ATE499828T1 - System und verfahren für ein elektronisches chassis, in einem baugruppenträger montierte elektronik mit einem integrierten umgebungsunterdruck-kühlsystem - Google Patents

System und verfahren für ein elektronisches chassis, in einem baugruppenträger montierte elektronik mit einem integrierten umgebungsunterdruck-kühlsystem

Info

Publication number
ATE499828T1
ATE499828T1 AT06256089T AT06256089T ATE499828T1 AT E499828 T1 ATE499828 T1 AT E499828T1 AT 06256089 T AT06256089 T AT 06256089T AT 06256089 T AT06256089 T AT 06256089T AT E499828 T1 ATE499828 T1 AT E499828T1
Authority
AT
Austria
Prior art keywords
heat
fluid coolant
cooling system
generating structure
mount
Prior art date
Application number
AT06256089T
Other languages
English (en)
Inventor
Richard Martin Weber
Kerrin A Rummel
Albert P Payton
William G Wyatt
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE499828T1 publication Critical patent/ATE499828T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/207—Thermal management, e.g. cabinet temperature control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT06256089T 2005-11-30 2006-11-28 System und verfahren für ein elektronisches chassis, in einem baugruppenträger montierte elektronik mit einem integrierten umgebungsunterdruck-kühlsystem ATE499828T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/291,041 US20070119199A1 (en) 2005-11-30 2005-11-30 System and method for electronic chassis and rack mounted electronics with an integrated subambient cooling system

Publications (1)

Publication Number Publication Date
ATE499828T1 true ATE499828T1 (de) 2011-03-15

Family

ID=37950623

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06256089T ATE499828T1 (de) 2005-11-30 2006-11-28 System und verfahren für ein elektronisches chassis, in einem baugruppenträger montierte elektronik mit einem integrierten umgebungsunterdruck-kühlsystem

Country Status (4)

Country Link
US (1) US20070119199A1 (de)
EP (1) EP1796447B1 (de)
AT (1) ATE499828T1 (de)
DE (1) DE602006020232D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8651172B2 (en) * 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US20080264614A1 (en) * 2007-04-27 2008-10-30 Szolyga Thomas H Cooling components in electronic devices
US7921655B2 (en) * 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US9644869B2 (en) * 2007-10-25 2017-05-09 Raytheon Company System and method for cooling structures having both an active state and an inactive state
US7907409B2 (en) * 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
DE102010028950B4 (de) * 2010-05-12 2020-04-09 Efficient Energy Gmbh Vorrichtung zum Kühlen und Rechner-Racks
CN103460828B (zh) * 2011-04-04 2016-03-23 丹佛斯硅动力股份有限公司 用于功率模块的冷却系统
US20130081778A1 (en) * 2011-10-03 2013-04-04 Elliptical Mobile Solutions, Llc. Method and apparatus for a close-coupled cooling system
US11895805B2 (en) * 2022-02-14 2024-02-06 Eagle Technology, Llc Systems and methods for electronics cooling

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US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
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Also Published As

Publication number Publication date
EP1796447A3 (de) 2008-07-16
EP1796447A2 (de) 2007-06-13
US20070119199A1 (en) 2007-05-31
EP1796447B1 (de) 2011-02-23
DE602006020232D1 (de) 2011-04-07

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Legal Events

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