ATE467267T1 - Resonator - Google Patents

Resonator

Info

Publication number
ATE467267T1
ATE467267T1 AT07826663T AT07826663T ATE467267T1 AT E467267 T1 ATE467267 T1 AT E467267T1 AT 07826663 T AT07826663 T AT 07826663T AT 07826663 T AT07826663 T AT 07826663T AT E467267 T1 ATE467267 T1 AT E467267T1
Authority
AT
Austria
Prior art keywords
resonator
central bar
electrodes
nano
oxide layer
Prior art date
Application number
AT07826663T
Other languages
English (en)
Inventor
Hoang Viet Nguyen
Dirk Gravesteijn
Radu Surdeanu
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE467267T1 publication Critical patent/ATE467267T1/de

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/0072—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks of microelectro-mechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02488—Vibration modes
    • H03H2009/02496—Horizontal, i.e. parallel to the substrate plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Micromachines (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Thin Film Transistor (AREA)
AT07826663T 2006-10-09 2007-10-05 Resonator ATE467267T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06122002 2006-10-09
PCT/IB2007/054071 WO2008044182A2 (en) 2006-10-09 2007-10-05 Resonator and fabrication method therof

Publications (1)

Publication Number Publication Date
ATE467267T1 true ATE467267T1 (de) 2010-05-15

Family

ID=39253850

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07826663T ATE467267T1 (de) 2006-10-09 2007-10-05 Resonator

Country Status (6)

Country Link
US (1) US20100090302A1 (de)
EP (1) EP2082481B1 (de)
CN (1) CN101523719B (de)
AT (1) ATE467267T1 (de)
DE (1) DE602007006335D1 (de)
WO (1) WO2008044182A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7943428B2 (en) * 2008-12-24 2011-05-17 International Business Machines Corporation Bonded semiconductor substrate including a cooling mechanism
US8877648B2 (en) * 2009-03-26 2014-11-04 Semprius, Inc. Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby
US8580596B2 (en) * 2009-04-10 2013-11-12 Nxp, B.V. Front end micro cavity
EP2622347A4 (de) * 2010-09-29 2015-05-06 Univ Texas Fin-fet-biosensor mit verbesserter empfindlichkeit und spezifität
US8502279B2 (en) * 2011-05-16 2013-08-06 Globalfoundries Singapore Pte. Ltd. Nano-electro-mechanical system (NEMS) structures with actuatable semiconductor fin on bulk substrates
EP2676923A1 (de) * 2012-06-20 2013-12-25 Imec Verfahren zur Herstellung leitfähiger Leitungen in naher Umgebung bei der Herstellung von mikroelektromechanischen Systemen
US8941161B2 (en) * 2013-05-07 2015-01-27 International Business Machines Corporation Semiconductor device including finFET and diode having reduced defects in depletion region
GB2530186B (en) * 2013-06-29 2020-09-30 Intel Corp Piezoresistive resonator with multi-gate transistor
US11323070B1 (en) 2021-04-16 2022-05-03 Apple Inc. Oscillator with fin field-effect transistor (FinFET) resonator

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348617A (en) * 1991-12-23 1994-09-20 Iowa State University Research Foundation, Inc. Selective etching process
DE4332843C2 (de) * 1993-09-27 1997-04-24 Siemens Ag Verfahren zur Herstellung einer mikromechanischen Vorrichtung und mikromechanische Vorrichtung
KR970013677A (ko) * 1995-08-17 1997-03-29 빈센트 비. 인그라시아 밀봉된 캐비티를 가진 박막 압전 공진기와 그 조립방법
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US6262464B1 (en) * 2000-06-19 2001-07-17 International Business Machines Corporation Encapsulated MEMS brand-pass filter for integrated circuits
WO2002073679A1 (en) * 2001-03-09 2002-09-19 Nec Corporation Vapor growth method for metal oxide dielectric film and pzt film
FR2839964B1 (fr) * 2002-05-24 2005-09-09 Centre Nat Rech Scient Procede de realisation de structure de microsysteme a entrefers lateraux et structure de microsysteme correspondante
US20040027030A1 (en) * 2002-08-08 2004-02-12 Li-Peng Wang Manufacturing film bulk acoustic resonator filters
US6985051B2 (en) * 2002-12-17 2006-01-10 The Regents Of The University Of Michigan Micromechanical resonator device and method of making a micromechanical device
US6885055B2 (en) * 2003-02-04 2005-04-26 Lee Jong-Ho Double-gate FinFET device and fabricating method thereof
US20040157426A1 (en) * 2003-02-07 2004-08-12 Luc Ouellet Fabrication of advanced silicon-based MEMS devices
US6936491B2 (en) * 2003-06-04 2005-08-30 Robert Bosch Gmbh Method of fabricating microelectromechanical systems and devices having trench isolated contacts
EP1758814A4 (de) * 2004-03-15 2010-12-15 Georgia Tech Res Inst Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür
US6946693B1 (en) * 2004-04-27 2005-09-20 Wisconsin Alumni Research Foundation Electromechanical electron transfer devices

Also Published As

Publication number Publication date
CN101523719B (zh) 2011-09-28
EP2082481B1 (de) 2010-05-05
US20100090302A1 (en) 2010-04-15
WO2008044182A3 (en) 2008-06-19
CN101523719A (zh) 2009-09-02
EP2082481A2 (de) 2009-07-29
WO2008044182A2 (en) 2008-04-17
DE602007006335D1 (en) 2010-06-17

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Legal Events

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