ATE464588T1 - Lichtempfindliche harzzusammensetzung und deren verwendung - Google Patents

Lichtempfindliche harzzusammensetzung und deren verwendung

Info

Publication number
ATE464588T1
ATE464588T1 AT05005613T AT05005613T ATE464588T1 AT E464588 T1 ATE464588 T1 AT E464588T1 AT 05005613 T AT05005613 T AT 05005613T AT 05005613 T AT05005613 T AT 05005613T AT E464588 T1 ATE464588 T1 AT E464588T1
Authority
AT
Austria
Prior art keywords
resin composition
photosensitive resin
pattern
polyimide film
specific
Prior art date
Application number
AT05005613T
Other languages
English (en)
Inventor
Hirofumi Fujii
Yasuhito Funada
Satoshi Tanigawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE464588T1 publication Critical patent/ATE464588T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AT05005613T 2004-03-17 2005-03-15 Lichtempfindliche harzzusammensetzung und deren verwendung ATE464588T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004076146A JP4256806B2 (ja) 2004-03-17 2004-03-17 感光性樹脂組成物とその利用

Publications (1)

Publication Number Publication Date
ATE464588T1 true ATE464588T1 (de) 2010-04-15

Family

ID=34836540

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05005613T ATE464588T1 (de) 2004-03-17 2005-03-15 Lichtempfindliche harzzusammensetzung und deren verwendung

Country Status (6)

Country Link
US (1) US7008752B2 (de)
EP (1) EP1577708B1 (de)
JP (1) JP4256806B2 (de)
CN (1) CN100498529C (de)
AT (1) ATE464588T1 (de)
DE (1) DE602005020543D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010181817A (ja) * 2009-02-09 2010-08-19 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP5644068B2 (ja) * 2009-07-06 2014-12-24 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション
JP5208085B2 (ja) * 2009-10-14 2013-06-12 日東電工株式会社 感光性樹脂組成物およびそれを用いた金属支持体付回路基板の製法、ならびに金属支持体付回路基板
JP2011253044A (ja) * 2010-06-02 2011-12-15 Nippon Kayaku Co Ltd 感光性樹脂組成物、その用途及びその使用方法
JP2012063645A (ja) 2010-09-17 2012-03-29 Nitto Denko Corp 感光性樹脂組成物およびそれを用いた金属支持体付回路基板
KR102300782B1 (ko) * 2014-01-24 2021-09-13 도레이 카부시키가이샤 네거티브형 감광성 수지 조성물, 그것을 경화시켜서 이루어지는 경화막과 그 제조 방법 및 그것을 구비하는 광학 디바이스, 그리고 이면 조사형 cmos 이미지 센서
JP7492880B2 (ja) * 2020-08-03 2024-05-30 日東電工株式会社 ポリイミド前駆体組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911541A (de) 1972-06-01 1974-02-01
JPS5246723B2 (de) 1974-04-26 1977-11-28
JPS5952822B2 (ja) 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS606368B2 (ja) 1979-08-01 1985-02-18 東レ株式会社 感光性ポリイミド前駆体
JP3093055B2 (ja) 1992-07-07 2000-10-03 日東電工株式会社 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法
JP3709997B2 (ja) 1994-03-29 2005-10-26 日東電工株式会社 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法
JP3176795B2 (ja) 1994-04-06 2001-06-18 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JP2000267276A (ja) * 1999-03-18 2000-09-29 Nitto Denko Corp 転写シート
JP2002148804A (ja) 2000-11-08 2002-05-22 Nitto Denko Corp 感光性樹脂組成物および回路基板
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP2003186192A (ja) * 2001-12-19 2003-07-03 Nitto Denko Corp 感光性樹脂組成物およびポリイミド樹脂

Also Published As

Publication number Publication date
EP1577708B1 (de) 2010-04-14
JP4256806B2 (ja) 2009-04-22
CN1670626A (zh) 2005-09-21
EP1577708A2 (de) 2005-09-21
CN100498529C (zh) 2009-06-10
US7008752B2 (en) 2006-03-07
DE602005020543D1 (de) 2010-05-27
JP2005266075A (ja) 2005-09-29
US20050208421A1 (en) 2005-09-22
EP1577708A3 (de) 2009-05-13

Similar Documents

Publication Publication Date Title
EP2637062A3 (de) Strukturbildungsverfahren
DE602007011321D1 (de) Lasermarkierung von pigmentierten substraten
DE60335120D1 (de) Zusammensetzung fur antireflexbeschichtungen und verfahren zur bildung einer struktur
DE60304841D1 (de) Lichtstrahl-ablenkvorrichtung und verfahren zu deren herstellung
DE50210866D1 (de) Selbstreinigende Oberflächen durch hydrophobe Strukturen und Verfahren zu deren Herstellung
DK1386893T3 (da) Fremgangsmåde til UV-hærdning af en coated fiber
TW200604749A (en) Top coat composition
DE60208089D1 (de) Fluorierte Photopolymerzusammensetzung und Wellenleitervorrichtung
BR112012023662A2 (pt) composição fotossensível à coloração, precursor de chapa de impressão litográfica e método de fabricação de chapa
ATE464331T1 (de) Verfahren zur herstellung eines polyvinylidenfluoridcopolymers
ATE417906T1 (de) Haftklebemasse, haftklebefilm sowie optisches filter
EP1684116A3 (de) Lichtempfindliche Zusammensetzung, Verbindung zur Verwendung für die lichtempfindliche Zusammensetzung und Strukturbildungsverfahren unter Verwendung der lichtempfindlichen Zusammensetzung
TW200801815A (en) Method for forming pattern and composition for forming organic thin film using therefor
DE602005020543D1 (de) Lichtempfindliche Harzzusammensetzung und deren Verwendung
EP1239332A4 (de) Strahlungsempfindliche polysilazan-zusammensetzung, daraus erzeugte muster sowie ein verfahren zur veraschung eines entsprechenden beschichtungsfilms
DE602005014369D1 (de) Verwendung von methanofullerenderivaten als resistmaterialien und verfahren zur bildung einer resistschicht
ATE407799T1 (de) Verfahren zur herstellung lithographischer druckplatten
ATE445861T1 (de) Photopolymer druckplattenvorläufer
ATE454983T1 (de) Lichtempfindliche zusammensetzung und damit hergestellte flachdruckplatte-vorstufe
WO2006137011A3 (en) Methods and devices for characterizing polarization of illumination system
ATE301169T1 (de) Durch uv-strahlung härtbare zusammensetzung
ATE325368T1 (de) Farbfilter und verfahren zu seiner herstellung
TW200619268A (en) Composition containing polyamic acid used for forming sublayer anti-reflective film
ATE271578T1 (de) Thermotrope folie und verfahren zu deren herstellung
ATE550401T1 (de) Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties