ATE548615T1 - Verfahren und vorrichtung zum kühlen von elektronik mit einem kühlmittel auf einem druck unter umgebungsdruck - Google Patents

Verfahren und vorrichtung zum kühlen von elektronik mit einem kühlmittel auf einem druck unter umgebungsdruck

Info

Publication number
ATE548615T1
ATE548615T1 AT07755199T AT07755199T ATE548615T1 AT E548615 T1 ATE548615 T1 AT E548615T1 AT 07755199 T AT07755199 T AT 07755199T AT 07755199 T AT07755199 T AT 07755199T AT E548615 T1 ATE548615 T1 AT E548615T1
Authority
AT
Austria
Prior art keywords
coolant
heat
pressure
generating structure
below ambient
Prior art date
Application number
AT07755199T
Other languages
English (en)
Inventor
Kerrin Rummel
William Wyatt
Richard Weber
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of ATE548615T1 publication Critical patent/ATE548615T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT07755199T 2006-05-02 2007-04-10 Verfahren und vorrichtung zum kühlen von elektronik mit einem kühlmittel auf einem druck unter umgebungsdruck ATE548615T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/381,297 US7908874B2 (en) 2006-05-02 2006-05-02 Method and apparatus for cooling electronics with a coolant at a subambient pressure
PCT/US2007/008842 WO2007133357A2 (en) 2006-05-02 2007-04-10 Method and apparatus for cooling electronics with a coolant at a subambient pressure

Publications (1)

Publication Number Publication Date
ATE548615T1 true ATE548615T1 (de) 2012-03-15

Family

ID=38477143

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07755199T ATE548615T1 (de) 2006-05-02 2007-04-10 Verfahren und vorrichtung zum kühlen von elektronik mit einem kühlmittel auf einem druck unter umgebungsdruck

Country Status (6)

Country Link
US (2) US7908874B2 (de)
EP (1) EP2024692B1 (de)
JP (1) JP5422379B2 (de)
AT (1) ATE548615T1 (de)
ES (1) ES2383615T3 (de)
WO (1) WO2007133357A2 (de)

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JP5422379B2 (ja) 2014-02-19
JP2009535847A (ja) 2009-10-01
EP2024692B1 (de) 2012-03-07
US8490418B2 (en) 2013-07-23
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US20070263356A1 (en) 2007-11-15

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