ATE494345T1 - Schleifmittel - Google Patents

Schleifmittel

Info

Publication number: ATE494345T1
Authority: AT; Austria
Prior art keywords: polishing material; abrasive grains; polishing; rare earth; contained
Prior art date: 2000-10-06

Application number

AT01972649T

Other languages

English (en)

Inventor

Yoshitsugu Uchino

Hidehiko Yamasaki

Shigeru Kuwabara

Original Assignee

Mitsui Mining & Smelting Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-10-06

Filing date

2001-10-02

Publication date

2011-01-15

2001-10-02 Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co

2011-01-15 Application granted granted Critical

2011-01-15 Publication of ATE494345T1 publication Critical patent/ATE494345T1/de

Links

239000003082 abrasive agent Substances 0.000 title 1
238000005498 polishing Methods 0.000 abstract 7
239000000463 material Substances 0.000 abstract 6
239000006061 abrasive grain Substances 0.000 abstract 5
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
229910000420 cerium oxide Inorganic materials 0.000 abstract 2
239000002612 dispersion medium Substances 0.000 abstract 2
BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract 2
239000002244 precipitate Substances 0.000 abstract 2
229910001404 rare earth metal oxide Inorganic materials 0.000 abstract 2
239000001577 tetrasodium phosphonato phosphate Substances 0.000 abstract 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 abstract 1
239000001913 cellulose Substances 0.000 abstract 1
229920002678 cellulose Polymers 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract 1
239000002270 dispersing agent Substances 0.000 abstract 1
KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 abstract 1
239000000377 silicon dioxide Substances 0.000 abstract 1
239000011734 sodium Substances 0.000 abstract 1
229910052708 sodium Inorganic materials 0.000 abstract 1
235000019982 sodium hexametaphosphate Nutrition 0.000 abstract 1
GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 abstract 1
238000007711 solidification Methods 0.000 abstract 1
235000019818 tetrasodium diphosphate Nutrition 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Mechanical Engineering (AREA)
Geochemistry & Mineralogy (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Polishing Bodies And Polishing Tools (AREA)
Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Luminescent Compositions (AREA)
Details Of Television Scanning (AREA)
Detergent Compositions (AREA)

AT01972649T 2000-10-06 2001-10-02 Schleifmittel ATE494345T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000307100		2000-10-06
PCT/JP2001/008671 WO2002031079A1 (en)	2000-10-06	2001-10-02	Abrasive material

Publications (1)

Publication Number	Publication Date
ATE494345T1 true ATE494345T1 (de)	2011-01-15

Family

ID=18787662

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT01972649T ATE494345T1 (de)	2000-10-06	2001-10-02	Schleifmittel

Country Status (11)

Country	Link
US (1)	US6824578B2 (de)
EP (1)	EP1338636B1 (de)
JP (1)	JP3986960B2 (de)
KR (1)	KR100539007B1 (de)
CN (1)	CN1300277C (de)
AT (1)	ATE494345T1 (de)
AU (1)	AU2001292332A1 (de)
DE (1)	DE60143812D1 (de)
MY (1)	MY136599A (de)
TW (1)	TWI281493B (de)
WO (1)	WO2002031079A1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7004819B2 (en) *	2002-01-18	2006-02-28	Cabot Microelectronics Corporation	CMP systems and methods utilizing amine-containing polymers
JP3463999B1 (ja) *	2002-05-16	2003-11-05	三井金属鉱業株式会社	セリウム系研摩材の製造方法
WO2004068570A1 (ja)	2003-01-31	2004-08-12	Hitachi Chemical Co., Ltd.	Cmp研磨剤及び研磨方法
US7073496B2 (en) *	2003-03-26	2006-07-11	Saint-Gobain Abrasives, Inc.	High precision multi-grit slicing blade
US7300478B2 (en) *	2003-05-22	2007-11-27	Ferro Corporation	Slurry composition and method of use
KR101072269B1 (ko) *	2004-03-30	2011-10-11	주식회사 동진쎄미켐	에쳔트를 포함하는 화학-기계적 연마 슬러리 조성물
US9293344B2 (en) *	2004-07-23	2016-03-22	Hitachi Chemical Company, Ltd.	Cmp polishing slurry and method of polishing substrate
US7531105B2 (en) *	2004-11-05	2009-05-12	Cabot Microelectronics Corporation	Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7504044B2 (en) *	2004-11-05	2009-03-17	Cabot Microelectronics Corporation	Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
TWI271555B (en) *	2005-06-13	2007-01-21	Basf Ag	Slurry composition for polishing color filter
KR101028622B1 (ko) *	2005-10-19	2011-04-11	히다치 가세고교 가부시끼가이샤	산화세륨 슬러리, 산화세륨 연마액 및 이들을 이용한기판의 연마 방법
KR100813100B1 (ko) *	2006-06-29	2008-03-17	성균관대학교산학협력단	실시간 확장 가능한 스테레오 매칭 시스템 및 방법
CN101484982A (zh) *	2006-07-04	2009-07-15	日立化成工业株式会社	Cmp用研磨液
TWI400142B (zh) *	2006-07-28	2013-07-01	Toray Industries	相互侵入高分子網目構造體及研磨墊與其製法
US7696095B2 (en) *	2007-02-23	2010-04-13	Ferro Corporation	Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide
JP5819036B2 (ja) *	2008-03-25	2015-11-18	三井金属鉱業株式会社	セリウム系研摩材スラリー
CN101608097B (zh) *	2009-07-14	2011-12-21	上海华明高纳稀土新材料有限公司	化学机械抛光用纳米氧化铈浆液及其制备方法
JP5774283B2 (ja) *	2010-04-08	2015-09-09	株式会社フジミインコーポレーテッド	研磨用組成物及び研磨方法
JP5516184B2 (ja) *	2010-07-26	2014-06-11	信越化学工業株式会社	合成石英ガラス基板の製造方法
WO2012032451A1 (en)	2010-09-08	2012-03-15	Basf Se	Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
US20130260027A1 (en) *	2010-12-29	2013-10-03	Hoya Corporation	Method for manufacturing glass substrate for magnetic disk, and method for manufacturing magnetic disk
JPWO2013065491A1 (ja) *	2011-11-01	2015-04-02	旭硝子株式会社	ガラス基板の製造方法
MY171093A (en) *	2012-02-10	2019-09-25	Basf Se	Chemical mechanical polishing (cmp) composition comprising a protein
KR20140000496A (ko)	2012-06-22	2014-01-03	에스케이하이닉스 주식회사	연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법
CN103923604A (zh) *	2013-01-15	2014-07-16	安阳市岷山有色金属有限责任公司	一种铈系研磨材料
US9281210B2 (en) *	2013-10-10	2016-03-08	Cabot Microelectronics Corporation	Wet-process ceria compositions for polishing substrates, and methods related thereto
US9340706B2 (en) *	2013-10-10	2016-05-17	Cabot Microelectronics Corporation	Mixed abrasive polishing compositions
CN103756571A (zh) *	2013-12-25	2014-04-30	上海华明高纳稀土新材料有限公司	稀土抛光粉及其制备方法
JP6204506B2 (ja) *	2014-01-31	2017-09-27	Hoya株式会社	使用済み研磨スラリーの再生方法、磁気ディスク用ガラス基板の製造方法
CN103992743B (zh) *	2014-05-09	2018-06-19	杰明纳微电子股份有限公司	含有二氧化铈粉体与胶体二氧化硅混合磨料的抛光液及其制备工艺
CN106661428B (zh) *	2014-07-31	2020-01-31	Hoya株式会社	研磨浆料的制作方法、研磨磨粒、研磨浆料、以及玻璃基板的制造方法
KR20180095846A (ko) *	2015-12-16	2018-08-28	로디아 오퍼레이션스	인산염 유리 또는 플루오로인산염 유리 기재를 폴리싱하기 위한 방법
CN106978089A (zh) *	2017-04-20	2017-07-25	德米特（苏州）电子环保材料有限公司	一种稀土抛光粉的制备方法
WO2019198622A1 (ja) *	2018-04-11	2019-10-17	日揮触媒化成株式会社	研磨組成物
CN109227227B (zh) *	2018-11-28	2020-10-16	湖南兴龙环境艺术工程有限公司	一种玻璃研磨磨盘的制备方法
EP4499766A4 (de) *	2022-03-24	2026-04-29	Cmc Mat Llc	Doppeladditivpolierzusammensetzung für glassubstrate
KR20250026161A (ko) *	2022-06-27	2025-02-25	미쓰이금속광업주식회사	연마재 슬러리 및 그 연마 방법
CN119547183A (zh) *	2022-06-27	2025-02-28	三井金属矿业株式会社	研磨材浆料及其研磨方法
CN119137235A (zh) *	2022-07-12	2024-12-13	株式会社力森诺科	铈系研磨材料、研磨液、研磨液的制造方法和玻璃研磨方法
CN115519484A (zh) *	2022-09-27	2022-12-27	郑州磨料磨具磨削研究所有限公司	一种高气孔率的陶瓷结合剂金刚石砂轮及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5645975A (en)	1979-09-20	1981-04-25	Akira Suzuki	Additive for abrasive material
JPS56147880A (en)	1980-04-19	1981-11-17	Akira Suzuki	Additive for abrasive material
EP0045826A1 (de)	1980-08-12	1982-02-17	Monsanto Company	Dicalciumphosphat-Dihydrat mit verbesserter Stabilität und Verfahren zu dessen Herstellung
FR2624519A1 (fr)	1987-12-09	1989-06-16	Rhone Poulenc Chimie	Composition de polissage perfectionnee a base de cerium et son procede de preparation
JP2783330B2 (ja)	1989-11-01	1998-08-06	株式会社フジミインコーポレーテッド	ガラス研磨用研磨材
JP2832270B2 (ja)	1993-05-18	1998-12-09	三井金属鉱業株式会社	ガラス研磨用研磨材
JPH09143455A (ja)	1995-09-21	1997-06-03	Mitsubishi Chem Corp	ハードディスク基板の研磨用組成物及びこれを用いる研磨方法
JP3856513B2 (ja)	1996-12-26	2006-12-13	昭和電工株式会社	ガラス研磨用研磨材組成物
BR9810241A (pt)	1997-06-04	2000-09-05	Toto Ltd	Agente de limpeza para limpar a superfìcie de um substrato, composição de sub-revestimento para formar um sub-revestimento sobre a superfìcie de um substrato, processo para formar um revestimento fotocataliticamente hidrofilicável sobre a superfìcie de um substrato, conjunto, e, membro
US6248143B1 (en) *	1998-01-27	2001-06-19	Showa Denko Kabushiki Kaisha	Composition for polishing glass and polishing method
JP3857799B2 (ja)	1998-01-27	2006-12-13	昭和電工株式会社	ガラス研磨用研磨材組成物およびその研磨方法
JP2000063806A (ja)	1998-08-17	2000-02-29	Okamoto Machine Tool Works Ltd	研磨剤スラリ−およびその調製方法
JP3728950B2 (ja)	1998-12-04	2005-12-21	株式会社日立製作所	半導体装置の製造方法及び平坦化加工装置
JP2000256656A (ja)	1999-03-04	2000-09-19	Hitachi Chem Co Ltd	Ｃｍｐ研磨剤及び基板の研磨方法
JP2000351956A (ja)	1999-06-10	2000-12-19	Seimi Chem Co Ltd	増粘剤を添加した半導体用研磨剤

2001
- 2001-09-24 TW TW090123439A patent/TWI281493B/zh not_active IP Right Cessation
- 2001-09-25 MY MYPI20014476A patent/MY136599A/en unknown
- 2001-10-02 US US10/363,678 patent/US6824578B2/en not_active Expired - Lifetime
- 2001-10-02 DE DE60143812T patent/DE60143812D1/de not_active Expired - Lifetime
- 2001-10-02 JP JP2002534451A patent/JP3986960B2/ja not_active Expired - Fee Related
- 2001-10-02 KR KR10-2003-7003566A patent/KR100539007B1/ko not_active Expired - Lifetime
- 2001-10-02 CN CNB018169368A patent/CN1300277C/zh not_active Expired - Lifetime
- 2001-10-02 AU AU2001292332A patent/AU2001292332A1/en not_active Abandoned
- 2001-10-02 AT AT01972649T patent/ATE494345T1/de not_active IP Right Cessation
- 2001-10-02 WO PCT/JP2001/008671 patent/WO2002031079A1/ja not_active Ceased
- 2001-10-02 EP EP01972649A patent/EP1338636B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP1338636B1 (de)	2011-01-05
AU2001292332A1 (en)	2002-04-22
EP1338636A1 (de)	2003-08-27
CN1697869A (zh)	2005-11-16
MY136599A (en)	2008-10-31
EP1338636A4 (de)	2007-08-29
TWI281493B (en)	2007-05-21
US6824578B2 (en)	2004-11-30
KR100539007B1 (ko)	2005-12-26
JPWO2002031079A1 (ja)	2004-02-19
JP3986960B2 (ja)	2007-10-03
KR20030048032A (ko)	2003-06-18
WO2002031079A1 (en)	2002-04-18
DE60143812D1 (de)	2011-02-17
CN1300277C (zh)	2007-02-14
US20040010978A1 (en)	2004-01-22

Legal Events

Date	Code	Title	Description
2011-07-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
DE60143812D1 (de)	2011-02-17	Schleifmittel
MY127740A (en)	2006-12-29	Cerium-based abrasive, stock material therefor, and methods of producing them
DE60030444D1 (de)	2006-10-12	Cmp-zusammensetzung enthaltend silanmodifizierte-schleifteilchen
WO2002004573A3 (en)	2003-08-21	Ready-to-use stable chemical-mechanical polishing slurries
DE60134970D1 (de)	2008-09-04	Hochgradig delaminierte hexagonale bornitridpulver, herstellungsverfahren, und verwendungen davon
ATE350426T1 (de)	2007-01-15	Keramische aggregatteilchen
IL110193A0 (en)	1994-10-21	A sol-gel alumina abrasive wheel with improved corner holding
DE69417066D1 (de)	1999-04-15	Schleifkorn auf basis von alpha-aluminiumoxid
AU4810200A (en)	2000-12-18	Slurry composition and method of chemical mechanical polishing using same
EP1313436A4 (de)	2004-09-15	Abrasive zubereitung und verfahren zu deren herstellung
IL120912A0 (en)	1997-09-30	Fluoride additive containing chemical mechanical polishing slurry and method for use of same
TW200736354A (en)	2007-10-01	Free radical-forming activator attached to solid and used to enhance CMP formulations
MY118116A (en)	2004-08-30	Method of polishing a memory or rigid disk with an ammonia and/or halide-containing composition
AU1660101A (en)	2001-05-30	Composition and method for planarizing surfaces
EP0959116A3 (de)	2002-03-06	Poliermittel und Polierverfahren
ATE449827T1 (de)	2009-12-15	Cerbasierendes schleifmittel und dessen herstellung
SG10201901971PA (en)	2019-10-30	Polishing composition
EP1130630A4 (de)	2007-01-10	Polierpaste zum polieren eines lsi
PL1917214T3 (pl)	2010-05-31	Kompozycja do polerowania szkła na bazie tlenku ceru i sposób jej wytwarzania
PL346057A1 (en)	2002-01-14	Toothpaste comprising fine and coarse calcium carbonate
DE50311351D1 (de)	2009-05-07	Schleifmittel mit verbesserten schleifeigenschaften
TWI263672B (en)	2006-10-11	Aqueous dispersion for chemical/mechanical polishing
WO2004106455A3 (en)	2005-07-21	Slurry composition and method of use
WO2003020839A8 (en)	2004-04-15	Polishing composition
CA2344980A1 (en)	2001-11-04	Improved abrasive grain