ATE488844T1 - Verfahren zur herstellung eines mehrschichtigen elektronischen bauelementes und mehrschichtiges bauelement - Google Patents

Verfahren zur herstellung eines mehrschichtigen elektronischen bauelementes und mehrschichtiges bauelement

Info

Publication number
ATE488844T1
ATE488844T1 AT04257524T AT04257524T ATE488844T1 AT E488844 T1 ATE488844 T1 AT E488844T1 AT 04257524 T AT04257524 T AT 04257524T AT 04257524 T AT04257524 T AT 04257524T AT E488844 T1 ATE488844 T1 AT E488844T1
Authority
AT
Austria
Prior art keywords
ceramic layers
layer
coil
connection electrode
component
Prior art date
Application number
AT04257524T
Other languages
English (en)
Inventor
Tomoyuki Maeda
Hideaki Matsushima
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of ATE488844T1 publication Critical patent/ATE488844T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/02—Fixed inductances of the signal type without magnetic core
    • H01F17/03—Fixed inductances of the signal type without magnetic core with ceramic former
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y10T29/49078—Laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
AT04257524T 2003-12-05 2004-12-03 Verfahren zur herstellung eines mehrschichtigen elektronischen bauelementes und mehrschichtiges bauelement ATE488844T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003407266A JP4211591B2 (ja) 2003-12-05 2003-12-05 積層型電子部品の製造方法および積層型電子部品

Publications (1)

Publication Number Publication Date
ATE488844T1 true ATE488844T1 (de) 2010-12-15

Family

ID=34464020

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04257524T ATE488844T1 (de) 2003-12-05 2004-12-03 Verfahren zur herstellung eines mehrschichtigen elektronischen bauelementes und mehrschichtiges bauelement

Country Status (8)

Country Link
US (2) US7375977B2 (de)
EP (1) EP1538638B1 (de)
JP (1) JP4211591B2 (de)
KR (1) KR100627700B1 (de)
CN (1) CN1291426C (de)
AT (1) ATE488844T1 (de)
DE (1) DE602004030085D1 (de)
TW (1) TWI244661B (de)

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CN1906715B (zh) * 2004-12-20 2010-06-16 株式会社村田制作所 层压陶瓷电子元件及其制造方法
US7474539B2 (en) * 2005-04-11 2009-01-06 Intel Corporation Inductor
WO2007086278A1 (ja) * 2006-01-24 2007-08-02 Nec Corporation 集積回路装置
US7768117B2 (en) * 2007-05-30 2010-08-03 Tessera, Inc. Microelectronic package having interconnected redistribution paths
US8212155B1 (en) * 2007-06-26 2012-07-03 Wright Peter V Integrated passive device
JP5262775B2 (ja) * 2008-03-18 2013-08-14 株式会社村田製作所 積層型電子部品及びその製造方法
WO2010010799A1 (ja) * 2008-07-22 2010-01-28 株式会社村田製作所 電子部品及びその製造方法
WO2010087220A1 (ja) * 2009-01-30 2010-08-05 株式会社村田製作所 電子部品及びその製造方法
WO2010092861A1 (ja) * 2009-02-13 2010-08-19 株式会社村田製作所 電子部品
CN102362320B (zh) * 2009-03-26 2014-07-30 株式会社村田制作所 电子部件及其制造方法
JP4893773B2 (ja) * 2009-04-02 2012-03-07 株式会社村田製作所 電子部品及びその製造方法
JP5333586B2 (ja) * 2009-06-24 2013-11-06 株式会社村田製作所 電子部品及びその製造方法
CN101819853B (zh) * 2010-04-29 2012-05-09 深圳顺络电子股份有限公司 一种叠层线圈元器件的制作方法
KR101153507B1 (ko) * 2010-05-24 2012-06-11 삼성전기주식회사 적층형 인덕터
CN102971809B (zh) * 2010-06-28 2016-02-17 株式会社村田制作所 层叠型陶瓷电子部件及其制造方法
KR20120050837A (ko) * 2010-11-11 2012-05-21 삼성전기주식회사 전도성 필름 및 그 제조방법
KR101153557B1 (ko) 2010-11-23 2012-06-11 삼성전기주식회사 적층형 인덕터 및 적층형 인덕터 제조 방법
US9113569B2 (en) * 2011-03-25 2015-08-18 Ibiden Co., Ltd. Wiring board and method for manufacturing same
KR101218985B1 (ko) * 2011-05-31 2013-01-04 삼성전기주식회사 칩형 코일 부품
JP5459327B2 (ja) * 2012-01-24 2014-04-02 株式会社村田製作所 電子部品
GB2513725B (en) * 2012-02-29 2016-01-13 Murata Manufacturing Co Multilayer inductor and power supply circuit module
KR20140080019A (ko) * 2012-12-20 2014-06-30 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터의 실장 기판
CN106024327B (zh) 2015-03-27 2019-07-19 株式会社村田制作所 层叠线圈部件
JP6508126B2 (ja) * 2016-05-26 2019-05-08 株式会社村田製作所 コイル部品
US10923259B2 (en) * 2016-07-07 2021-02-16 Samsung Electro-Mechanics Co., Ltd. Coil component
JP6569654B2 (ja) * 2016-12-14 2019-09-04 株式会社村田製作所 チップインダクタ
JP6780589B2 (ja) * 2017-06-02 2020-11-04 株式会社村田製作所 電子部品
JP6962129B2 (ja) * 2017-10-20 2021-11-05 Tdk株式会社 積層コイル部品及びその製造方法
JP2019096818A (ja) 2017-11-27 2019-06-20 株式会社村田製作所 積層型コイル部品
JP6954217B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
JP6954216B2 (ja) * 2018-04-02 2021-10-27 株式会社村田製作所 積層型コイル部品
JP7222217B2 (ja) * 2018-10-30 2023-02-15 Tdk株式会社 積層コイル部品
JP7180329B2 (ja) * 2018-11-30 2022-11-30 Tdk株式会社 積層コイル部品
JP7092070B2 (ja) * 2019-03-04 2022-06-28 株式会社村田製作所 積層型コイル部品
JP7260016B2 (ja) * 2019-05-24 2023-04-18 株式会社村田製作所 積層型コイル部品
JP7020455B2 (ja) * 2019-05-24 2022-02-16 株式会社村田製作所 積層型コイル部品
JP7260015B2 (ja) * 2019-05-24 2023-04-18 株式会社村田製作所 積層型コイル部品及びバイアスティー回路
JP7215326B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品
JP7215327B2 (ja) * 2019-05-24 2023-01-31 株式会社村田製作所 積層型コイル部品
KR102769358B1 (ko) * 2019-08-13 2025-02-19 엘지이노텍 주식회사 손떨림 보정을 위한 코일 부재 및 이를 포함하는 카메라 모듈
JP7362416B2 (ja) * 2019-10-23 2023-10-17 Tdk株式会社 コイル部品及びその製造方法
WO2021096878A1 (en) 2019-11-11 2021-05-20 Carpenter Technology Corporation Soft magnetic composite materials and methods and powders for producing the same
JP7409334B2 (ja) * 2021-02-17 2024-01-09 株式会社村田製作所 積層型コイル部品
CN119601349A (zh) * 2024-11-29 2025-03-11 深圳顺络电子股份有限公司 一种片式电感

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JP3097569B2 (ja) * 1996-09-17 2000-10-10 株式会社村田製作所 積層チップインダクタの製造方法
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JP3500319B2 (ja) 1998-01-08 2004-02-23 太陽誘電株式会社 電子部品
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JP3571247B2 (ja) 1999-03-31 2004-09-29 太陽誘電株式会社 積層電子部品
JP2001076928A (ja) 1999-09-03 2001-03-23 Murata Mfg Co Ltd 積層型コイル部品
JP2002015918A (ja) 2000-06-28 2002-01-18 Tdk Corp 積層型電子部品
JP2002134321A (ja) 2000-10-23 2002-05-10 Tdk Corp 高周波コイル及びその製造方法
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Also Published As

Publication number Publication date
US7375977B2 (en) 2008-05-20
KR20050054832A (ko) 2005-06-10
CN1291426C (zh) 2006-12-20
US20080250628A1 (en) 2008-10-16
US7694414B2 (en) 2010-04-13
CN1624826A (zh) 2005-06-08
DE602004030085D1 (de) 2010-12-30
JP2005167130A (ja) 2005-06-23
KR100627700B1 (ko) 2006-09-25
EP1538638A3 (de) 2006-06-28
TWI244661B (en) 2005-12-01
JP4211591B2 (ja) 2009-01-21
US20050122699A1 (en) 2005-06-09
EP1538638A2 (de) 2005-06-08
EP1538638B1 (de) 2010-11-17
TW200522104A (en) 2005-07-01

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