack Components Ag Verpackung für mehrere hintereinander angeordnete Stückgüter.
US5518120A (en) * 1994-12-20 1996-05-21 Conductive Containers Inc. Anti-static package for protecting sensitive electronic components from electrostatic charges
JPH09290891A (ja) 1996-04-22 1997-11-11 Shin Etsu Polymer Co Ltd キャリアテープ
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
CA2372480C (en) 2002-02-15 2009-10-13 Forrest Smith Protective packaging enclosure for shock sensitive products
DE10306643B4 (de) * 2003-02-18 2005-08-25 Semikron Elektronik Gmbh Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
DE10320186B4 (de) * 2003-05-07 2008-02-14 Semikron Elektronik Gmbh & Co. Kg Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz

Also Published As

Publication number Publication date
DK1544130T3 (da) 2010-07-12
DE10358843B3 (de) 2005-03-24
ATE464247T1 (de) 2010-04-15
DE502004011027D1 (de) 2010-05-27
EP1544130A1 (de) 2005-06-22
EP1544130B1 (de) 2010-04-14

Similar Documents

Publication Publication Date Title
US8083063B2 (en) Reticle POD and supporting components therebetween
ES2327964T3 (es) Modulo semiconductor de potencia.
ES2645788T3 (es) Disyuntor y caja de soplado del arco con aparato de protección
ES2870019T3 (es) Disposición de paquete de enfriamiento para un conjunto de recipiente con aislamiento térmico
JP4429823B2 (ja) 半導体装置用トレイ
KR20030093126A (ko) 전자 부품용 트레이
KR20150057887A (ko) 배터리 팩
ES2811801T3 (es) Montaje de soporte físico electrónico
CN103518258B (zh) 用于基片的包装以及具有这种包装的包装单元
ES2341106T3 (es) Contenedor de empaquetado que contiene un modulo semiconductores de potencia.
KR102324344B1 (ko) 배터리 팩
JP5732260B2 (ja) 少なくとも1つのパワー半導体モジュールと輸送包装を備えて構成される配列装置
ES3053257T3 (en) Battery module and battery pack including the same
JP5732261B2 (ja) 少なくとも1つのパワー半導体モジュールと輸送包装を備えて構成される配列装置
ES2292524T3 (es) Modulo semiconductor de potencia.
ES2348803T3 (es) Conjunto de mã“dulos de semiconductores de potencia y dispositivo para la colocaciã“n y procedimiento de tratamiento de la superficie de dichos mã“dulos de semiconductores de potencia.
JP2018129429A (ja) チップトレイ、半導体チップの収納体および収納体の製造方法
JP6963059B2 (ja) デュアルポート電子コンポーネント
ES2736249T3 (es) Módulo electrónico
KR101150405B1 (ko) 움직임이 줄어든 웨이퍼 박스
US7554807B2 (en) Heat sink having protective device for thermal interface material spread thereon
KR20110016026A (ko) 적층 반도체 패키지 및 이의 제조 방법
TWI680925B (zh) 半導體晶片載具及包裝方法
ES2856760T3 (es) Contenedor de material de impresión con detección de cortocircuito
US20080116107A1 (en) Protective cover