ATE509145T1 - Kupferlaminat, lamellares verbundmaterial dieses kupferlaminat enthaltend und ein verfahren für dessen produktion - Google Patents

Kupferlaminat, lamellares verbundmaterial dieses kupferlaminat enthaltend und ein verfahren für dessen produktion

Info

Publication number
ATE509145T1
ATE509145T1 AT03725503T AT03725503T ATE509145T1 AT E509145 T1 ATE509145 T1 AT E509145T1 AT 03725503 T AT03725503 T AT 03725503T AT 03725503 T AT03725503 T AT 03725503T AT E509145 T1 ATE509145 T1 AT E509145T1
Authority
AT
Austria
Prior art keywords
copper
copper laminate
laminate
rolled
production
Prior art date
Application number
AT03725503T
Other languages
English (en)
Inventor
Siurana Antonio Rodriguez
Coca Felip Balsells
Original Assignee
Siurana Antonio Rodriguez
Coca Felip Balsells
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siurana Antonio Rodriguez, Coca Felip Balsells filed Critical Siurana Antonio Rodriguez
Application granted granted Critical
Publication of ATE509145T1 publication Critical patent/ATE509145T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
AT03725503T 2002-05-23 2003-05-21 Kupferlaminat, lamellares verbundmaterial dieses kupferlaminat enthaltend und ein verfahren für dessen produktion ATE509145T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ES200201271A ES2203324B1 (es) 2002-05-23 2002-05-23 Lamina de cobre, material laminar compuesto que comprende dicha lamina de cobre y procedimiento para su obtencion.
PCT/IB2003/002122 WO2003100138A1 (en) 2002-05-23 2003-05-21 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it

Publications (1)

Publication Number Publication Date
ATE509145T1 true ATE509145T1 (de) 2011-05-15

Family

ID=29558516

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03725503T ATE509145T1 (de) 2002-05-23 2003-05-21 Kupferlaminat, lamellares verbundmaterial dieses kupferlaminat enthaltend und ein verfahren für dessen produktion

Country Status (5)

Country Link
EP (1) EP1507900B1 (de)
AT (1) ATE509145T1 (de)
AU (1) AU2003228035A1 (de)
ES (2) ES2203324B1 (de)
WO (1) WO2003100138A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014211298A1 (de) * 2014-06-13 2015-12-17 Robert Bosch Gmbh Substrat mit einer Oberflächenbeschichtung und Verfahren zum Beschichten einer Oberfläche eines Substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1137960A (en) * 1966-06-06 1968-12-27 Clevite Corp Metal composite and electrolytic method of making same
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
EP0181430A1 (de) 1984-11-13 1986-05-21 Olin Corporation Systeme zur Herstellung einer elektroplattierten und/oder bearbeiteten Metallfolie
AU579517B2 (en) 1986-06-20 1988-11-24 Gould Inc. Double matte finish copper foil
US4961828A (en) 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
JP3347457B2 (ja) * 1994-02-24 2002-11-20 日本電解株式会社 非シアン系銅−亜鉛電気めっき浴、これを用いたプリント配線板用銅箔の表面処理方法及びプリント配線板用銅箔
US6322585B1 (en) 1998-11-16 2001-11-27 Endotex Interventional Systems, Inc. Coiled-sheet stent-graft with slidable exo-skeleton
GB2361713B (en) * 2000-04-14 2003-09-24 Fukuda Metal Foil Powder Method for surface treatment of copper foil

Also Published As

Publication number Publication date
EP1507900A1 (de) 2005-02-23
ES2203324B1 (es) 2005-02-16
ES2370997T3 (es) 2011-12-26
ES2203324A1 (es) 2004-04-01
EP1507900B1 (de) 2011-05-11
AU2003228035A1 (en) 2003-12-12
WO2003100138A1 (en) 2003-12-04

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