ATE402594T1 - Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus - Google Patents

Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus

Info

Publication number
ATE402594T1
ATE402594T1 AT01947018T AT01947018T ATE402594T1 AT E402594 T1 ATE402594 T1 AT E402594T1 AT 01947018 T AT01947018 T AT 01947018T AT 01947018 T AT01947018 T AT 01947018T AT E402594 T1 ATE402594 T1 AT E402594T1
Authority
AT
Austria
Prior art keywords
copper foil
copper
production
layer
surface treated
Prior art date
Application number
AT01947018T
Other languages
English (en)
Inventor
M Mitsuhashi
T Kataoka
N Takahashi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE402594T1 publication Critical patent/ATE402594T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
AT01947018T 2000-01-28 2001-01-24 Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus ATE402594T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000020884A JP3670185B2 (ja) 2000-01-28 2000-01-28 プリント配線板用表面処理銅箔の製造方法

Publications (1)

Publication Number Publication Date
ATE402594T1 true ATE402594T1 (de) 2008-08-15

Family

ID=18547373

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01947018T ATE402594T1 (de) 2000-01-28 2001-01-24 Oberflächenbehandelte kupferfolie und ihre herstellung und kupferkaschiertes laminat daraus

Country Status (10)

Country Link
US (1) US6531045B2 (de)
EP (1) EP1185152B1 (de)
JP (1) JP3670185B2 (de)
KR (1) KR100743512B1 (de)
CN (1) CN1213645C (de)
AT (1) ATE402594T1 (de)
DE (1) DE60134926D1 (de)
MY (1) MY128582A (de)
TW (1) TW511407B (de)
WO (1) WO2001056343A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI267569B (en) * 2002-06-04 2006-12-01 Mitsui Mining & Smelting Co Surface-treated copper foil for low dielectric substrate, and copper clad laminate and printed wiring board both using the same
US7476449B2 (en) * 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
TWI282259B (en) * 2004-01-30 2007-06-01 Hitachi Chemical Co Ltd Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
JP4913328B2 (ja) * 2004-01-30 2012-04-11 日立化成工業株式会社 接着補助剤付金属箔及びそれを用いたプリント配線板
JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP5512273B2 (ja) * 2007-09-28 2014-06-04 Ｊｘ日鉱日石金属株式会社 印刷回路用銅箔及び銅張積層板
CN101556846B (zh) * 2009-05-19 2010-11-03 丹凤县永鑫电子材料有限责任公司 镀镍铈合金软铜线生产工艺
KR101344176B1 (ko) * 2010-02-24 2013-12-20 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 인쇄 회로 기판용 동박 및 인쇄 회로 기판용 동장 적층판
CN103924268B (zh) * 2013-12-26 2016-04-13 苏州昕皓新材料科技有限公司 一种酸铜整平剂的应用
CN103924269B (zh) * 2013-12-26 2016-04-13 苏州昕皓新材料科技有限公司 一种非染料系整平剂的应用
JP6570430B2 (ja) * 2015-11-12 2019-09-04 Ｊｘ金属株式会社 キャリア付銅箔の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP7033905B2 (ja) * 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7366436B2 (ja) 2021-05-31 2023-10-23 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
CN117181676B (zh) * 2023-09-11 2025-12-16 昆山先捷精密电子有限公司 一种提高电解铜性能的表面处理装置和方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
KR930006103B1 (ko) * 1991-03-11 1993-07-07 덕산금속 주식회사 인쇄회로용 전해동박 및 그 제조방법
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US5482784A (en) * 1993-12-24 1996-01-09 Mitsui Mining And Smelting Co., Ltd. Printed circuit inner-layer copper foil and process for producing the same
JP3292774B2 (ja) * 1994-02-15 2002-06-17 三井金属鉱業株式会社 プリント配線板用銅箔およびその製造方法
JP3199208B2 (ja) * 1994-03-24 2001-08-13 三井金属鉱業株式会社 有機防錆処理銅箔およびその製造方法
JP2684164B2 (ja) * 1995-03-17 1997-12-03 福田金属箔粉工業株式会社 印刷回路用銅箔の表面処理方法
JPH0974273A (ja) * 1995-06-27 1997-03-18 Nippon Denkai Kk プリント回路用銅張積層板とその接着剤
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JPH10341066A (ja) * 1997-06-10 1998-12-22 Furukawa Electric Co Ltd:The 印刷回路用銅箔、前記銅箔を用いた印刷回路用樹脂接着剤付銅箔、および前記銅箔を用いた印刷回路用銅張り積層板

Also Published As

Publication number Publication date
KR100743512B1 (ko) 2007-07-27
JP3670185B2 (ja) 2005-07-13
EP1185152A4 (de) 2006-11-22
CN1358407A (zh) 2002-07-10
TW511407B (en) 2002-11-21
EP1185152B1 (de) 2008-07-23
KR20010102562A (ko) 2001-11-15
US20010014406A1 (en) 2001-08-16
DE60134926D1 (de) 2008-09-04
WO2001056343A1 (en) 2001-08-02
US6531045B2 (en) 2003-03-11
JP2001214298A (ja) 2001-08-07
CN1213645C (zh) 2005-08-03
EP1185152A1 (de) 2002-03-06
MY128582A (en) 2007-02-28

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties