ATE471366T1 - Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit - Google Patents

Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit

Info

Publication number
ATE471366T1
ATE471366T1 AT07017582T AT07017582T ATE471366T1 AT E471366 T1 ATE471366 T1 AT E471366T1 AT 07017582 T AT07017582 T AT 07017582T AT 07017582 T AT07017582 T AT 07017582T AT E471366 T1 ATE471366 T1 AT E471366T1
Authority
AT
Austria
Prior art keywords
substrate
water
drying
bringing
contact
Prior art date
Application number
AT07017582T
Other languages
English (en)
Inventor
Hiroyuki Seki
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Application granted granted Critical
Publication of ATE471366T1 publication Critical patent/ATE471366T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/28Organic compounds containing halogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5018Halogenated solvents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50Solvents
    • C11D7/5004Organic solvents
    • C11D7/5022Organic solvents containing oxygen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture
    • H10P70/23Cleaning during device manufacture during, before or after processing of insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/20Cleaning during device manufacture
    • H10P70/27Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/273Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a delineation of conductive layers, e.g. by RIE
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Detergent Compositions (AREA)
AT07017582T 2006-09-14 2007-09-07 Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit ATE471366T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006248955 2006-09-14

Publications (1)

Publication Number Publication Date
ATE471366T1 true ATE471366T1 (de) 2010-07-15

Family

ID=38694851

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07017582T ATE471366T1 (de) 2006-09-14 2007-09-07 Mittel zur entfernung von wasser aus einem substrat, verfahren zur wasserentfernung und trocknungsverfahren damit

Country Status (7)

Country Link
US (1) US20080066337A1 (de)
EP (1) EP1900801B1 (de)
KR (1) KR101451694B1 (de)
CN (1) CN101144051A (de)
AT (1) ATE471366T1 (de)
DE (1) DE602007007161D1 (de)
TW (1) TWI484030B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120103371A1 (en) * 2010-10-28 2012-05-03 Lam Research Ag Method and apparatus for drying a semiconductor wafer
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
JP6426927B2 (ja) * 2013-09-30 2018-11-21 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN103571647A (zh) * 2013-10-31 2014-02-12 合肥中南光电有限公司 一种太阳能级硅片水基清洗剂及其制备方法
EP2889355B1 (de) 2013-12-26 2017-04-19 Central Glass Company, Limited Azeotrope mischungsartige zusammensetzung, wärmeübertragungszusammensetzung, reiniger, hochtemperaturwärmepumpenvorrichtung und wärmeübertragungsverfahren
JP6117711B2 (ja) 2014-02-06 2017-04-19 信越化学工業株式会社 半導体基板の洗浄乾燥方法
JP2018186231A (ja) 2017-04-27 2018-11-22 信越化学工業株式会社 半導体基板の洗浄乾燥方法
US11004746B2 (en) * 2018-11-28 2021-05-11 Taiwan Semiconductor Manufacturing Company Ltd. Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure
JP7745359B2 (ja) * 2021-04-16 2025-09-29 株式会社Screenホールディングス 基板処理方法、基板処理装置および乾燥処理液
JP7627994B2 (ja) * 2021-05-20 2025-02-07 株式会社Screenホールディングス 基板処理方法および基板処理装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140728A (ja) 1987-11-27 1989-06-01 Hitachi Ltd 物体の洗浄乾燥方法
JPH03106024A (ja) 1989-09-20 1991-05-02 Hitachi Ltd 洗浄乾燥方法およびそれを用いた半導体集積回路装置の製造方法
JPH0393899A (ja) 1989-09-06 1991-04-18 Mitsui Petrochem Ind Ltd 洗浄剤および洗浄方法
JPH02203529A (ja) 1989-02-01 1990-08-13 Mitsui Petrochem Ind Ltd 基板の洗浄乾燥方法
CA2008882A1 (en) * 1989-02-01 1990-08-01 Takamasa Tsumoto Washing agent, washing method and process for preparing semiconductor integrated circuit device by use thereof
US5403695A (en) * 1991-04-30 1995-04-04 Kabushiki Kaisha Toshiba Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups
KR940000562A (ko) * 1992-06-30 1994-01-03 닥터. 디이터 라우어 1-클로로-2,2,2-트리플루오로에틸 디플루오로메틸 에테르와 부분적으로 플루오르화된 알칸올의 조성물
JPH06310486A (ja) 1993-04-23 1994-11-04 Dainippon Screen Mfg Co Ltd 基板乾燥方法および基板乾燥装置
JP2651652B2 (ja) 1993-05-07 1997-09-10 工業技術院長 フッ素化アルコール系洗浄剤
JP2572524B2 (ja) 1993-05-10 1997-01-16 工業技術院長 フッ素化アルコール含有水切り溶剤
JP2763083B2 (ja) 1993-06-01 1998-06-11 工業技術院長 フッ素系洗浄溶剤組成物
JPH0762394A (ja) 1993-08-27 1995-03-07 Asahi Glass Co Ltd 混合溶剤
US6351039B1 (en) * 1997-05-28 2002-02-26 Texas Instruments Incorporated Integrated circuit dielectric and method
JP2000038673A (ja) 1998-07-22 2000-02-08 Central Glass Co Ltd クリーニングガス
US20040029395A1 (en) * 2002-08-12 2004-02-12 Peng Zhang Process solutions containing acetylenic diol surfactants
US20030183251A1 (en) * 2001-04-24 2003-10-02 Kabushiski Kaisha Kobe Seiko Sho Process for drying an object having microstructure and the object obtained by the same
JP3920696B2 (ja) 2001-04-24 2007-05-30 株式会社神戸製鋼所 微細構造体の乾燥方法および該方法により得られる微細構造体
JP2005171147A (ja) 2003-12-12 2005-06-30 Asahi Glass Co Ltd 物品の洗浄乾燥方法

Also Published As

Publication number Publication date
KR101451694B1 (ko) 2014-10-16
TW200821383A (en) 2008-05-16
DE602007007161D1 (de) 2010-07-29
CN101144051A (zh) 2008-03-19
US20080066337A1 (en) 2008-03-20
TWI484030B (zh) 2015-05-11
EP1900801B1 (de) 2010-06-16
KR20080025024A (ko) 2008-03-19
EP1900801A1 (de) 2008-03-19

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