ATE493759T1 - Verfahren zur herstellung einer in harz eingebetteten elektronischen vorrichtung - Google Patents

Verfahren zur herstellung einer in harz eingebetteten elektronischen vorrichtung

Info

Publication number
ATE493759T1
ATE493759T1 AT04104575T AT04104575T ATE493759T1 AT E493759 T1 ATE493759 T1 AT E493759T1 AT 04104575 T AT04104575 T AT 04104575T AT 04104575 T AT04104575 T AT 04104575T AT E493759 T1 ATE493759 T1 AT E493759T1
Authority
AT
Austria
Prior art keywords
resin
producing
electronic device
dam frame
embedded electronic
Prior art date
Application number
AT04104575T
Other languages
English (en)
Inventor
Takashi Sugino
Tomonori Shinoda
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of ATE493759T1 publication Critical patent/ATE493759T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
AT04104575T 2003-10-01 2004-09-21 Verfahren zur herstellung einer in harz eingebetteten elektronischen vorrichtung ATE493759T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003342932A JP4152855B2 (ja) 2003-10-01 2003-10-01 樹脂封止型の電子デバイスの製造方法。

Publications (1)

Publication Number Publication Date
ATE493759T1 true ATE493759T1 (de) 2011-01-15

Family

ID=34309103

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04104575T ATE493759T1 (de) 2003-10-01 2004-09-21 Verfahren zur herstellung einer in harz eingebetteten elektronischen vorrichtung

Country Status (6)

Country Link
US (1) US7135358B2 (de)
EP (1) EP1521304B1 (de)
JP (1) JP4152855B2 (de)
AT (1) ATE493759T1 (de)
DE (1) DE602004030752D1 (de)
SG (1) SG110183A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6947748B2 (en) 2000-12-15 2005-09-20 Adaptix, Inc. OFDMA with adaptive subcarrier-cluster configuration and selective loading
JP2006100489A (ja) * 2004-09-29 2006-04-13 Ricoh Co Ltd プリント基板及びそのプリント基板を用いた電子ユニット並びに樹脂流出防止用ダムの形成方法
US7573851B2 (en) 2004-12-07 2009-08-11 Adaptix, Inc. Method and system for switching antenna and channel assignments in broadband wireless networks
DE102005005750B4 (de) * 2005-02-07 2009-06-04 Infineon Technologies Ag Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material und Thermoplast-Duroplast-Verbund
TWI421982B (zh) * 2008-11-21 2014-01-01 先進封裝技術私人有限公司 半導體導線元件及其製造方法
JP5263009B2 (ja) * 2009-06-02 2013-08-14 株式会社村田製作所 基板の製造方法
CN102097340A (zh) * 2010-12-14 2011-06-15 沈阳中光电子有限公司 用cob灌胶封装制作smd的方法
JP2013058330A (ja) * 2011-09-07 2013-03-28 Sumitomo Wiring Syst Ltd シールド線のコネクタ接続端末処理構造部及びシールド線のコネクタ接続端末処理構造部の製造方法
EP2780344A1 (de) 2011-11-15 2014-09-24 Xention Limited Thieno[2,3-c]pyrazole als kaliumkanalinhibitoren
JP2016162964A (ja) * 2015-03-04 2016-09-05 ローム株式会社 半導体装置の製造方法および半導体装置
CN106876342A (zh) * 2016-12-19 2017-06-20 杰群电子科技（东莞）有限公司 一种双面散热半导体元件的制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5612513A (en) * 1995-09-19 1997-03-18 Micron Communications, Inc. Article and method of manufacturing an enclosed electrical circuit using an encapsulant
JPH09301480A (ja) * 1996-05-13 1997-11-25 Hitachi Ltd 搬送用トレイ
US5776798A (en) * 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
JP3819574B2 (ja) * 1997-12-25 2006-09-13 三洋電機株式会社 半導体装置の製造方法
US6130473A (en) * 1998-04-02 2000-10-10 National Semiconductor Corporation Lead frame chip scale package
US6580159B1 (en) * 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
DE10024336A1 (de) * 2000-05-17 2001-11-22 Heidenhain Gmbh Dr Johannes Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung
JP2003142634A (ja) * 2001-08-20 2003-05-16 Sony Corp 半導体装置、その製造方法及び電子機器
JP2003218251A (ja) * 2002-01-28 2003-07-31 Murata Mfg Co Ltd 電子デバイスおよびその製造方法

Also Published As

Publication number Publication date
EP1521304A2 (de) 2005-04-06
SG110183A1 (en) 2005-04-28
EP1521304B1 (de) 2010-12-29
US20050074922A1 (en) 2005-04-07
EP1521304A3 (de) 2006-10-11
US7135358B2 (en) 2006-11-14
JP2005109300A (ja) 2005-04-21
JP4152855B2 (ja) 2008-09-17
DE602004030752D1 (de) 2011-02-10

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