ATE468604T1 - Methode und apparat zur herstellung von kühlkörpern hoher lamellendichte - Google Patents
Methode und apparat zur herstellung von kühlkörpern hoher lamellendichteInfo
- Publication number
- ATE468604T1 ATE468604T1 AT06007763T AT06007763T ATE468604T1 AT E468604 T1 ATE468604 T1 AT E468604T1 AT 06007763 T AT06007763 T AT 06007763T AT 06007763 T AT06007763 T AT 06007763T AT E468604 T1 ATE468604 T1 AT E468604T1
- Authority
- AT
- Austria
- Prior art keywords
- base plates
- fins
- base
- base plate
- plates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/10—Heat sinks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49377—Tube with heat transfer means
- Y10T29/49378—Finned tube
- Y10T29/49384—Internally finned
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
- Y10T29/49922—Overedge assembling of seated part by bending over projecting prongs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53113—Heat exchanger
- Y10T29/53122—Heat exchanger including deforming means
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Surface Heating Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/106,440 US7497013B2 (en) | 2005-04-15 | 2005-04-15 | Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE468604T1 true ATE468604T1 (de) | 2010-06-15 |
Family
ID=36601139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06007763T ATE468604T1 (de) | 2005-04-15 | 2006-04-13 | Methode und apparat zur herstellung von kühlkörpern hoher lamellendichte |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7497013B2 (de) |
| EP (1) | EP1713120B1 (de) |
| AT (1) | ATE468604T1 (de) |
| CA (2) | CA2542169C (de) |
| DE (1) | DE602006014320D1 (de) |
| DK (1) | DK1713120T3 (de) |
| ES (1) | ES2342186T3 (de) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI262760B (en) * | 2005-05-20 | 2006-09-21 | Shr-Ming Chen | Riveting process of bottom plate of heat-dissipating device and fins |
| FR2898668B1 (fr) * | 2006-03-15 | 2008-06-27 | Ferraz Date Ind Soc Par Action | Echangeur de chaleur destine au refroidissement d'un composant electronique et son procede de fabrication |
| TW200934362A (en) * | 2008-01-16 | 2009-08-01 | Neng Tyi Prec Ind Co Ltd | Method of manufacturing heat dissipaters having heat sinks and structure thereof |
| US8225512B2 (en) | 2008-03-05 | 2012-07-24 | Surgical Site Solutions, Inc. | Vacuum device for hair clippings |
| CN101534626B (zh) * | 2008-03-14 | 2011-06-08 | 富准精密工业(深圳)有限公司 | 散热模组组合及其散热器组合 |
| TW201024653A (en) * | 2008-12-31 | 2010-07-01 | Quan-Pei Chen | Method for tightly fastening heat dissipation device |
| US20100326644A1 (en) * | 2009-06-30 | 2010-12-30 | Shui-Hsu Hung | Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same |
| USD634278S1 (en) * | 2009-10-15 | 2011-03-15 | Sapa Ab | Heat sink |
| CN102166714B (zh) * | 2010-02-26 | 2013-04-24 | 苏州春兴精工股份有限公司 | 一种散热片装配器具 |
| CN102401358B (zh) * | 2010-09-10 | 2016-08-03 | 欧司朗股份有限公司 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
| US20130014917A1 (en) * | 2011-07-14 | 2013-01-17 | Tsung-Hsien Huang | Heat pipe-attached heat sink with bottom radiation fins |
| US20130153189A1 (en) * | 2011-12-18 | 2013-06-20 | Chia-Yu Lin | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
| US9398723B2 (en) | 2013-08-29 | 2016-07-19 | Eaton Corporation | Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat |
| US12120994B2 (en) * | 2016-09-25 | 2024-10-22 | Scynce Led Llc | Method and apparatus for an horticultural light fixture |
| JP6462737B2 (ja) * | 2017-01-24 | 2019-01-30 | 三菱電機株式会社 | ヒートシンク |
| US10980149B2 (en) * | 2017-03-07 | 2021-04-13 | Karhe Technology Co., Ltd. | Thermal superconductive finned heat sink and electrical equipment cabinet |
| CN107640597A (zh) * | 2017-10-11 | 2018-01-30 | 苏州新元电器有限公司 | 一种翅片换热器的翅片码放装置 |
| JP6555374B1 (ja) * | 2018-03-13 | 2019-08-07 | 日本電気株式会社 | 冷却構造、実装構造 |
| CN209879238U (zh) * | 2019-04-29 | 2019-12-31 | 中强光电股份有限公司 | 散热装置及投影机 |
| CN110479852A (zh) * | 2019-09-12 | 2019-11-22 | 苏州翰裴精密机械有限公司 | 一种用于散热器翅片加工的铲齿模具 |
| US11786959B2 (en) * | 2019-10-21 | 2023-10-17 | Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. | Double-sided expanded plate riveting structure and method |
| CN113385915B (zh) * | 2021-07-05 | 2022-04-08 | 全椒赛德利机械有限公司 | 基于管片式散热器加工用散热片叠合排列装置 |
| TWI785778B (zh) * | 2021-09-06 | 2022-12-01 | 可成科技股份有限公司 | 散熱機構與其製造方法 |
| CN116372550B (zh) * | 2023-04-24 | 2025-06-20 | Ihi寿力压缩技术(苏州)有限公司 | 一种免焊接的水分离器翅片安装方法 |
| CN118288000B (zh) * | 2024-04-22 | 2024-08-20 | 东莞市仁信精工实业有限公司 | 一种插片散热器加工快速成型设备 |
| CN118162879B (zh) * | 2024-05-16 | 2024-07-23 | 博特换热系统(江苏)有限公司 | 一种散热片的组装装置及其使用方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3814145C2 (de) * | 1988-04-27 | 1998-07-23 | Hess Joachim | Vorrichtung zum Zuführen oder Abführen von Wärme |
| US5542176A (en) * | 1992-09-21 | 1996-08-06 | Hideaki Serizawa | Radiation plate and method of producing the same |
| CA2107869C (en) * | 1993-10-06 | 1998-05-05 | Joseph Lipinski | Method and apparatus for fabricating high fin density heatsinks |
| CA2216999A1 (en) * | 1995-04-11 | 1996-10-17 | Fmc Corporation | Termite bait station |
| US5564826A (en) * | 1995-09-27 | 1996-10-15 | Robbins Scientific Corporation | Reciprocating bath shaker |
| US5771966A (en) * | 1995-12-15 | 1998-06-30 | Jacoby; John | Folded conducting member heatsinks and method of making same |
| DK0789396T3 (da) * | 1996-01-31 | 2006-10-23 | Alcan Tech & Man Ag | Köleelement til halvlederkomponenter eller lignende |
| DE29601776U1 (de) | 1996-02-02 | 1996-06-13 | Alusuisse-Lonza Services AG, Neuhausen am Rheinfall | Kühlkörper für Halbleiterbauelemente o.dgl. |
| US5937517A (en) * | 1997-11-12 | 1999-08-17 | Eastman Kodak Company | Method of manufacturing bonded dual extruded, high fin density heat sinks |
| DE19900970A1 (de) | 1999-01-13 | 2000-07-20 | Joachim Glueck | Kühlkörper mit Rippenabstandsprofil |
| US6538991B1 (en) * | 1999-08-03 | 2003-03-25 | Lucent Technologies Inc. | Constraint-based routing between ingress-egress points in a packet network |
| DE20006937U1 (de) * | 2000-04-14 | 2000-08-17 | Hsieh, Hsin-Mao, Kaohsiung | Anordnung zum Ableiten von Wärme |
| US6520248B2 (en) * | 2000-05-18 | 2003-02-18 | Aavid Thermalloy Llc | Heat sink having bonded cooling fins |
| CA2353338A1 (en) * | 2000-07-21 | 2002-01-21 | Ats Automation Tooling Systems Inc. | Folded-fin heat sink manufacturing method and apparatus |
| JP2002118211A (ja) * | 2000-10-12 | 2002-04-19 | Mizutani Denki Kogyo Kk | 電子部品の放熱器およびその製造方法 |
| JP3552047B2 (ja) * | 2000-10-25 | 2004-08-11 | 古河電気工業株式会社 | ヒートシンク、その製造方法、および、押圧治具 |
| DE10056387B4 (de) | 2000-11-14 | 2008-11-13 | Corus Aluminium Profiltechnik Gmbh | Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens |
| JP4457487B2 (ja) | 2000-11-15 | 2010-04-28 | パナソニック株式会社 | スピーカの製造方法 |
| DE60206489T2 (de) * | 2001-05-11 | 2006-07-13 | Parker-Hannifin Corp., Cleveland | Gezahnte Dichtung für EMI-Abschirmungsanwendungen mit niedrigen Verpressungskräften |
| KR100411251B1 (ko) * | 2001-11-28 | 2003-12-18 | 한국전자통신연구원 | 제한조건을 만족하는 다중 경로 배정방법 |
| KR100450407B1 (ko) * | 2002-08-28 | 2004-09-30 | 한국전자통신연구원 | 서비스 품질(QoS)보장 다중경로 계산방법 |
| DE202004009712U1 (de) | 2004-06-21 | 2004-11-18 | Chen, Shyh-Ming, Shulin | Vorrichtung zur Herstellung von Wärmeableitvorrichtungen durch Rammen sowie auf diese Weise hergestellte Wärmeableitvorrichtung |
| US7466520B2 (en) * | 2004-10-07 | 2008-12-16 | Seagate Technology Llc | Co-located microactuator lever assembly |
-
2005
- 2005-04-15 US US11/106,440 patent/US7497013B2/en active Active
-
2006
- 2006-04-06 CA CA002542169A patent/CA2542169C/en not_active Expired - Fee Related
- 2006-04-06 CA CA2651842A patent/CA2651842C/en not_active Expired - Fee Related
- 2006-04-13 DK DK06007763.3T patent/DK1713120T3/da active
- 2006-04-13 AT AT06007763T patent/ATE468604T1/de active
- 2006-04-13 DE DE602006014320T patent/DE602006014320D1/de not_active Expired - Lifetime
- 2006-04-13 ES ES06007763T patent/ES2342186T3/es not_active Expired - Lifetime
- 2006-04-13 EP EP06007763A patent/EP1713120B1/de not_active Expired - Lifetime
-
2009
- 2009-01-21 US US12/356,654 patent/US7819173B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DK1713120T3 (da) | 2010-08-30 |
| EP1713120B1 (de) | 2010-05-19 |
| US20060230616A1 (en) | 2006-10-19 |
| CA2651842A1 (en) | 2006-10-15 |
| US7497013B2 (en) | 2009-03-03 |
| CA2651842C (en) | 2013-02-05 |
| EP1713120A2 (de) | 2006-10-18 |
| ES2342186T3 (es) | 2010-07-02 |
| CA2542169C (en) | 2009-05-26 |
| EP1713120A3 (de) | 2008-01-23 |
| DE602006014320D1 (de) | 2010-07-01 |
| US7819173B2 (en) | 2010-10-26 |
| US20090178796A1 (en) | 2009-07-16 |
| CA2542169A1 (en) | 2006-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
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