ATE496392T1 - Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement - Google Patents
Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelementInfo
- Publication number
- ATE496392T1 ATE496392T1 AT05709466T AT05709466T ATE496392T1 AT E496392 T1 ATE496392 T1 AT E496392T1 AT 05709466 T AT05709466 T AT 05709466T AT 05709466 T AT05709466 T AT 05709466T AT E496392 T1 ATE496392 T1 AT E496392T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon carbide
- carbide substrate
- production method
- semiconductor component
- carbide semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
- H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
- H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
- H10P30/2042—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors into crystalline silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
Landscapes
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Carbon And Carbon Compounds (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004030972 | 2004-02-06 | ||
| PCT/JP2005/001240 WO2005076327A1 (ja) | 2004-02-06 | 2005-01-28 | 炭化珪素半導体素子及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE496392T1 true ATE496392T1 (de) | 2011-02-15 |
Family
ID=34836022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05709466T ATE496392T1 (de) | 2004-02-06 | 2005-01-28 | Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7462540B2 (de) |
| EP (1) | EP1713117B1 (de) |
| JP (1) | JP4418794B2 (de) |
| KR (1) | KR20060125700A (de) |
| CN (1) | CN100490077C (de) |
| AT (1) | ATE496392T1 (de) |
| DE (1) | DE602005025976D1 (de) |
| WO (1) | WO2005076327A1 (de) |
Families Citing this family (59)
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| US7334918B2 (en) * | 2003-05-07 | 2008-02-26 | Bayco Products, Ltd. | LED lighting array for a portable task light |
| WO2005076327A1 (ja) * | 2004-02-06 | 2005-08-18 | Matsushita Electric Industrial Co., Ltd. | 炭化珪素半導体素子及びその製造方法 |
| US7812441B2 (en) | 2004-10-21 | 2010-10-12 | Siliconix Technology C.V. | Schottky diode with improved surge capability |
| US7394158B2 (en) * | 2004-10-21 | 2008-07-01 | Siliconix Technology C.V. | Solderable top metal for SiC device |
| US9419092B2 (en) * | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
| US7834376B2 (en) | 2005-03-04 | 2010-11-16 | Siliconix Technology C. V. | Power semiconductor switch |
| US8368165B2 (en) * | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
| JP2007115875A (ja) * | 2005-10-20 | 2007-05-10 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置およびその製造方法 |
| JP4961805B2 (ja) * | 2006-04-03 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| KR101170210B1 (ko) * | 2006-05-01 | 2012-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 탄소 합금된 si 필름을 사용한 초박형 접합 형성 방법 |
| US9627552B2 (en) * | 2006-07-31 | 2017-04-18 | Vishay-Siliconix | Molybdenum barrier metal for SiC Schottky diode and process of manufacture |
| WO2008020911A2 (en) * | 2006-08-17 | 2008-02-21 | Cree, Inc. | High power insulated gate bipolar transistors |
| CN101542688B (zh) * | 2007-03-29 | 2011-03-30 | 松下电器产业株式会社 | 碳化硅半导体元件的制造方法 |
| WO2008136126A1 (ja) * | 2007-04-20 | 2008-11-13 | Canon Anelva Corporation | 炭化ケイ素基板を有する半導体デバイスのアニール方法と半導体デバイス |
| JP2008283143A (ja) * | 2007-05-14 | 2008-11-20 | Ulvac Japan Ltd | 処理装置、トランジスタ製造方法 |
| JP4600438B2 (ja) * | 2007-06-21 | 2010-12-15 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| GB2457410B (en) * | 2007-06-22 | 2012-01-04 | Panasonic Corp | Plasma display panel driving device and plasma display |
| US8039204B2 (en) * | 2007-07-25 | 2011-10-18 | Mitsubishi Electric Corporation | Manufacturing method of silicon carbide semiconductor apparatus |
| US7820534B2 (en) * | 2007-08-10 | 2010-10-26 | Mitsubishi Electric Corporation | Method of manufacturing silicon carbide semiconductor device |
| JP2009206413A (ja) * | 2008-02-29 | 2009-09-10 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| JP2009212365A (ja) * | 2008-03-05 | 2009-09-17 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| JP4935741B2 (ja) * | 2008-04-02 | 2012-05-23 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
| JP4480775B2 (ja) * | 2008-04-23 | 2010-06-16 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
| DE102008023609A1 (de) * | 2008-05-15 | 2009-11-19 | Siced Electronics Development Gmbh & Co. Kg | Verfahren zum thermischen Ausheilen und elektrischen Aktivieren implantierter Siliziumcarbidhalbleiter |
| KR101063914B1 (ko) * | 2008-08-08 | 2011-09-14 | 한국전기연구원 | 탄화규소에 내열금속카바이드를 오믹 접촉 형성시키는 방법및 이를 이용한 전력용 반도체 소자 |
| JP2014225692A (ja) * | 2008-12-25 | 2014-12-04 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5518326B2 (ja) | 2008-12-26 | 2014-06-11 | 昭和電工株式会社 | 炭化珪素半導体装置の製造方法 |
| WO2010110123A1 (ja) * | 2009-03-26 | 2010-09-30 | キヤノンアネルバ株式会社 | 基板処理方法および結晶性炭化ケイ素(SiC)基板の製造方法 |
| JP5525940B2 (ja) | 2009-07-21 | 2014-06-18 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| US8242030B2 (en) * | 2009-09-25 | 2012-08-14 | International Business Machines Corporation | Activation of graphene buffer layers on silicon carbide by ultra low temperature oxidation |
| US20120076927A1 (en) * | 2010-02-01 | 2012-03-29 | United States Government As Represented By The Secretary Of The Army | Method of improving the thermo-mechanical properties of fiber-reinforced silicon carbide matrix composites |
| JP5220049B2 (ja) * | 2010-03-09 | 2013-06-26 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
| JP5766495B2 (ja) * | 2010-05-18 | 2015-08-19 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
| JP2010239152A (ja) * | 2010-06-23 | 2010-10-21 | Mitsubishi Electric Corp | 炭化珪素半導体装置 |
| JP5954856B2 (ja) | 2011-02-01 | 2016-07-20 | ルネサスエレクトロニクス株式会社 | 縦チャネル型ノーマリオフ型パワーjfetの製造方法 |
| JP5799458B2 (ja) * | 2011-03-29 | 2015-10-28 | 学校法人関西学院 | 半導体素子の製造方法 |
| WO2012157679A1 (ja) * | 2011-05-18 | 2012-11-22 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP5759293B2 (ja) * | 2011-07-20 | 2015-08-05 | 住友電気工業株式会社 | 半導体装置の製造方法 |
| JP6011340B2 (ja) * | 2011-08-05 | 2016-10-19 | 住友電気工業株式会社 | 基板、半導体装置およびこれらの製造方法 |
| JP5802492B2 (ja) * | 2011-09-09 | 2015-10-28 | 株式会社東芝 | 半導体素子及びその製造方法 |
| JP5977986B2 (ja) | 2011-11-08 | 2016-08-24 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
| JP5539302B2 (ja) * | 2011-12-21 | 2014-07-02 | 三菱電機株式会社 | カーボン膜除去方法 |
| WO2013145022A1 (ja) * | 2012-03-30 | 2013-10-03 | 株式会社日立製作所 | 炭化珪素半導体装置の製造方法 |
| JP2015065316A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
| JP2015065318A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
| JP2015065289A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
| CN105723499B (zh) * | 2013-11-13 | 2018-11-06 | 三菱电机株式会社 | 半导体装置的制造方法以及半导体装置 |
| JP6588423B2 (ja) * | 2014-03-24 | 2019-10-09 | キヤノンアネルバ株式会社 | 半導体基板の熱処理方法、半導体基板の製造方法、熱処理装置、及び基板処理システム |
| US10403509B2 (en) * | 2014-04-04 | 2019-09-03 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Basal plane dislocation elimination in 4H—SiC by pulsed rapid thermal annealing |
| US20160045881A1 (en) * | 2014-08-15 | 2016-02-18 | Rec Silicon Inc | High-purity silicon to form silicon carbide for use in a fluidized bed reactor |
| JP6472016B2 (ja) * | 2014-09-25 | 2019-02-20 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置の製造方法 |
| CN104766798A (zh) * | 2015-03-27 | 2015-07-08 | 西安电子科技大学 | 改善SiC/SiO2界面粗糙度的方法 |
| JP2015159309A (ja) * | 2015-04-07 | 2015-09-03 | ルネサスエレクトロニクス株式会社 | パワーjfet |
| CN105470119B (zh) * | 2015-11-19 | 2018-09-11 | 泰科天润半导体科技(北京)有限公司 | 一种碳化硅器件的正面欧姆接触的加工方法 |
| CN105448673B (zh) * | 2016-01-04 | 2018-05-18 | 株洲南车时代电气股份有限公司 | 一种碳化硅器件背面欧姆接触的制作方法 |
| JP7687078B2 (ja) | 2021-06-21 | 2025-06-03 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
| CN113644119A (zh) * | 2021-07-14 | 2021-11-12 | 深圳市森国科科技股份有限公司 | 碳化硅肖特基二极管及其制造方法、装置及存储介质 |
| CN116092923B (zh) * | 2023-01-16 | 2025-11-04 | 湖北九峰山实验室 | 一种基于碳膜的碳化硅欧姆接触结构及其制备方法 |
| FR3153689A1 (fr) * | 2023-09-28 | 2025-04-04 | Soitec | Procédé de traitement d’un substrat de carbure de silicium |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0693441B2 (ja) * | 1989-09-22 | 1994-11-16 | 株式会社東芝 | 半導体集積回路装置の加熱処理方法 |
| KR0179677B1 (ko) * | 1993-12-28 | 1999-04-15 | 사토 후미오 | 반도체장치 및 그 제조방법 |
| JP3721588B2 (ja) * | 1994-10-04 | 2005-11-30 | 富士電機デバイステクノロジー株式会社 | 炭化けい素半導体素子の製造方法 |
| JP3647515B2 (ja) * | 1995-08-28 | 2005-05-11 | 株式会社デンソー | p型炭化珪素半導体の製造方法 |
| US6573534B1 (en) * | 1995-09-06 | 2003-06-03 | Denso Corporation | Silicon carbide semiconductor device |
| JP3206727B2 (ja) * | 1997-02-20 | 2001-09-10 | 富士電機株式会社 | 炭化けい素縦型mosfetおよびその製造方法 |
| JP3180895B2 (ja) * | 1997-08-18 | 2001-06-25 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
| WO1999017345A1 (de) * | 1997-09-30 | 1999-04-08 | Infineon Technologies Ag | Verfahren zum thermischen ausheilen von durch implantation dotierten siliziumcarbid-halbleitern |
| JP3216804B2 (ja) * | 1998-01-06 | 2001-10-09 | 富士電機株式会社 | 炭化けい素縦形fetの製造方法および炭化けい素縦形fet |
| JP3956487B2 (ja) | 1998-06-22 | 2007-08-08 | 富士電機デバイステクノロジー株式会社 | 炭化けい素半導体素子の製造方法 |
| JP3460585B2 (ja) * | 1998-07-07 | 2003-10-27 | 富士電機株式会社 | 炭化けい素mos半導体素子の製造方法 |
| JP3344562B2 (ja) * | 1998-07-21 | 2002-11-11 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
| JP3760688B2 (ja) | 1999-08-26 | 2006-03-29 | 富士電機ホールディングス株式会社 | 炭化けい素半導体素子の製造方法 |
| JP4560179B2 (ja) | 2000-06-22 | 2010-10-13 | クボタ松下電工外装株式会社 | 窯業系基材切削部の補強方法 |
| JP2002016013A (ja) | 2000-06-27 | 2002-01-18 | Nissan Motor Co Ltd | 炭化珪素半導体装置の製造方法 |
| JP2002089551A (ja) | 2000-09-18 | 2002-03-27 | Sumitomo Metal Mining Co Ltd | エンコーダ付き転がり軸受け |
| JP4581240B2 (ja) | 2000-12-12 | 2010-11-17 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| JP4595224B2 (ja) * | 2001-03-27 | 2010-12-08 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| JP4961633B2 (ja) | 2001-04-18 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| EP1306890A2 (de) * | 2001-10-25 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Halbleitersubstrat und -bauelement aus SiC und Verfahren zu deren Herstellung |
| WO2004049449A1 (ja) * | 2002-11-25 | 2004-06-10 | National Institute Of Advanced Industrial Science And Technology | 半導体装置、およびその半導体装置を用いた電力変換器、駆動用インバータ、汎用インバータ、大電力高周波通信機器 |
| JP4015068B2 (ja) * | 2003-06-17 | 2007-11-28 | 株式会社東芝 | 半導体装置の製造方法 |
| US7473929B2 (en) * | 2003-07-02 | 2009-01-06 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
| JP2005197464A (ja) * | 2004-01-07 | 2005-07-21 | Rohm Co Ltd | 半導体装置の製造方法 |
| WO2005076327A1 (ja) * | 2004-02-06 | 2005-08-18 | Matsushita Electric Industrial Co., Ltd. | 炭化珪素半導体素子及びその製造方法 |
| US7195996B2 (en) * | 2005-08-09 | 2007-03-27 | New Japan Radio Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
| JP4961805B2 (ja) * | 2006-04-03 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
-
2005
- 2005-01-28 WO PCT/JP2005/001240 patent/WO2005076327A1/ja not_active Ceased
- 2005-01-28 DE DE602005025976T patent/DE602005025976D1/de not_active Expired - Lifetime
- 2005-01-28 JP JP2005517659A patent/JP4418794B2/ja not_active Expired - Fee Related
- 2005-01-28 EP EP05709466A patent/EP1713117B1/de not_active Expired - Lifetime
- 2005-01-28 US US10/553,845 patent/US7462540B2/en not_active Expired - Fee Related
- 2005-01-28 CN CNB2005800003598A patent/CN100490077C/zh not_active Expired - Fee Related
- 2005-01-28 KR KR1020067004595A patent/KR20060125700A/ko not_active Ceased
- 2005-01-28 AT AT05709466T patent/ATE496392T1/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1713117A4 (de) | 2009-07-22 |
| JPWO2005076327A1 (ja) | 2007-08-02 |
| US20060220027A1 (en) | 2006-10-05 |
| KR20060125700A (ko) | 2006-12-06 |
| EP1713117B1 (de) | 2011-01-19 |
| EP1713117A1 (de) | 2006-10-18 |
| CN100490077C (zh) | 2009-05-20 |
| DE602005025976D1 (de) | 2011-03-03 |
| US7462540B2 (en) | 2008-12-09 |
| CN1788335A (zh) | 2006-06-14 |
| JP4418794B2 (ja) | 2010-02-24 |
| WO2005076327A1 (ja) | 2005-08-18 |
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