ATE494345T1 - Schleifmittel - Google Patents

Schleifmittel

Info

Publication number: ATE494345T1
Authority: AT; Austria
Prior art keywords: polishing material; abrasive grains; polishing; rare earth; contained
Prior art date: 2000-10-06

Application number

AT01972649T

Other languages

English (en)

Inventor

Yoshitsugu Uchino

Hidehiko Yamasaki

Shigeru Kuwabara

Original Assignee

Mitsui Mining & Smelting Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-10-06

Filing date

2001-10-02

Publication date

2011-01-15

2001-10-02 Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co

2011-01-15 Application granted granted Critical

2011-01-15 Publication of ATE494345T1 publication Critical patent/ATE494345T1/de

Links

239000003082 abrasive agent Substances 0.000 title 1
238000005498 polishing Methods 0.000 abstract 7
239000000463 material Substances 0.000 abstract 6
239000006061 abrasive grain Substances 0.000 abstract 5
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
229910000420 cerium oxide Inorganic materials 0.000 abstract 2
239000002612 dispersion medium Substances 0.000 abstract 2
BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract 2
239000002244 precipitate Substances 0.000 abstract 2
229910001404 rare earth metal oxide Inorganic materials 0.000 abstract 2
239000001577 tetrasodium phosphonato phosphate Substances 0.000 abstract 2
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 abstract 1
239000001913 cellulose Substances 0.000 abstract 1
229920002678 cellulose Polymers 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract 1
239000002270 dispersing agent Substances 0.000 abstract 1
KVBGVZZKJNLNJU-UHFFFAOYSA-N naphthalene-2-sulfonic acid Chemical compound C1=CC=CC2=CC(S(=O)(=O)O)=CC=C21 KVBGVZZKJNLNJU-UHFFFAOYSA-N 0.000 abstract 1
239000000377 silicon dioxide Substances 0.000 abstract 1
239000011734 sodium Substances 0.000 abstract 1
229910052708 sodium Inorganic materials 0.000 abstract 1
235000019982 sodium hexametaphosphate Nutrition 0.000 abstract 1
GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 abstract 1
238000007711 solidification Methods 0.000 abstract 1
235000019818 tetrasodium diphosphate Nutrition 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Mechanical Engineering (AREA)
Geochemistry & Mineralogy (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Polishing Bodies And Polishing Tools (AREA)
Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
Detergent Compositions (AREA)
Luminescent Compositions (AREA)
Details Of Television Scanning (AREA)
Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)

AT01972649T 2000-10-06 2001-10-02 Schleifmittel ATE494345T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000307100		2000-10-06
PCT/JP2001/008671 WO2002031079A1 (en)	2000-10-06	2001-10-02	Abrasive material

Publications (1)

Publication Number	Publication Date
ATE494345T1 true ATE494345T1 (de)	2011-01-15

Family

ID=18787662

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT01972649T ATE494345T1 (de)	2000-10-06	2001-10-02	Schleifmittel

Country Status (11)

Country	Link
US (1)	US6824578B2 (de)
EP (1)	EP1338636B1 (de)
JP (1)	JP3986960B2 (de)
KR (1)	KR100539007B1 (de)
CN (1)	CN1300277C (de)
AT (1)	ATE494345T1 (de)
AU (1)	AU2001292332A1 (de)
DE (1)	DE60143812D1 (de)
MY (1)	MY136599A (de)
TW (1)	TWI281493B (de)
WO (1)	WO2002031079A1 (de)

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US7004819B2 (en) *	2002-01-18	2006-02-28	Cabot Microelectronics Corporation	CMP systems and methods utilizing amine-containing polymers
JP3463999B1 (ja) *	2002-05-16	2003-11-05	三井金属鉱業株式会社	セリウム系研摩材の製造方法
TWI276169B (en) *	2003-01-31	2007-03-11	Hitachi Chemical Co Ltd	CMP abrasive and polishing method
US7073496B2 (en) *	2003-03-26	2006-07-11	Saint-Gobain Abrasives, Inc.	High precision multi-grit slicing blade
US7300478B2 (en) *	2003-05-22	2007-11-27	Ferro Corporation	Slurry composition and method of use
KR101072269B1 (ko) *	2004-03-30	2011-10-11	주식회사 동진쎄미켐	에쳔트를 포함하는 화학-기계적 연마 슬러리 조성물
EP1796152B1 (de)	2004-07-23	2019-02-27	Hitachi Chemical Company, Ltd.	Cmp-poliermittel und verfahren zum polieren eines substrats
US7504044B2 (en) *	2004-11-05	2009-03-17	Cabot Microelectronics Corporation	Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7531105B2 (en) *	2004-11-05	2009-05-12	Cabot Microelectronics Corporation	Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
TWI271555B (en) *	2005-06-13	2007-01-21	Basf Ag	Slurry composition for polishing color filter
JP4983603B2 (ja) *	2005-10-19	2012-07-25	日立化成工業株式会社	酸化セリウムスラリー、酸化セリウム研磨液及びこれらを用いた基板の研磨方法
KR100813100B1 (ko) *	2006-06-29	2008-03-17	성균관대학교산학협력단	실시간 확장 가능한 스테레오 매칭 시스템 및 방법
CN101484982A (zh) *	2006-07-04	2009-07-15	日立化成工业株式会社	Cmp用研磨液
TWI400142B (zh) *	2006-07-28	2013-07-01	Toray Industries	相互侵入高分子網目構造體及研磨墊與其製法
US7696095B2 (en) *	2007-02-23	2010-04-13	Ferro Corporation	Auto-stopping slurries for chemical-mechanical polishing of topographic dielectric silicon dioxide
JP5819036B2 (ja) *	2008-03-25	2015-11-18	三井金属鉱業株式会社	セリウム系研摩材スラリー
CN101608097B (zh) *	2009-07-14	2011-12-21	上海华明高纳稀土新材料有限公司	化学机械抛光用纳米氧化铈浆液及其制备方法
JP5774283B2 (ja) *	2010-04-08	2015-09-09	株式会社フジミインコーポレーテッド	研磨用組成物及び研磨方法
JP5516184B2 (ja) *	2010-07-26	2014-06-11	信越化学工業株式会社	合成石英ガラス基板の製造方法
KR101906135B1 (ko)	2010-09-08	2018-10-10	바스프 에스이	수성 연마 조성물 및 산화규소 유전체 및 폴리실리콘 필름을 함유하는 기판의 화학적 기계적 연마 방법
WO2012090510A1 (ja) *	2010-12-29	2012-07-05	Hoya株式会社	磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法
CN103917332A (zh) *	2011-11-01	2014-07-09	旭硝子株式会社	玻璃基板的制造方法
EP2812911B1 (de) *	2012-02-10	2017-06-28	Basf Se	Chemisch-mechanische polierzusammensetzung mit einem protein
KR20140000496A (ko)	2012-06-22	2014-01-03	에스케이하이닉스 주식회사	연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법
CN103923604A (zh) *	2013-01-15	2014-07-16	安阳市岷山有色金属有限责任公司	一种铈系研磨材料
US9340706B2 (en) *	2013-10-10	2016-05-17	Cabot Microelectronics Corporation	Mixed abrasive polishing compositions
US9281210B2 (en) *	2013-10-10	2016-03-08	Cabot Microelectronics Corporation	Wet-process ceria compositions for polishing substrates, and methods related thereto
CN103756571A (zh) *	2013-12-25	2014-04-30	上海华明高纳稀土新材料有限公司	稀土抛光粉及其制备方法
CN105939817B (zh) *	2014-01-31	2018-04-10	Hoya株式会社	使用过的研磨浆料的再生方法、磁盘用玻璃基板的制造方法
CN103992743B (zh) *	2014-05-09	2018-06-19	杰明纳微电子股份有限公司	含有二氧化铈粉体与胶体二氧化硅混合磨料的抛光液及其制备工艺
MY182259A (en) *	2014-07-31	2021-01-18	Hoya Corp	Method for producing polishing slurry, method for manufacturing glass substrate, and mass of raw-material abrasive particles
EP3417022A1 (de) *	2015-12-16	2018-12-26	Rhodia Operations	Verfahren zum polieren eines phosphatglas- oder fluorphosphatglassubstrats
CN106978089A (zh) *	2017-04-20	2017-07-25	德米特（苏州）电子环保材料有限公司	一种稀土抛光粉的制备方法
WO2019198622A1 (ja) *	2018-04-11	2019-10-17	日揮触媒化成株式会社	研磨組成物
CN109227227B (zh) *	2018-11-28	2020-10-16	湖南兴龙环境艺术工程有限公司	一种玻璃研磨磨盘的制备方法
WO2023183100A1 (en) *	2022-03-24	2023-09-28	Cmc Materials, Inc.	Dual additive polishing composition for glass substrates
KR20250026161A (ko) *	2022-06-27	2025-02-25	미쓰이금속광업주식회사	연마재 슬러리 및 그 연마 방법
CN119547183A (zh) *	2022-06-27	2025-02-28	三井金属矿业株式会社	研磨材浆料及其研磨方法
WO2024014425A1 (ja) *	2022-07-12	2024-01-18	株式会社レゾナック	セリウム系研磨材、研磨液、研磨液の製造方法、及びガラス研磨方法
CN115519484A (zh) *	2022-09-27	2022-12-27	郑州磨料磨具磨削研究所有限公司	一种高气孔率的陶瓷结合剂金刚石砂轮及其制备方法

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JPS56147880A (en)	1980-04-19	1981-11-17	Akira Suzuki	Additive for abrasive material
EP0045826A1 (de)	1980-08-12	1982-02-17	Monsanto Company	Dicalciumphosphat-Dihydrat mit verbesserter Stabilität und Verfahren zu dessen Herstellung
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2001
- 2001-09-24 TW TW090123439A patent/TWI281493B/zh not_active IP Right Cessation
- 2001-09-25 MY MYPI20014476A patent/MY136599A/en unknown
- 2001-10-02 WO PCT/JP2001/008671 patent/WO2002031079A1/ja not_active Ceased
- 2001-10-02 US US10/363,678 patent/US6824578B2/en not_active Expired - Lifetime
- 2001-10-02 CN CNB018169368A patent/CN1300277C/zh not_active Expired - Lifetime
- 2001-10-02 JP JP2002534451A patent/JP3986960B2/ja not_active Expired - Fee Related
- 2001-10-02 AT AT01972649T patent/ATE494345T1/de not_active IP Right Cessation
- 2001-10-02 DE DE60143812T patent/DE60143812D1/de not_active Expired - Lifetime
- 2001-10-02 KR KR10-2003-7003566A patent/KR100539007B1/ko not_active Expired - Lifetime
- 2001-10-02 EP EP01972649A patent/EP1338636B1/de not_active Expired - Lifetime
- 2001-10-02 AU AU2001292332A patent/AU2001292332A1/en not_active Abandoned

Also Published As

Publication number	Publication date
JPWO2002031079A1 (ja)	2004-02-19
MY136599A (en)	2008-10-31
US6824578B2 (en)	2004-11-30
EP1338636A4 (de)	2007-08-29
WO2002031079A1 (en)	2002-04-18
EP1338636B1 (de)	2011-01-05
EP1338636A1 (de)	2003-08-27
CN1697869A (zh)	2005-11-16
CN1300277C (zh)	2007-02-14
TWI281493B (en)	2007-05-21
KR20030048032A (ko)	2003-06-18
AU2001292332A1 (en)	2002-04-22
US20040010978A1 (en)	2004-01-22
JP3986960B2 (ja)	2007-10-03
DE60143812D1 (de)	2011-02-17
KR100539007B1 (ko)	2005-12-26

Legal Events

Date	Code	Title	Description
2011-07-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE494345T1 (de)	2011-01-15	Schleifmittel
MY127740A (en)	2006-12-29	Cerium-based abrasive, stock material therefor, and methods of producing them
JP3340747B2 (ja)	2002-11-05	ゾル−ゲルアルミナ砥粒及びその製造方法
DE60030444D1 (de)	2006-10-12	Cmp-zusammensetzung enthaltend silanmodifizierte-schleifteilchen
DE60134970D1 (de)	2008-09-04	Hochgradig delaminierte hexagonale bornitridpulver, herstellungsverfahren, und verwendungen davon
DE60125808D1 (de)	2007-02-15	Keramische aggregatteilchen
HUT70361A (en)	1995-10-30	Sol-gel alumina grinding wheel with improved corner holding
DE69417066D1 (de)	1999-04-15	Schleifkorn auf basis von alpha-aluminiumoxid
AU4810200A (en)	2000-12-18	Slurry composition and method of chemical mechanical polishing using same
EP1313436A4 (de)	2004-09-15	Abrasive zubereitung und verfahren zu deren herstellung
TW200736354A (en)	2007-10-01	Free radical-forming activator attached to solid and used to enhance CMP formulations
EP0947469A3 (de)	2000-01-12	Schleifmittel
MY120865A (en)	2005-11-30	Composition and method for planarizing surfaces
MY118116A (en)	2004-08-30	Method of polishing a memory or rigid disk with an ammonia and/or halide-containing composition
WO2003025085A1 (en)	2003-03-27	Cerium-based abrasive material slurry and method for producing cerium-based abrasive material slurry
EP0959116A3 (de)	2002-03-06	Poliermittel und Polierverfahren
ATE449827T1 (de)	2009-12-15	Cerbasierendes schleifmittel und dessen herstellung
SG10201901971PA (en)	2019-10-30	Polishing composition
PL1917214T3 (pl)	2010-05-31	Kompozycja do polerowania szkła na bazie tlenku ceru i sposób jej wytwarzania
AU5288399A (en)	2000-03-14	Toothpaste comprising fine and coarse calcium carbonate
DE50311351D1 (de)	2009-05-07	Schleifmittel mit verbesserten schleifeigenschaften
TWI263672B (en)	2006-10-11	Aqueous dispersion for chemical/mechanical polishing
WO2004106455A3 (en)	2005-07-21	Slurry composition and method of use
WO2002020214A3 (en)	2002-05-30	Method for polishing a memory or rigid disk with a polishing composition containing an oxidized halide and an acid
DE60139939D1 (de)	2009-10-29	Aluminiumoxid-yttriumoxid-zirkonoxid eutektium enthaltende, geschmolzene schleifpartikel, schleifgegenstände und verfahren zur herstellung und verwendung derselben