ATE489733T1 - Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement - Google Patents

Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement

Info

Publication number
ATE489733T1
ATE489733T1 AT07859486T AT07859486T ATE489733T1 AT E489733 T1 ATE489733 T1 AT E489733T1 AT 07859486 T AT07859486 T AT 07859486T AT 07859486 T AT07859486 T AT 07859486T AT E489733 T1 ATE489733 T1 AT E489733T1
Authority
AT
Austria
Prior art keywords
layer
light emitting
strain
relieved
light
Prior art date
Application number
AT07859486T
Other languages
English (en)
Inventor
James C Kim
Sungsoo Yi
Original Assignee
Koninkl Philips Electronics Nv
Philips Lumileds Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Philips Lumileds Lighting Co filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE489733T1 publication Critical patent/ATE489733T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/815Bodies having stress relaxation structures, e.g. buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
AT07859486T 2006-12-22 2007-12-20 Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement ATE489733T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/615,601 US20080149946A1 (en) 2006-12-22 2006-12-22 Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light
PCT/IB2007/055262 WO2008078297A2 (en) 2006-12-22 2007-12-20 Semiconductor light emitting device configured to emit multiple wavelengths of light

Publications (1)

Publication Number Publication Date
ATE489733T1 true ATE489733T1 (de) 2010-12-15

Family

ID=39387249

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07859486T ATE489733T1 (de) 2006-12-22 2007-12-20 Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement

Country Status (11)

Country Link
US (3) US20080149946A1 (de)
EP (1) EP2095435B1 (de)
JP (1) JP5189106B2 (de)
KR (1) KR101358701B1 (de)
CN (1) CN101675534B (de)
AT (1) ATE489733T1 (de)
BR (1) BRPI0721111A2 (de)
DE (1) DE602007010827D1 (de)
RU (1) RU2009128240A (de)
TW (1) TWI536599B (de)
WO (1) WO2008078297A2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007102781A1 (en) * 2006-03-08 2007-09-13 Qunano Ab Method for metal-free synthesis of epitaxial semiconductor nanowires on si
US8183587B2 (en) * 2006-12-22 2012-05-22 Qunano Ab LED with upstanding nanowire structure and method of producing such
US8049203B2 (en) 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such
US7663148B2 (en) * 2006-12-22 2010-02-16 Philips Lumileds Lighting Company, Llc III-nitride light emitting device with reduced strain light emitting layer
EP2091862B1 (de) 2006-12-22 2019-12-11 QuNano AB Erhöhte led und herstellungsverfahren dafür
JP5453105B2 (ja) * 2006-12-22 2014-03-26 クナノ アーベー ナノ構造のled及びデバイス
CN101681813B (zh) 2007-01-12 2012-07-11 昆南诺股份有限公司 氮化物纳米线及其制造方法
DE102008035784A1 (de) 2008-07-31 2010-02-11 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
US9293656B2 (en) * 2012-11-02 2016-03-22 Epistar Corporation Light emitting device
US8716723B2 (en) * 2008-08-18 2014-05-06 Tsmc Solid State Lighting Ltd. Reflective layer between light-emitting diodes
EP2357676A4 (de) * 2008-10-17 2013-05-29 Univ Hokkaido Nat Univ Corp Halbleiter-leuchtelementarray und herstellungsverfahren dafür
US20110079766A1 (en) * 2009-10-01 2011-04-07 Isaac Harshman Wildeson Process for fabricating iii-nitride based nanopyramid leds directly on a metalized silicon substrate
US8692261B2 (en) * 2010-05-19 2014-04-08 Koninklijke Philips N.V. Light emitting device grown on a relaxed layer
KR20110131801A (ko) * 2010-05-31 2011-12-07 삼성전자주식회사 발광 소자 및 다중 파장의 광을 만드는 방법
JP5390472B2 (ja) * 2010-06-03 2014-01-15 株式会社東芝 半導体発光装置及びその製造方法
JP5919284B2 (ja) * 2010-10-12 2016-05-18 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. エピ応力が低減された発光デバイス
CN102054916B (zh) * 2010-10-29 2012-11-28 厦门市三安光电科技有限公司 反射器及其制作方法,以及包含该反射器的发光器件
CN108198749A (zh) * 2010-11-04 2018-06-22 皇家飞利浦电子股份有限公司 基于结晶弛豫结构的固态发光器件
KR101591991B1 (ko) 2010-12-02 2016-02-05 삼성전자주식회사 발광소자 패키지 및 그 제조 방법
EP2509120A1 (de) 2011-04-05 2012-10-10 Imec Halbleiterbauelement und -verfahren
US9653286B2 (en) 2012-02-14 2017-05-16 Hexagem Ab Gallium nitride nanowire based electronics
CN103367584B (zh) 2012-03-30 2017-04-05 清华大学 发光二极管及光学元件
CN103367585B (zh) * 2012-03-30 2016-04-13 清华大学 发光二极管
CN103367560B (zh) * 2012-03-30 2016-08-10 清华大学 发光二极管的制备方法
CN103367383B (zh) 2012-03-30 2016-04-13 清华大学 发光二极管
JP6227128B2 (ja) 2013-06-07 2017-11-08 グロ アーベーGlo Ab マルチカラーled及びその製造方法
US10483319B2 (en) 2014-08-08 2019-11-19 Glo Ab Pixilated display device based upon nanowire LEDs and method for making the same
KR102227771B1 (ko) 2014-08-25 2021-03-16 삼성전자주식회사 나노구조 반도체 발광소자
US9620559B2 (en) 2014-09-26 2017-04-11 Glo Ab Monolithic image chip for near-to-eye display
JP2016081562A (ja) 2014-10-09 2016-05-16 ソニー株式会社 表示装置、表示装置の製造方法および電子機器
KR20180133436A (ko) * 2016-05-04 2018-12-14 글로 에이비 상이한 색상의 led를 포함하는 일체형 다색 직시형 디스플레이와 이의 제조 방법
FR3105878B1 (fr) * 2019-12-26 2023-10-27 Aledia Dispositif à composants optoélectroniques tridimensionnels pour découpe au laser et procédé de découpe au laser d'un tel dispositif
EP3869383B1 (de) 2020-02-20 2023-07-19 Continental Automotive Technologies GmbH Verfahren zur identifizierung einer passiven rfid-karte
FR3114682B1 (fr) * 2020-09-29 2023-05-19 Aledia Dispositif optoelectronique a diodes electroluminescentes a affichage couleur

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5055894A (en) * 1988-09-29 1991-10-08 The Boeing Company Monolithic interleaved LED/PIN photodetector array
DE69637304T2 (de) * 1995-03-17 2008-08-07 Toyoda Gosei Co., Ltd. Lichtemittierende Halbleitervorrichtung bestehend aus einer III-V Nitridverbindung
FR2734097B1 (fr) * 1995-05-12 1997-06-06 Thomson Csf Laser a semiconducteurs
JP4032264B2 (ja) * 1997-03-21 2008-01-16 ソニー株式会社 量子細線を有する素子の製造方法
WO1998019375A1 (en) * 1996-10-30 1998-05-07 Hitachi, Ltd. Optical information processor and semiconductor light emitting device suitable for the same
US5795798A (en) * 1996-11-27 1998-08-18 The Regents Of The University Of California Method of making full color monolithic gan based leds
US6274924B1 (en) 1998-11-05 2001-08-14 Lumileds Lighting, U.S. Llc Surface mountable LED package
US6204523B1 (en) * 1998-11-06 2001-03-20 Lumileds Lighting, U.S., Llc High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range
US6534791B1 (en) * 1998-11-27 2003-03-18 Lumileds Lighting U.S., Llc Epitaxial aluminium-gallium nitride semiconductor substrate
JP2001267242A (ja) * 2000-03-14 2001-09-28 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体及びその製造方法
NO20014399L (no) * 2000-11-29 2002-05-30 Hewlett Packard Co En datastruktur og lagrings- og hentemetode som stötter ordinal-tallbasert datasöking og henting
WO2003019678A1 (en) 2001-08-22 2003-03-06 Sony Corporation Nitride semiconductor element and production method for nitride semiconductor element
US7071494B2 (en) * 2002-12-11 2006-07-04 Lumileds Lighting U.S. Llc Light emitting device with enhanced optical scattering
CN1829654B (zh) * 2003-04-04 2013-04-17 库纳诺公司 精确定位的纳米晶须和纳米晶须阵列及其制备方法
US7098589B2 (en) * 2003-04-15 2006-08-29 Luminus Devices, Inc. Light emitting devices with high light collimation
US6995389B2 (en) * 2003-06-18 2006-02-07 Lumileds Lighting, U.S., Llc Heterostructures for III-nitride light emitting devices
DE10327733C5 (de) * 2003-06-18 2012-04-19 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Formung eines Lichtstrahls
KR100525545B1 (ko) * 2003-06-25 2005-10-31 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
EP1667241B1 (de) 2003-08-19 2016-12-07 Nichia Corporation Halbleiter-leuchtdiode und verfahren zu deren herstellung
JP4457609B2 (ja) * 2003-08-26 2010-04-28 豊田合成株式会社 窒化ガリウム(GaN)の製造方法
KR100641989B1 (ko) * 2003-10-15 2006-11-02 엘지이노텍 주식회사 질화물 반도체 발광소자
US7122827B2 (en) * 2003-10-15 2006-10-17 General Electric Company Monolithic light emitting devices based on wide bandgap semiconductor nanostructures and methods for making same
US7012279B2 (en) * 2003-10-21 2006-03-14 Lumileds Lighting U.S., Llc Photonic crystal light emitting device
JP4781821B2 (ja) 2004-01-23 2011-09-28 Hoya株式会社 量子ドット分散発光素子およびその製造方法
US7132677B2 (en) * 2004-02-13 2006-11-07 Dongguk University Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same
US20050205883A1 (en) * 2004-03-19 2005-09-22 Wierer Jonathan J Jr Photonic crystal light emitting device
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
EP1735838B1 (de) * 2004-04-15 2011-10-05 Trustees of Boston University Optische bauelemente mit texturierten halbleiterschichten
US8035113B2 (en) * 2004-04-15 2011-10-11 The Trustees Of Boston University Optical devices featuring textured semiconductor layers
TWI433343B (zh) 2004-06-22 2014-04-01 維帝克股份有限公司 具有改良光輸出的垂直構造半導體裝置
KR100649494B1 (ko) * 2004-08-17 2006-11-24 삼성전기주식회사 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드
US7633097B2 (en) * 2004-09-23 2009-12-15 Philips Lumileds Lighting Company, Llc Growth of III-nitride light emitting devices on textured substrates
WO2006060599A2 (en) 2004-12-02 2006-06-08 The Regents Of The University Of California Semiconductor devices based on coalesced nano-rod arrays
KR100580751B1 (ko) * 2004-12-23 2006-05-15 엘지이노텍 주식회사 질화물 반도체 발광소자 및 그 제조방법
US7804100B2 (en) 2005-03-14 2010-09-28 Philips Lumileds Lighting Company, Llc Polarization-reversed III-nitride light emitting device
KR100631980B1 (ko) 2005-04-06 2006-10-11 삼성전기주식회사 질화물 반도체 소자
US20070243703A1 (en) * 2006-04-14 2007-10-18 Aonex Technololgies, Inc. Processes and structures for epitaxial growth on laminate substrates

Also Published As

Publication number Publication date
KR101358701B1 (ko) 2014-02-07
JP2010514190A (ja) 2010-04-30
EP2095435B1 (de) 2010-11-24
WO2008078297A2 (en) 2008-07-03
US10312404B2 (en) 2019-06-04
US20100264454A1 (en) 2010-10-21
JP5189106B2 (ja) 2013-04-24
US20080149946A1 (en) 2008-06-26
KR20090094162A (ko) 2009-09-03
US9911896B2 (en) 2018-03-06
CN101675534B (zh) 2012-09-05
EP2095435A2 (de) 2009-09-02
DE602007010827D1 (de) 2011-01-05
WO2008078297A3 (en) 2008-10-23
RU2009128240A (ru) 2011-01-27
BRPI0721111A2 (pt) 2014-03-04
US20180175236A1 (en) 2018-06-21
TWI536599B (zh) 2016-06-01
TW200843148A (en) 2008-11-01
CN101675534A (zh) 2010-03-17

Similar Documents

Publication Publication Date Title
ATE489733T1 (de) Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement
ATE535027T1 (de) Lichtemittierende iii-nitrid-vorrichtung mit spannungsreduzierter lichtemittierender schicht
WO2014013400A3 (en) Method for providing horticulture light to a crop and lighting device for horticulture lighting
WO2013016631A3 (en) Method and system for flexible illuminated devices having edge lighting utilizing light active sheet material with integrated light emitting diode
WO2013111542A9 (ja) 窒化物半導体発光装置
TW200737552A (en) Shifting spectral content in solid state light emitters by spatially separating lumiphor films
EP2528115A3 (de) Lichtemittierendes Halbleiterbauelement, Nitrid-Halbleiterschicht und Verfahren zur Herstellung einer Nitrid-Halbleiterschicht
WO2008021988A3 (en) Gan based led with improved light extraction efficiency and method for making the same
TW200717884A (en) Method for manufacturing vertically structured light emitting diode
WO2011091016A3 (en) Solid state lighting device and associated methods of manufacturing
WO2010044561A3 (ko) 3족 질화물 반도체 발광소자
EA201491420A1 (ru) Осветительное остекление для транспортного средства
WO2010036070A3 (ko) 고효율 유기발광소자 및 이의 제조 방법
EP2642536A3 (de) Weißlichtemittierende Diode
TW200625692A (en) White-light emitting device and method for manufacturing the same
WO2012071136A3 (en) Light emitting devices and methods
WO2006076207A3 (en) Light emitting diodes (leds) with improved light extraction by roughening
TW200742126A (en) Semiconductor light emitting device and its manufacturing method
WO2012108627A3 (en) Light emitting diode having photonic crystal structure and method of fabricating the same
WO2012067723A8 (en) Board assemblies, light emitting device assemblies, and methods of making the same
EP2575185A3 (de) Lichtemittierendes Halbleiterbauelement und dessen Herstellungsverfahren
EP2658000A4 (de) Substrat, lichtemittierende vorrichtung und beleuchtungsvorrichtung
ATE542243T1 (de) Lichtemittierende vorrichtung
WO2014166873A3 (de) Leuchtvorrichtung mit variabel einstellbarer lichtfarbe
WO2011116315A3 (en) Light emitting diodes and methods for manufacturing light emitting diodes

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties